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SEMI M26-0304 © SEMI 1995, 2004 1 SEMI M26-0304 GUIDE FOR THE RE-USE OF 100, 125, 150 AND 200 mm WAFER SHIPPING BOXES USED TO TRANSPORT WAFERS This guide was technically approved b y the Global Silicon Wafer Com mittee a…

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SEMI M25-95 © SEMI 1995, 2003 2
5.5.1 Calibration wafers must be handled and stored
with great care to avoid contamination and damage.
5.5.2 The bell-shaped peak in the LPD histogram of a
calibration wafer which is generated by the latex-
spheres must be well-defined and must be well above
the background level. The bell-shaped curve has to go
down to less than 50% of its peak value on both sides of
the maximum within a diameter range of ± 15% as
referred to the nominal latex-sphere diameter.
5.6 Multiple Deposition of Latex-Spheres —
Deposition of latex-spheres with different, well-defined
diameters on a calibration wafer is allowed if all the
conditions of this specification are met for each kind of
deposited latex-sphere size.
6 Packaging
6.1 Special packing requirements shall be subject to
agreement between the supplier and the purchaser.
Otherwise all wafers shall be handled, inspected, and
packed in such a manner as to avoid chipping,
scratches, and contamination, and in accordance with
the best industry practices to provide ample protection
against damage during shipment.
7 Data to Accompany Calibration Wafers
7.1 Certificate for average and standard deviation of
the diameter of the latex spheres used, including the
production lot number of latex-spheres used.
7.2 Date of production and certification of calibration
wafer.
7.3 Histogram, as defined above.
7.4 Approximate number of deposited latex-spheres in
a specified area.
7.5 Wafer identification.
7.6 Name and address of the originator of the
calibration wafers.
7.7 LPD’s wafer map.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI M26-0304 © SEMI 1995, 2004 1
SEMI M26-0304
GUIDE FOR THE RE-USE OF 100, 125, 150 AND 200 mm WAFER
SHIPPING BOXES USED TO TRANSPORT WAFERS
This guide was technically approved by the Global Silicon Wafer Committee and is the direct responsibility
of the Japanese Silicon Wafer Committee. Current edition approved by the Japanese Regional Standards
Committee on January 9, 2004. Initially available at www.semi.org February 2004; to be March 2004.
Originally published in 1995; last published in 1996.
1 Purpose
1.1 This document is a guide for box cleaning services,
wafer suppliers, and wafer users for the re-use of 100,
125, 150 and 200 mm wafer shipping boxes.
1.2 Its purpose is to reduce the total cost relating to
transport of 100, 125, 150 and 200 mm wafers from the
wafer supplier to the customers.
2 Scope
2.1 This Guide stipulates materials relating to transport
of 100, 125, 150 and 200 mm wafers using shipping
boxes.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI M31 — Provisional Mechanical Specification for
Front-Opening Shipping Box Used to Transport And
Ship 300 mm Wafers
SEMI M45 — Provisional Specification for 300 mm
Shipping System
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Defintions
4.1.1 bag — a package used for sealing the outside of
the wafer box. Typically two or three types of different
plastic film and aluminum film are laminated, and these
are usually heat-sealed. (SEMI M45)
4.1.2 carrier — an open structure that holds one or
more substrates. (SEMI M31)
4.1.3 label — The label on the wafer shipping box
identifying the product and its manufacturer (see SEMI
M45.)
4.1.4 recycle — to use an already used item for some
other useful purpose. (SEMI M45)
4.1.5 re-use — to repeat use of an item in its original
shape for the same purpose as initially intended. (SEMI
M45)
4.1.6 seam tape — adhesive-coated tape employed to
seal the seam between the cover and the base of a wafer
shipping box.
4.1.7 secondary container — the outermost box of the
smallest transport unit. Typically cardboard boxes or
similar boxes are used. (SEMI M45)
4.1.8 shipping box — a protective container for a
carrier and/or wafer(s) that is used to ship wafers from
the wafer suppliers to their customers. (SEMI M31)
5 Suitability for Re-Use
5.1 The ability to re-use wafer boxes and cassettes is
adversely affected by certain characteristics. Some of
these characteristics also impact on the ability to
recycle.
5.2 Wafer Shipping Box
5.2.1 After a customer has transferred an accepted
wafer to a fab carrier, the wafer shipping box must be
returned to the supplier without having used it for any
other purpose. The wafer shipping box will be inserted
into a bag sealed prior to return to the wafer supplier
using protective bag (agreed upon by supplier and
customer).
5.2.2 The wafer shipping box will maintain its
dimensional stability throughout its useful life.
5.2.3 Wafer shipping box materials will be recyclable
after useful life.
5.2.4 The following characteristics are recommended:
5.2.4.1 generic embossed markings (e.g., model name,
model number, manufacturer' s information),
5.2.4.2 embossed recycle symbol, trademark symbol,
mold markings,
5.2.4.3 removable labels with low residue, low tack
adhesives,
SEMI M26-0304 © SEMI 1995, 2004 2
5.2.4.4 removable seam tape with low residue, low
tack adhesives,
5.2.4.5 removable methods of identification, and
5.2.4.6 stackable wafer box bases and covers.
5.2.5 The following characteristics are not
recommended:
5.2.5.1 “custom” embossed markings,
5.2.5.2 end-user specific logos, symbols, and markings,
5.2.5.3 high residue tape and labels,
5.2.5.4 labels which are difficult to remove or are non-
removable, and
5.2.5.5 non-removable marks such as inks and other
coloring.
6 Procedural Guidelines
6.1 Collection Method at the Wafer User Facility
6.1.1 Unpack secondary containers and save for re-use
or recycle.
6.1.2 Exercise care when removing the bag; avoid
scuffing or cutting the wafer shipping box surface.
6.1.3 Remove wafers from box in cleanroom area.
6.1.4 Remove all labels from the box.
6.1.5 Place wafer shipping boxes for re-use in a
designated collection container or collection area.
6.1.6 Maintain the wafer shipping boxes for re-use in
an environment free from contact with metal
contaminants and process chemicals.
6.1.7 Periodically return wafer shipping boxes for
reclean to the reclean service location or the wafer
supplier.
6.1.8 Whenever possible, cycle wafer shipping boxes
between the same wafer user and wafer supplier.
6.2 Wafer Shipping Boxes Cleaning at the Reclean
Service Location
6.2.1 The supplier of the reclean service must engineer
the reclean process.
6.2.2 At the service supplier’s option, visually inspect
the wafer shipping boxes prior to cleaning. The service
supplier and customer should agree to acceptable and
unacceptable levels of defects, recognizing that there
will be some normal wear. These levels should be
provided to the service supplier. Inspect for the
following defects:
6.2.2.1 deformation or warp,
6.2.2.2 razor cuts, scuffs, breaks, cracks, voids, and
fractures,
6.2.2.3 contamination and imbedded silicon,
6.2.2.4 damage to tension springs or other wafer
retention mechanisms, and
6.2.2.5 markings and labels.
6.2.3 Collect defective parts for recycle, and clean
acceptable parts as follows:
6.2.3.1 Clean using an aqueous-based or non-aqueous-
based chemistry.
6.2.3.2 Chlorofluorocarbon chemistries are not
permitted.
6.2.3.3 Confirm the compatibility of the wafer shipping
box materials with the cleaning method and drying
conditions.
6.2.4 Visually inspect the wafer shipping boxes after
cleaning using a high intensity or an ultraviolet light.
The wafer user and the wafer supplier should agree to
acceptable and unacceptable levels of defects,
recognizing that there will be some normal wear.
Inspect for all the defects noted in Section 6.2.2 and, in
addition, for:
6.2.4.1 residues from labels, markings, or tape, and
6.2.4.2 failure of the wafer shipping box halves to seat
and seal together.
6.2.5 Collect defective parts for recycle.
6.2.6 Return acceptable boxes and cassettes to the
wafer supplier using box wrap, nesting material, and
shipping containers as required to maintain cleanliness
and mechanical integrity.
6.3 Maximum Number of Re-Use Cycles
6.3.1 Base the total number of re-use cycles on the
ability to maintain both mechanical integrity and
cleanliness.