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SEMI E116-0705 © SEMI 2002, 2005 20 Tool Type Modules Metrology Loadports Central Wafer Handler Align-ment Stage Measure- ment Stage Inspection Loadports Inspection Stage Handler Probe / Test Loadports Probe/ Test Platfo…
SEMI E116-0705 © SEMI 2002, 2005 19
RELATED INFORMATION 1
EXAMPLES OF EQUIPMENT PERFORMANCE TRACKING (EPT)
NOTICE: This related information is not an official part of SEMI E116 and was derived from North American
Information and Control. This related information was approved for publication by full letter ballot procedures on
April 30, 2002.
R1-1 Examples of EPT Modules per Tool Type
R1-1.1 Table R1-1 lists examples of EPT modules for various equipment types. It is not required that each tool type
support all or be limited to only the modules listed; rather, the listing is provided as an example only.
Table R1-1 Example EPT Modules
Tool Type Modules
CMP/
Planar
Loadports Alignment
Stage
Wafer
Handler
Transport Polish
Table
Scrub
Station
Rinse
Station
Linked Litho
Track
Loadports Central
Wafer
Handler
Module
Spin Cup Link
Transfer
Station
Buffer Vapor Prime Chill
Plate
Soft Bake
Oven
Linked Litho
Expose
Expose
Stage
Wafer
Transfer
Link
Transfer
Station –
In port
Link
Transfer
Station –
Out port
Reticle
Stage
Reticle
Library
Reticle
Loader
Arm
Thin Film
Sputter
Loadports Central
Wafer
Handler(s)
Cool Down PVD Airlock Argon
Sputter Etch
Degas In Situ
Metrology
CVD
Diffusion
Furnace
Loadports Quartz
Loading
Station
Reactor
Module
Wafer
Transfer
System
Buffer
Implanter Loadports Central
Wafer
Handler(s)
Implant
Chamber
Platen Notch
Aligner
Coldplate
Plater Loadports Central
Wafer
Handler
Degas Plate
Chamber
Thermal
Anneal
Loadports Central
Wafer
Handler
Bake Stage
Wet Etcher Loadports Central
Wafer
Handler
Aligner Bath CH 1 Bath CH
2
Buffer
Dry Etcher Loadports Central
Wafer
Handler
Aligner Chill Plate Etch CH
1
Etch CH 2
Wafer Sorter Loadports Central
Wafer
Handler
Aligner
SEMI E116-0705 © SEMI 2002, 2005 20
Tool Type Modules
Metrology Loadports Central
Wafer
Handler
Align-ment
Stage
Measure-
ment Stage
Inspection Loadports Inspection
Stage
Handler
Probe / Test Loadports Probe/ Test
Platform
Handler
R1-2 EPT Module / Task Definition Example
R1-2.1 Figure R1-1 shows a simple module and the associated actions/tasks that correspond. The EPT Tasks have
been diluted to the level that will allow a serial chain of tasks to occur. The Internal Tasks column is present to
show that the equipment may have much more happening concurrently at a more detailed level. Table R1-2 shows a
possible task-based process flow in this module.
Spinning substrate Dispensing resist
Substrate load/unload
Figure R1-1
Example EPT Module
Table R1-2 Example EPT Tasks
Step Action Possible Internal Tasks EPT Active Task
1 Loading the substrate Receiving the substrate
Substrate alignment
Substrate load
2 Coating the substrate Substrate spin (accelerate)
Substrate spin (steady)
Dispense resist
Substrate spin (decelerate)
Substrate coat
3 Unloading the substrate Substrate alignment
Substrate removal
Substrate unload
R1-3 An Example of Equipment Performance Tracking on a Carrier Handling Module
R1-3.1 This section provides examples of equipment performance tracking to clarify the application of the standard
to modules that are part of the Equipment Front-End Module (EFEM).
R1-4 Carrier Handling Module (CHM)
R1-4.1 The Carrier Handler is a part of EFEM, excluding any Substrate Handler, which is defined in SEMI E101. A
Carrier Handling Module is similar but different from the definition. It is a more general subsystem to handle
carriers without handling substrates in EFEM that is applicable to various analyses and applications. The Carrier
Handling Module is a logical module that may or may not represent an existing physical module.
SEMI E116-0705 © SEMI 2002, 2005 21
R1-4.2 The advantages of applying Equipment Performance Tracking to the Carrier Handling Module are as
follows:
Any equipment, except certain specific ones such as an expose tool within a linked litho tool in the lithography
process, has one or more Carrier Handling Modules.
The state of the Carrier Handling Module leads to whole input and output of material to and from an equipment.
Monitoring the Equipment Performance Tracking state of the Carrier Handling Module helps control loading to
or unloading from equipment on appropriate time.
The state can reveal what related SEMI standards, i.e. SEMI E87 and SEMI E90, may not address.
Estimation of capabilities about sub-components on a Carrier Handling Module is available with tracking the
state.
Each component that makes up the Carrier Handling Module may experience mechanical failure. This can cause
the entire Carrier Handling Module to be in an out of service state. Tracking time between failures would be
valuable.
R1-5 Components to track performance of Carrier Handling Module
R1-5.1 Generally, a Carrier Handling Module has the following components.
Carrier Handoff PIO (SEMI E84) Port
Carrier Transfer Mechanism
Carrier ID Reader
Carrier ID Writer
FOUP Opener
Carrier Slot Mapper
R1-5.2 This section investigates the following composition to represent examples for Fixed Buffer type and Internal
Buffer type equipment. An example of a Carrier Handling Module is illustrated in Figure R1-2. Number of installed
components are listed in the Table R1-3.
Table R1-3 Typical Composition of Carrier Handoff Module
Number Installed Carrier Handoff
PIO
Carrier Transfer
Mechanism
Carrier ID
Reader
Carrier ID
Writer
FOUP
Opener
Slot Mapper
Internal Buffer Type 2 4 2 1 1 1
Fixed Buffer Type 2 2 2 2 2 2
#1
Several Carrier Transfer Mechanisms are usually docking mechanism for Fixed Buffer type. For Internal Buffer type, one of them is a Carrier
Transfer Robot in internal buffer, one is a Docking Mechanism inside the internal buffer and the other one is Carrier Transfer Mechanism to pass
carrier between Load Port and the Internal Buffer.