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SEMI M31-0705 © SEMI 1998, 2005 2 NOTICE: As listed or revised, all documents cited shall be the latest publications of adopted standards. 4 Terminology 4.1 Definitions 4.1.1 bilateral datum plan e — a vertical plane tha…

SEMI M31-0705 © SEMI 1998, 2005 1

SEMI M31-0705

PROVISIONAL MECHANICAL SPECIFICATION FOR FRONT-OPENING

SHIPPING BOX USED TO TRANSPORT AND SHIP 300 mm WAFERS

This provisional specification was technically approved by the global Silicon Wafer Committee. This edition

was approved for publication by the global Audits and Reviews Subcommittee on May 20, 2005. It was

available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published in 1998;

previously published March 2005.

1 Purpose

1.1 This standard specifies the front-opening shipping box (FOSB) used to ship 300 mm wafers from wafer

suppliers to their customers (typically IC manufacturers), while maintaining wafer quality.

NOTE 1: Refer to SEMI silicon wafer related specifications M-series such as SEMI M1 as for a wafer quality.

2 Scope

2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation

while ensuring modularity and interchangeability at all mechanical interfaces. However, this standard has been

written so that injection-molded plastic FOSBs can be manufactured in conformance with it, and those can be

utilized for maintaining wafers quality during transportation, opening and closing the door.

2.2 This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and

inspection, and in transferring the wafers from the FOSB to a FOUP, FOBIT or open cassette inside an IC

manufacturing facility. The FOSB is not intended to be used in IC manufacturing processes. It is recommended that

wafers be transferred from the FOSB to a FOUP, FOBIT or open cassette using automated methods. As described in

¶5.4, the purchaser needs to specify which type of FOSB door is required:

1) Manual door as described in ¶5.4.1; or

2) Automated–shippable door as described in ¶5.4.2.

2.3 This standard is provisional. This standard will be modified and upgraded from provisional status. Where

possible, the specified design features are in accord with like features in SEMI E1.9 and SEMI E47.1.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Referenced Standards and Documents

3.1 SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load Port

SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm

Wafers

SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E62 — Provisional Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)

SEMI E119 — Provisional Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory

Transport of 300mm Wafers

SEMI M45 — Provisional Standard for 300mm Wafer Shipping System

SEMI S8 — Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment

SEMI M31-0705 © SEMI 1998, 2005 2

NOTICE: As listed or revised, all documents cited shall be the latest publications of adopted standards.

4 Terminology

4.1 Definitions

4.1.1 bilateral datum plane — a vertical plane that bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI E57).

4.1.2 box — a protective portable container for a carrier and/or substrate(s).

4.1.3 carrier — an open structure that holds one or more substrates.

4.1.4 carrier bottom domain — volume (below z6 above the horizontal datum plane) that contains the bottom of the

carrier (as defined in SEMI E1.9).

4.1.5 carrier capacity — the number of substrates that a carrier holds (as defined in SEMI E1.9).

4.1.6 carrier sensing pads — surfaces on the bottom of the carrier for triggering optical or mechanical sensors (as

defined in SEMI E1.9).

4.1.7 carrier side domains — volumes (from z6 above the horizontal datum plane to z15 above the top nominal

wafer seating plane) that contain the mizo teeth or slots that support the wafer and the supporting columns on the

sides and rear of the carrier (as defined in SEMI E1.9).

4.1.8 carrier top domain — volume (higher than z15 above the top wafer) that contains the top of the carrier (as

defined in SEMI E1.9).

4.1.9 facial datum plane — a vertical plane that bisects the wafers and that is parallel to the front side of the carrier

(where wafers are removed or inserted). On tool load ports, it is also parallel to the load face plane specified in

SEMI E15 on the side of the tool where the carrier is loaded and unloaded (as defined in SEMI E57).

4.1.10 front-opening shipping box (FOSB) — a shipping box with a front-opening interface.

4.1.11 front-opening unified pod (FOUP) — a box (that complies with SEMI E47.1) with a non-removable cassette

(so that its interior complies with SEMI E1.9) and with a front-opening interface (that mates with a FIMS port that

complies with SEMI E62) (as defined in SEMI E47.1).

4.1.12 front-opening box for interfactory transport (FOBIT) — box for interfactory transport between IC

manufacturing sites.

4.1.13 horizontal datum plane — a horizontal plane from which projects the kinematic-coupling pins on which the

carrier sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically realized as

a surface (as defined in SEMI E57).

4.1.14 minienvironment — a localized environment created by an enclosure to isolate the product from

contamination and people.

4.1.15 nominal wafer centerline — the line that is defined by the intersection of the two vertical datum planes

(facial and bilateral) and that passes through the nominal centers of the seated wafers (which must be horizontal

when the carrier is placed on the coupling) (as defined in SEMI E57).

4.1.16 optical wafer sensing paths — lines of sight for optically sensing the positions of the wafers. Several

horizontal optical wafer sensing paths are present in between the carrier side domains. In addition, two vertical

optical wafer sensing paths are created by rectangular exclusion zones in the front of the carrier top and bottom (as

defined in SEMI E1.9).

4.1.17 shipping box — a protective portable container for a carrier and/or wafer(s) that is used to ship wafers from

the wafer suppliers to their customers.

4.1.18 shipping-box front-opening mechanical interface (SFMI) — optional automated-shippable door style for a

FOSB that is compatible with SEMI E62, and must be considered characteristics with exceptions as noted in ¶5.4.2.

4.1.19 virtual tracking unit — an entity (which could be a number of substrates or an individual die or mask group)

that the factory floor control system treats as a single unit for tracking purposes (as defined in SEMI E1.9).

4.1.20 wafer carrier — any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15).

4.1.21 wafer extraction volume — the open space for extracting a wafer from the carrier (as defined in SEMI E1.9).

4.1.22 wafer pick-up volume — the space that contains entire bottom of a wafer if the wafer has been pushed to the

rear of the carrier (as defined in SEMI E1.9).

4.1.23 wafer set-down volume — the open space for inserting and setting down a wafer in the carrier (as defined in

SEMI E1.9).

5 Requirements

5.1 The FOSB has the following components and sub-components:

Key:

 Required feature

 Optional feature

 Door on front

 Manual door (optional)

 Automated door (optional)

 Holes for latch keys that lock the door to the SFMI interface when the door is unlatched from the box

 Holes for registration pins

 Door presence sensing areas

 Top

 Top robotic handling flange (optional)

 Interior

 Cassette with supports for 13 or 25 wafers

 Wafer retainer

 2 end effector exclusion zones

 Sides

 Ergonomic manual handles (optional)

 Bottom

 5 carrier sensing pads

 4 Info pads

 3 features that mate with kinematic coupling pins and provide a 10 mm lead-in

 3 features that mate with kinematic coupling pins and provide a 15 mm lead-in (optional)

 Retaining features for manual door (optional)

 Retaining features for automated-shippable door

5.2 Kinematic Couplings — The physical alignment mechanism from the FOSB to the tool load-port (or a nest on a

vehicle or in a stocker) consists of features (not specified in this standard) on the top entity that mate with three or

six pins underneath as defined in SEMI E57. The three features that mate with the kinematic coupling pins must

provide a lead-in capability that corrects a FOSB misalignment of up to r69 in any horizontal direction.