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SEMI T14-1104 © SEMI 2004 1 SEMI T14-0705 SPECIFICATION FOR MICRO ID ON 300 mm SILICON WAFERS This specificati on was technically approved by the Global Trac eability Committee and is the direct responsibility of the Jap…

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SEMI T13.2-1104 © SEMI 2004 23
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SEMI T14-1104 © SEMI 2004 1
SEMI T14-0705
SPECIFICATION FOR MICRO ID ON 300 mm SILICON WAFERS
This specification was technically approved by the Global Traceability Committee and is the direct
responsibility of the Japanese Traceability Committee. Current edition approved by the Japanese Regional
Standards Committee on July 23, 2004. Initially available at www.semi.org September 2004; to be published
November 2004.
NOTICE: The designation number of T14 was updated during the 0705 cycle to reflect the creation of T14.1
1 Purpose
1.1 The purpose of this document is to specify a new means of identification with the Micro ID on 300mm polished
monocrystalline Silicon wafer with polished edge for process control.
1.2 The objective of the Micro ID is to keep unique information to be assigned in the device manufacturing process
on the location defined on the wafer bevel.
2 Scope
2.1 This document assumes that the Micro ID is implemented under the responsibility of Device Manufacturers.
2.2 A two-dimensional data matrix code symbol consists of the microdots marked on the bevel of a semiconductor
wafer.
2.3 Although this specification does not specify the marking techniques that may be employed when complying
with its requirements, it is assumed that the microdots will be obtained by laser irradiated individual dots.
2.4 The data matrix code symbol is applicable to a broad range of wafer products (un-patterned or patterned wafers)
with mirror polished
bevel surface.
2.5 The format and algorithms of this code are based on two-dimensional symbology specified in ISO/IEC ISS
16022.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI AUX001 — List of Vendor Identification Codes
SEMI M1 ― Specifications of Polished Monocrystalline Silicon Wafers
SEMI M1.15 — Standard for 300 mm Polished Monocrystalline Silicon Wafers (Notched)
SEMI T1 — Specifications for Back Surface Bar Cord Marking of Silicon Wafers
SEMI T7 — Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional
Matrix Code Symbol
3.2 ISO
1
/IEC
2
Standard
ISO/IEC ISS 16022 — Information Technology – International Symbology Specification – Data Matrix
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.
Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30, Website: /www.iso.ch
2 International Electrotechnical Commission, 3, rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00, Website: www.iec.ch
SEMI T14-1104 © SEMI 2004 2
4 Terminology
4.1 Definitions
4.1.1 alignment bar, of a data matrix code symbol — a solid line of contiguous filled cells abutting a line of
alternately filled and empty cells [ISO/IEC ISS 16022].
4.1.2 binary values — a protrusion dot in the wafer surface indicates the binary value 1. The absence of a dot, or a
smooth surface surrounding a cell center point indicates the binary value 0.
4.1.3 border column — the outermost column of a data matrix code symbol. This column is a portion of the finder
pattern.
4.1.4 border row — the outermost row of a data matrix code symbol. This row is a portion of the finder pattern.
4.1.5 cell center point, of an array — the point at which the centerline of a row intersects the centerline of a
column.
4.1.6 cell, of a data matrix code symbol — the area within which a dot may be placed to indicate a binary value.
4.1.7 cell spacing, of an array — the (equal) vertical or horizontal distance between the cell center points of
contiguous cells.
4.1.8 center line, of a row or column — the line positioned parallel to, and spaced equally between, the boundary
lines of the row or column.
4.1.9 central area, of a cell — the area enclosed by a circle centered at the cell center point; used by code readers to
sense the binary value of the cell.
4.1.10 data matrix code symbol — a two-dimensional array of square cells arranged in contiguous rows and
columns. In certain ECC200 symbols, data regions are separated by alignment patterns. The data region is
surrounded by a finder pattern [ISO/IEC ISS 16022].
4.1.11 finder pattern, of a data matrix code symbol — a perimeter to the data region. Two adjacent sides contain
dots in every cell; these are used primarily to define physical size, orientation and symbol distortion. The two
opposite sides are made up of cells containing dots in alternate cells [ISO/IEC ISS 16022].
4.1.12 Micro ID — Micro ID consists of the data matrix code symbol, which is formed with some protruding marks
on the silicon wafers.
4.1.13 protrusion dot — a locally protruded region with a reflectance which differs from that of the surrounding
surface.
NOTE 1: To assure reading efficiency, a minimum contrast of 30% is required between the reflectance value of a dot and the
surrounding wafer surface. Various densitometers can provide such measurements nondestructively.
4.1.14 protrusion dot misalignment, within a cell — the distance between the physical center point of a protrusion
dot and the cell center point.
5 Requirements
5.1 Shape and Size of the Data Matrix Code Symbol
5.1.1 Each square data matrix code symbol shall be composed of an array of 16 rows and 16 columns as defined in
ISO/IEC ISS 16022. (As shown in Figure 1.)
5.1.2 Cell spacing shall be 6.25 µm, center to center. (As shown in Figure 2.)
5.2 Shape and Size of the Microdot Mark
5.2.1 A microdot mark is formed by laser irradiation and consists of a single dot mark on each laser-irradiated
point.
5.2.2 The mark has a single protrusion, which includes a concave portion provided around the protrusion and lower
than a surface of the wafer and whose center potion protrudes upward so as to be higher than the surface of the
wafer.