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SEMI E76-0299 SEMI 1998, 1999 1 SEMI E76-0299 GUIDE FOR 300 mm PROCESS EQUIPMENT POINTS OF CONNECTION TO FACILITY SERVICES This G uide was tec hnically approv ed by the G lobal Facilities Com mittee and is the di…
SEMI E74-0301 © SEMI 1998, 20019
RELATED INFORMATION 1
APPLICATION NOTES
NOTE: This related information is not an official part of SEMI E74 and is not intended to modify or supercede the official
standard. This related information is optional and contains information that is not required to conform to this standard.
NOTE 1: While this standard was developed to specify
vacuum pumps installed with 300 mm equipment, the
standard should also be applied to vacuum pumps
installed with 200 mm equipment.
NOTE 2: ICF flange is available on request for inlet
flange.
NOTE 3: In order to save space and reduce cost, the
connector for the control and running status signals
should be a minimum size required for the number of
pins specified in the standard. If the additional signal
connections are required another connector should be
added to the pump.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E76-0299
SEMI 1998, 1999
1
SEMI E76-0299
GUIDE FOR 300 mm PROCESS EQUIPMENT POINTS OF
CONNECTION TO FACILITY SERVICES
This Guide was technically approved by the Global Facilities Committee and is the direct responsibility of
the North American Facilities Committee. Current edition approved by the North American Regional
Standards Committee on August 15, 1998. Initially available at www.semi.org January 1999; to be published
February 1999. Originally published September 1998.
This document replaces E76-0998 in its entirety.
1 Purpose
1.1 Factory design variations make it difficult for
equipment manufacturers to predict or agree on
consistent points of connection for hookup of equipment
to facility services. Similarly, device manufacturers
cannot easily pre-facilitate their factories for equipment
because the connections on the equipment are not
consistently located. Standardization of connection
locations and utilizing pre-facilitation strategies
decreases the cost of and time required for equipment
installation.
1.2 This document is a guide for 300 mm equipment
manufacturers to define the positioning of the
equipment points of connection (EPOC), required on
semiconductor processing equipment for hookup to
facility utility services. The document identifies
locations for the EPOC’s and provides EPOC
consistency recommendations that should allow for
efficient equipment installation. In addition, this
document defines strategies to support the device
manufacturer’s ability to pre-facilitate the utility point
of connection (UPOC). Recommendations for supplier-
provided EPOC documentation are also included.
2 Scope
2.1 This guide addresses three areas that are necessary
to improve the efficiency of and reduce the duration of
equipment installations.
a) Recommendations for EPOC location, grouping,
consistency and reduction to increase confidence in
the accuracy and repeatability of EPOC’s, and
reduce the amount of work required to hookup
equipment. As a result, device manufacturers can
employ standard pre-facilitation strategies and
increase the efficiency of equipment installation.
b) Pre-facilitation recommendations that provide the
ability for UPOC’s to be efficiently and accurately
installed prior to equipment delivery, thus allowing
immediate hook-up of the equipment upon arrival
in the wafer fab. This includes recommendations
for jigs, templates, mating pedestal bases, and
associated interface panels.
c) Documentation recommendations to be required by
the device manufacturer and provided by the
equipment supplier relative to EPOC location,
group, consistency, pre-facilitation strategies and
hardware. This includes additional documentation
recommended to support equipment installations
but not directly related to EPOC’s.
2.2 This guide applies to 300 mm semiconductor
processing equipment and any supplier-provided
support equipment for installation into new factories.
2.3 The following groups of utilities are covered in this
guide.
• Electrical Power
• Data communications
• Exhaust and other process effluents
• Process fluids (liquids and gases)
• Support equipment interconnects
2.4 The primary focus for this guide is hookup of
semiconductor processing equipment including but not
limited to the following equipment types.
• Etch equipment (Dry and Wet)
• Film deposition equipment (CVD, PVD and
Plating)
• Thermal equipment
• Surface prep and clean
• Photolithography equipment (Stepper and
Tracks)
• Chemical Mechanical Polishing equipment
• Ion Implant equipment
• Metrology equipment
3 Limitations
3.1 This standard does not apply to assembly and test
equipment.
3.2 International, national, and local codes, regulations
SEMI E76-0299
SEMI 1998, 1999
2
and laws should be consulted to ensure that the
equipment meets regulatory requirements in each
location.
3.3 This guide is not intended to address design issues
related to safety. Safety issues are addressed in other
SEMI standards (See SEMI S2).
4 Referenced Documents
4.1 SEMI documents
SEMI E6 — Facilities Interface Specifications
Guideline and Format
SEMI S2 — Safety Guideline for Semiconductor
Manufacturing Equipment
NOTE: All documents cited will be the latest published
versions.
5 Terminology
5.1 bottom feed — Equipment utility supply lines enter
the equipment from its underside typically through the
floor.
5.2 equipment configuration — Specifically, the
arrangement, location, type and quantity of EPOC’s
needed for installation. Also know as tool configuration.
5.3 equipment point of connection (EPOC) — A
fitting or other terminal provided with the processing
equipment (either external or internal) for utility
connection, the equipment end/termination of the
hookup. Also know as tool point of connection.
5.4 external connection — An external connection is
located outside the main frame of equipment.
5.5 facilities interface specification
— Documentation
provided by an equipment supplier that contains the
equipment requirements for utilities and installation
[SEMI E6].
5.6 facility services — Any gas, exhaust, liquid,
power, data communications or other material which are
supplied to or carried away from the equipment and
used in the process. Also referred to as utilities or
facilities.
5.7 footprint — The total area or floor space
consumed by a piece of equipment when viewed
perpendicular to the area of reference (e.g., normally,
when viewed from directly overhead and considering
the floor).
5.8 hazardous production materials (HPM) — A
solid, liquid, or gas that has a degree of hazard rating in
health, flammability, or reactivity of class 3 or 4 as
ranked by NFPA 704 and that is used directly in
research, laboratory, or production processes that have
as their end product materials that are not hazardous.
5.9 hookup — The set of activities and organization
required to accept incoming process equipment, move it
into place, connect the equipment to all facilities, and
test the connections. The connection of all necessary
facilities and interconnects required to make the
equipment package fully operational.
5.10 interconnect — Connections between equipment
mainframe and peripheral equipment subsystem
equipment [SEMI E6].
5.11 internal connection — An internal connection is
a utility connection to the equipment which is located
internal to the equipment and typically associated with
hazardous utilities.
5.12 interface box — An enclosure located between
the equipment mainframe and facility services typically
containing components for pressure regulation and
filtration. It functions to consolidate facility service
requirements to single points of connection. The
interface box can provide location and ability to pre-
facilitate equipment hookups in advance of equipment
delivery.
5.13 jig — A three dimensional fixture, typically a
frame that contains equipment installation aides which
serve to indicate location and type of connection needed
for equipment hook-up.
5.14 location plane — The common area on a piece of
equipment where EPOC’s may be located (e.g., back,
side, top, bottom).
5.15 pedestal — Structural support element upon
which equipment or raised floor rests.
5.16 pre-facilitation — The stage in the equipment
installation process that follows base build and precedes
equipment delivery/equipment hookup. Pre-facilitation
brings the various facilities services close to the new
equipment location, including new facilities services
and structural modifications required to prepare the
facility to accept the equipment.
5.17 pre-facilitation pedestal — A matching
equipment floor mounting surface intended to act as a
means to expedite equipment hookup, as well as, save
fab floor space by having pre-plumbed connections.
Ideally, the pedestal would be installed and facilitated to
the UPOC’s prior to the equipment arrival.
5.18 raised floor — The removable floor system
installed above the actual building floor within
cleanroom environments to control air flow and allow
access for utility routing and connection.