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SEMI T1-95 © SEMI 1993, 2003 9 RELATED INFORMATION 1 APPLICATION NOTES NOTICE: This related information sec tion is not an official part of SEMI T1 a nd is not intended to modify or supercede the official standard. Rathe…
SEMI T1-95 © SEMI 1993, 2003 8
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
SEMI T1-95 © SEMI 1993, 2003 9
RELATED INFORMATION 1
APPLICATION NOTES
NOTICE: This related information section is not an official part of SEMI T1 and is not intended to modify or supercede the
official standard. Rather, this note is provided primarily as a source of information to aid in the application of the standard. As
such, it is considered reference material only. The standard should be referred to in all cases.
R1-1 Center Reference Dimensions for Bar
Code and Optional Alphanumeric Marks
R1-1.1 The following information is provided as a
reference for equipment which employs center
referencing to locate the bar code or optional
alphanumeric marks. Dimensions for flatted wafers are
given in Table R1-1 and dimensions for notched wafers
are given in Table R1-2.
R1-2 Referenced Documents
R1-2.1 SEMI Standards
SEMI M1.7 — Standard for 125 mm Polished Mono-
crystalline Silicon Wafers
SEMI M1.8 — Standard for 150 mm Polished Mono-
crystalline Silicon Wafers
SEMI M1.9 — Standard for 200 mm Polished Mono-
crystalline Silicon Wafers (Notched)
SEMI M1.10 — Standard for 200 mm Polished Mono-
crystalline Silicon Wafers (Flatted)
SEMI M1.12 — Standard for 125 mm Polished Mono-
crystalline Silicon Wafers Without Secondary Flat
SEMI M1.13 — Standard for 150 mm Polished Mono-
crystalline Silicon Wafers Without Secondary Flat (625
µm Thickness)
Table R1-1 Mark Distances on Flatted Wafers
(see Figure R1-1)
Wafer Size and SEMI Standards
125 mm 150 mm 200 mm
Dim. in
mm
SEMI
M1.7
SEMI
M1.12
SEMI
M1.13
SEMI
M1.8
SEMI
M1.10
D 125 ±
0.5
125 ±
0.2
150 ± 0.2 150 ± 0.2 200 ± 0.2
FL 42.5 ±
2.5
475. ±
2.5
47.50 ±
2.5
57.50 ±
2.5
57.50 ±
2.5
Znom 58.83 58.83 71.19 69.32 95.83
Zmax 59.53 59.37 71.70 69.93 96.30
Zmin 58.09 58.25 70.66 68.68 95.34
R1nom 54.48 54.48 66.84 64.97 91.48
R1max 55.59 55.53 67.86 66.10 92.46
R1min 53.23 53.39 65.79 63.82 90.08
K1nom 1.03 1.03 1.03 1.03 1.03
K1max 1.55 1.55 1.55 1.55 1.55
K1min 0.05 0.50 0.50 0.50 0.50
D = Wafer Diameter
FL = Primary Flat Length
Table R1-2 Mark Distances on Notched Wafers
(see Figure R1-2)
Wafer Size and SEMI Standards
Dim. in mm 125 mm 150 mm 200 mm
SEMI M1.9
D 125 ± 0.5 150 ± 0.2 200 ± 0.2
Z1nom 0.80 0.80 0.80
Z1max 1.05 1.05 1.05
Z1min 0.30 0.30 0.30
R1nom 54.90 67.40 92.40
R1max 55.91 68.26 93.26
R1min 53.64 66.29 91.29
K1mon 3.28 3.28 3.28
K1max 4.05 4.05 4.05
K1min 2.50 2.50 2.50
Ynom 1.80 1.80 1.80
Y1max 2.05 2.05 2.05
Y1min 1.55 1.55 1.55
D = Wafer Diameter
SEMI T1-95 © SEMI 1993, 2003 10
Figure R1-1
Code Field Locations for Flatted Wafers (See Tables R1-1 and 5.)
Figure R1-2
Code Field Locations for Notched Wafers (See Tables R1-2 and 5.)
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.