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SEMI E15-0698 E2 © SEMI 1990, 2003 1 SEMI E15-0698 E2 (Reapproved 0703) SPECIFICATION FOR TOOL LOAD PORT This standard was technically reapproved by the Globa l Physical Insterfaces & Carriers Committee and is the di…
SEMI E12-0303 © SEMI 1986, 2003 2
generally accepted 0° C, as has the semiconductor
industry, in its definition of sccm. Standard pressure has
almost universally been accepted as one atmosphere,
except for rounding errors in different units.
10.2 Further confusion has existed in the definition of
standard density when extended to vapors. For perfect
gases (most light gases are nearly perfect), the standard
density can be defined as the density of the gas at
standard temperature and pressure. Since one gram
mole of a perfect gas occupies 22,414 cubic centimeters
at standard pressure and standard temperature, it
follows that a flow rate of 22,414 sccm of any perfect
gas is one mole per minute.
10.3 By defining standard density as in Section 7.1, the
correlation between sccm and moles/minute is retained,
even for vapors. If standard density were defined as the
actual density of the vapor at standard temperature and
pressure, then the correlation with moles per minute
would differ by the vapor' s compressibility factor (Z).
This is not an acceptable alternative because the
compressibility of many vapors is not accurately
known, and, in fact, does not exist for those materials
that are liquid at standard temperature and pressure.
11 Implications for Calibration
11.1 Since the standard flow units are defined at a
standard density, they represent units of mass flow
rather than volumetric flow.
11.2 Gravimetric calibration readings in grams per
minute (g/min) can be converted to standard cubic
centimeters per minute (sccm) by dividing by the
standard density (g/scc) as defined in Section 7.1.
11.3 Rate-of-rise (ROR) data will generally have
negligible compressibility error when operated over a
low absolute pressure range. If compressibility errors
are significant, they will cause the rate of pressure rise
to be reduced and become pressure-dependent as the
pressure increases. In this case, the pressure range must
be reduced, or correction made, for compressibility.
11.4 Volumetric flow data must be corrected from
actual density of the real gas at the test conditions to the
standard density. The actual density can be
approximated for near-perfect gases by ratios of
absolute pressure and temperature to the standard
density. For vapors, the actual density at the test
conditions must be known from other data.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E15-0698
E2
© SEMI 1990, 2003 1
SEMI E15-0698
E2
(Reapproved 0703)
SPECIFICATION FOR TOOL LOAD PORT
This standard was technically reapproved by the Global Physical Insterfaces & Carriers Committee and is the
direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
approved by the North American Regional Standards Committee on March 12, 2003. Initially available at
www.semi.org May 2003; to be published July 2003. Originally published in 1990; previously published
March 2003.
E
This specification was editorially modified in November 2004 to correct an editorial error. Changes were
made to Table 1.
1 Purpose
1.1 This standard is intended to unify the interface
between process/inspection tools and automated wafer
carrier transport systems while maintaining
compatibility with human transport.
2 Scope
2.1 This specification deals with the mechanical
interface (load port) for wafer carrier transfer between
wafer carrier material transport systems, including
humans, and wafer fabrication/inspection equipment
(tools). The concept defines the placement and
orientation of a wafer carrier on a tool to allow
reasonable interfacing with mechanized material
movement systems without compromising human
access to perform the material exchange function.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Impact
3.1 Compliance with this specification requires the
placement of load ports on tools to specific heights,
orientations, and load depths. Restrictions are also
placed on clearances to obstructions which may be
adjacent to such ports.
4 Referenced Standards
4.1 SEMI Standards
SEMI E1 — Specification for 3 inch, 100 mm, 125
mm, and 150 mm Plastic and Metal Wafer Carriers
SEMI E19 — Standard Mechanical Interface (SMIF)
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Definitions
5.1.1 box — A protective portable carrier for a cassette
and/or substrate(s).
5.1.2 cassette — An open structure that holds one or
more substrates.
5.1.3 cassette centroid — A datum representing the
theoretical center of a stack of wafers in a cassette
formed by the pocket centerline and the “center” pocket
as defined by the location associated with dividing
dimension B3 by two (see SEMI E1, Figure 1).
5.1.4 cassette envelope — A rectangular volume with
vertical sides which completely contains a cassette,
even if the cassette is tilted (see Figure 1).
5.1.5 enclosed load port — A load port with overhead
clearance obstructed by the tool.
5.1.6 global orientation — The general orientation of a
wafer carrier in a tool; may be vertical or horizontal.
5.1.7 load depth — The horizontal distance from the
load face plane to cassette centroid or carrier centroid
(see Figures 2 and 3 (D)).
5.1.8 load face plane — The furthest physical vertical
boundary plane from cassette centroid or carrier
centroid on the side (or sides) of the tool where loading
of the tool is intended (see Figures 2 and 3).
5.1.9
load height — The distance from the bottom of
the cassette or carrier to the floor at the load face plane
(see Figure 3 (H)).
5.1.10 load port — The interface location on a tool
where wafer carriers are delivered. It is possible that
wafers are not removed from, or inserted into, the
carrier at this location.
5.1.11 open load port — A load port with overhead
clearance unobstructed by the tool.
5.1.12 pod — A box having a Standard Mechanical
Interface (SMIF) per SEMI E19.
SEMI E15-0698
E2
© SEMI 1990, 2003 2
5.1.13 spacing — The minimum spacing between
centroids (see Figure 2, S).
5.1.14 tool — Any piece of semiconductor fabrication
or inspection equipment designed to process wafers
delivered in wafer carriers.
5.1.15 tilt — A small angle of offset from the normal
horizontal or vertical orientation of a cassette or wafer
carrier designed to preferentially align or keep wafers in
their intended place within the carrier/cassette (see
Figure 1, T).
5.1.16 wafer carrier — Any cassette, box, pod, or boat
that contains wafers.
5.1.17 wafer carrier centroid — A datum representing
the theoretical location of the center of a stack of wafers
in the carrier.
5.1.18 wafer carrier envelope — A rectangular volume
with vertical sides which completely contains a carrier,
even if the carrier is tilted (see Figure 1).
5.2 Description of Terms Specific to this Standard
5.2.1 carrier — Wafer carrier.
6 Ordering Information
6.1 The following items require communication
between the tool supplier and user and shall be included
in any request for quotation, quotation, or purchase
order:
6.1.1 If the tool has multiple load ports, provide the
spacing, S, between carrier centroids (see Section 7.8).
6.1.2 Specify what carrier (e.g., SEMI standard
cassette, pod) is to be accommodated by the load port.
6.1.3 Specify whether the load port is open or
enclosed.
6.1.4 Specify whether the wafer orientation is
horizontal (per Section 7.3.1) or vertical (per Section
7.3.2).
7 Requirements
7.1 The dimensions for the placement of a wafer
carrier on the load port of a tool are given in Table 1.
7.2 The standard is based upon the concept that any
wafer carrier can be used. Dimensions are usually
specified as clearances to wafer carrier envelopes (see
envelope concept in Figure 1).
7.3 The global orientation of the cassette or wafer
carrier is constrained to be parallel or perpendicular to
the load face plane. Allowable cassette orientations are:
7.3.1 For wafers horizontal, the opening of the cassette
must be opposite the load face plane, and the front
surface of the wafer must face up (see Figure 4);
7.3.2 For wafers vertical, the opening of the cassette
must face up, and the front surface of the wafer must
face the load face plane (see Figure 5).
7.3.3 This requirement also applies to cassettes in
pods.
7.4
The maximum tilt is 10 degrees.
7.5 The load height is specified as follows (see Figure
3):
7.5.1 Dimension H is 900 mm (~35.4 in.), fully
adjustable over ± 10 mm (~0.4 in.).
7.6 The maximum height above H of an obstruction
between the load face plane and the carrier envelope
(such as for an alignment device or identification tag
reader) is 50 mm (~2 in.) (see Dimension H1 in Figure
3).
7.7 Clearances (C1, C2, and C3) are defined with
respect to the largest carrier envelope required. For
cassettes, envelopes are defined using cassette
dimensions from SEMI E1. For pods or other wafer
carriers, envelopes are defined using the carrier
standard (if any) or the carrier manufacturer's
specifications (see Figure 1 for concept and Figures 2
and 3 for use).
7.8 Dimension S specifies the recommended minimum
spacing between cassette/wafer carrier centroids. In any
case, if S violates clearance C1 in any application, then
C1 prevails (see Figure 2).
7.9 Tools with enclosed load ports shall have a
minimum vertical clearance, C3, above the cassette or
carrier at the load port. Open load ports shall have a
vertical clearance above the load port which is
unrestricted by the tool.
Table 1 Dimension Requirements, mm (inches)
Dimension Application Value, mm (in.) Notes
C1 minimum 75 (3)
C2 minimum 30 (1.2)
C3 minimum 225 (9) See Note 1
D maximum 250 (9.8)