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APPENDIX 1 SIMULTANEOUS MARKING WITH SQUARE DATA MATRIX AND ALPHANUMERIC CODES NOTICE : The material in this appendix is an official part of SEMI T2 and was approved by full letter ballot procedures. A1-1 The relative po…

6.4.5 The distance from the edge of the data matrix code symbol to the diameter perpendicular to the primary

fiducial bisector varies according to the actual size of the wafer and the placement of the symbol within its tolerance

range. Minimum distances from the edge of the code symbol to the wafer center-line are given in Table 4 for both

16 × 16, 125 µm and 20 × 20, 150 µm matrix code symbols.

Table 3 Location of Matrix Code Symbol — Wafer Polished Side Up, Primary Fiducial toward the Operator

Type of Array Wafer Fiducial Reference Point Cell Location of Symbol Reference Point

Square (used on 125, 150,

and 200 mm wafers)

Flat Common cell of primary

border row and secondary

border column

16.0 ± 0.5 mm to the right of the fiducial bisection,

and 2.5 ± 0.5 mm above the edge of the flat

Notch 160 ± 0.5 mm to the right of the fiducial bisector, and

5.3 ± 0.5 mm above the notch pin center

Table 4 Minimum Distances from Edge of Matrix Code Symbol to the Wafer Centerline

SEMI Standard M1.7 M1.8 M1.12 M1.13 M1.10 M1.9

Nominal Wafer Diameter, mm 125 150 125 150 200 125 150 200

Flat or Notch Flat Flat Flat Flat Flat Notch Notch Notch

Distance from 20 × 20 Matrix with 150

µm Cell Spacing, mm

52.17 62.76 52.33 64.73 89.28 53.98 66.48 91.48

Distance from 16 × 16 Matrix with 125

µm Cell Spacing, mm

53.14 63.73 53.30 65.74 90.25 54.95 67.45 92.45

SEMI T2-0298 © SEMI 1993, 2004 6

APPENDIX 1

SIMULTANEOUS MARKING WITH SQUARE DATA MATRIX AND

ALPHANUMERIC CODES

NOTICE: The material in this appendix is an official part of SEMI T2 and was approved by full letter ballot

procedures.

A1-1 The relative positions of alphanumeric and data matrix markings are shown in Figure A1-1. This figure also

shows the relationship between the data matrix code symbol and the edge of the polished area of the front surface of

the wafer. Wafer peripheries in the figure are the edges of the polished area of wafers with maximum intrusion of

the edge contour, minimum diameter, and maximum flat diameter (minimum flat length), or distance between the

notch pin centerline and the wafer edge, as specified in SEMI M1. For all wafer diameters, SEMI M1 allows the

edge contour to extend inward from the edge up to 508 µm (Dimension B in Figure 4 of SEMI M1). The distance

between the notch pin centerline and the wafer periphery may vary from 0.30 to 0.80 mm as indicated in Figure 6 of

SEMI M1. Other dimensions and tolerances are specified in the appropriate polished wafer specification in SEMI

M1.

A1-2 Alphanumeric code field locations are shown for all cases except the SEMI M13 code field for flatted wafers,

which lies entirely to the left of the primary fiducial bisector. Note that alphanumeric code field locations are not

specified for 125 mm diameter notched wafers in either SEMI M12 or SEMI M13.

A1-3 The nominal position of the reference point of the data matrix code symbol is marked by a +; this position is 1

mm to the right of the closest alphanumeric code field. Because of the tolerances on the position of the reference

point, the largest data matrix code symbol (20 × 20, 150 µm cell spacing) may lie anywhere within the dotted

square. The effect of a 3º skew toward the alphanumeric field is also shown. Although the skew does not affect

readability of the data matrix code symbol, too great a skew may cause the data matrix symbol code to impinge on

occupied areas of the wafer surface. The 3º skew, which is the maximum allowed by SEMI M12 and SEMI M13,

does not cause the data matrix code symbol to impinge on the alphanumeric code fields.

Figure A1-1

Relationship Between the Maximum Size Matrix Code Symbol, Alphanumeric Fields, and the Edges of the

Polished Front Surface of Minimum Size Wafers