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SEMI E56-1104 © SEMI 1996, 2004 13 15.3 Repeatability — Report a single num ber, as calculated above, as a percen tage of the reading. 15.4 Hysteresis — Report a single num ber, as calculated above. 15.5 Deadband — Repor…

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SEMI E56-1104 © SEMI 1996, 2004 12
percentage of reading. Perform this calculation at each
setpoint.

RPS

I
max
R
PS

Repeatability at a setpoint
14.1.3.3 The overall repeatability of the DUT is the
maximum value calculated in Section 14.1.3.2.
R
PD
R
P
S
max
R
PD
Repeatability of the DUT
14.1.4 Short-Term Reproducibility
14.1.4.1 Determine the short-term reproducibility at a
setpoint by dividing the precision of the setpoint by the
average setpoint. This is expressed as a percentage of
reading. Perform this calculation a each setpoint.
SRS
P
S
a
100
SRS
Short - term reproducibility at a setpoint
14.1.4.2 The overall short-term reproducibility of the
DUT is the maximum value calculated in Section
14.1.4.1.

SRD

SR
S
max
SRD

Short - term reproducibility of the device
14.1.5 Deadband
14.1.5.1 Determine the absolute deadband value by
subtracting the lower deadband value from the upper
value at each setpoint. Perform this calculation at each
setpoint.
D
D
u

D
l
D
Deadband value
D
u
Upper deadband value
D
l
Lower deadband value
14.1.5.2 Determine the deadband at setpoint by
dividing the absolute deadband value by the initial
setpoint and multiplying by 100. This is expressed as a
percentage of reading. Perform this calculation at each
setpoint.
D
B
S
D
S
100
D
B
S
Deadband of setpoint
14.1.5.3 The overall deadband of the DUT is the
maximum value calculated in Section 14.1.5.2.
D
BD
D
BS
max
D
BD
Deadband of device
14.1.6 Hysteresis
14.1.6.1 Determine the hysteresis plus deadband by
subtracting the average of the difference between the
downscale measured value and the downscale setpoint
from the average of the difference between the upscale
measured value and the upscale setpoint. Perform this
calculation at each setpoint.
H
DB
S
[
(
A
u
S
u
)
i
]
k
n
k
[
(
A
l
S
l
)
i
]
n
n
m
H
DB
S
Hysteresis plus deadband at a setpoint
A
u
Measured value, up cycle
A
l
Measured value, down cycle
S
u
Setpoint, up cycle
S
l
Setpoint, down cycle
n
N
umber of up scale readings
k
Up cycle number for a given setpoint
m
Down cycle number for a setpoint
14.1.6.2 Determine the hysteresis by subtracting the
deadband from hysteresis plus deadband and divide the
result by the initial setpoint and multiply by 100. This
is expressed as a percentage of reading. Perform this
calculation at each setpoint.
H
S
H
DBS
D
S
100
H
S
Hysteresis at a setpoint
14.1.6.3 The overall hysteresis of the DUT is the
maximum value calculated in Section 14.1.6.2.
H
D%
H
S
max
H
D
Hysteresis of dev
i
15 Data Presentation
15.1 Accuracy — Plot the accuracy data at each
setpoint on a graph. The x-axis is the setpoint, and the
y-axis is accuracy as a percentage of the reading.
15.2 Linearity — Plot the linearity at each setpoint on a
graph. The x-axis is the setpoint, and the y-axis is
linearity as a percentage of full scale.
SEMI E56-1104 © SEMI 1996, 2004 13
15.3 Repeatability — Report a single number, as
calculated above, as a percentage of the reading.
15.4 Hysteresis — Report a single number, as
calculated above.
15.5 Deadband — Report a single number, as
calculated above.
16 Related Documents
16.1 SEMI Standard
SEMI E28 — Guideline for Pressure Specifications of
the Mass Flow Controller
SEMI E67 — Test Method for Determining Reliability
of Mass Flow Controller (refer to this standard if
reliability data is needed for some of the parameters
tested in this method)
16.2 ANSI Standards
3
ANSI C39.5 — Safety Requirements for Electrical and
Electronic Measuring and Controlling Instrumentation
ANSI C42.100 — Dictionary of Electrical and
Electronics Terms
ANSI MC4.1 — Dynamic Response Testing of Process
Control Instrumentation
16.3 ASME Standard
4
ASME MFC-1M — Glossary of Terms Used in the
Measurement of Fluid Flow in Pipes
16.4 IEC Standards
5
IEC 160 — Standard Atmospheric Conditions for Test
Purposes
IEC 546 — Methods of Evaluating the Performance of
Controllers with Analogue [sic] Signals for Use in
Industrial Process Control
16.5 ISA Standard
6
ISA S7.3 — Quality Standards for Instrument Air
3 American National Standards Institute, Headquarters: 1819 L
Street, NW, Washington, DC 20036, USA. Telephone: 202.293.8020;
Fax: 202.293.9287, New York Office: 11 West 42nd Street, New
York, NY 10036, USA. Telephone: 212.642.4900; Fax:
212.398.0023, Website: www.ansi.org
4 American Society of Mechanical Engineers, Three Park Avenue,
New York, NY 10016-5990, USA. Telephone: 800.843.2763
(U.S./Canada), 95.800.843.2763 (Mexico), 973.882.1167 (outside
North America), Website: www.asme.org
5 International Electrotechnical Commission, 3, rue de Varembé,
Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00, Website: www.iec.ch
6
Instrument Society of America, 67 Alexander Drive, Research
Triangle Park, NC 27709 USA Telephone: 919.549.8411 Website:
www.isa.org
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E57-0305 © SEMI 1996, 2005 1
SEMI E57-0600 (Reapproved 0305)
MECHANICAL SPECIFICATION FOR KINEMATIC COUPLINGS USED
TO ALIGN AND SUPPORT 300 mm WAFER CARRIERS
This specification was technically reapproved by the Global Physical Interfaces and Carriers Committee and
is the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current
edition approved by the North American Regional Standards Committee on November 4, 2004. Initially
available at www.semi.org January 2005; to be published March 2005. Originally published in 1996;
previously published June 2000.
1 Purpose
1.1 This standard specifies the mechanical couplings used to ergonomically align and precisely support 300 mm
wafer carriers (including transport cassettes, process cassettes, quartz boats, pods, lot boxes, and shipping boxes).
Such a kinematic coupling can be used at several interfaces, including:
between a box or cassette and a tool load-port or vehicle nest,
between a transport cassette and a box, and
between a process cassette or quartz boat and the floor of a process chamber.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and inter-changeability at all mechanical interfaces. Only the bottom half of the
kinematic coupling is specified so that suppliers can be flexible in designing wafer carriers that can mate with it.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E15 — Specification for Tool Load Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E19.4 — 200 mm Standard Mechanical Interface (SMIF)
3.2 ISO Document
1
ISO 4287 — Geometrical Product Specifications (GPS) — Surface texture: Profile method — Terms, definitions
and surface texture parameters
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes.
4.1.2 box — a protective portable container for a cassette and/or substrate(s).
4.1.3 cassette — a open structure that holds one or more substrates.
1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.
Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30, Website: /www.iso.ch