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SEMI G13-88 © SEMI 198 1, 1996 2 7 Reference s ASTM D 696 1 — Coefficient of Linear Therm o Expansion Plastic NOTICE: T hese standards do n ot purport to address safety issues, if any, as sociated with their use. It is t…

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SEMI G13-88 © SEMI 1981, 19961
SEMI G13-88
STANDARD TEST METHOD FOR EXPANSION CHARACTERISTICS OF
MOLDING COMPOUNDS
1 Scope
1.1 This specification describes the procedure for
measuring the Coefficient of Thermal Expansion (CTE)
and Glass Transition Temperature (T
g
) of thermosetting
molding compounds.
2 Apparatus
2.1 Mold — Producing 0.1–0.2" c ubes or equivalent
with an aspect ratio of 0.8–1.
2.2 Transfer Press
2.3 Micrometer — (0.0001 accuracy)
2.4 Thermomechanical Analyzer — (TMA) (Dupont
Model 943, Perkin-Elmer TMS-1, or equivalent)
2.5 Recorder and Power Supply — (Dupont Model
990, Perkin-Elmer UUI, or equivalent)
2.6 Oven — (200° ± 5°C capabilit y)
3 Materials
3.1 Nitrogen (Gas)
3.2 Nitrogen (Liquid)
4 Sampling
4.1 Mold samples according to pro duct specifications.
4.2 Postcure the specimen in acco rdance with the
material specification, and allow two (2) hours for
cooling in a desiccator.
5 Procedure
5.1 Select a sample, making certain that all sides are
flat and smooth. Measure the height of the sample with
a micrometer to the nearest 0.0001 inch.
5.2 Place the sample into the TMA sample holder and
bring the expansion probe down slowly until it just
makes contact with the sample. Place sample on fixture
per Instruction Manual. Add 3.0–5.0 grams to weight
tray. Adjust the Linear Variable Differential
Transformer (LVDT) to bring the recorder pen on scale.
The LVDT is then zeroed with the zero switch.
Readjust LVDT, if necessary, to bring pen on scale.
5.3 In a nitrogen atmosphere, heat the sample at a rate
of 20°C/min. to its post-cure temperature.
5.4 Without changing LVDT or pr obe position, use
liquid nitrogen to cool the sample to a temperature at
least 100°C below the deviation from α
1
.1.
5.5 Heat the sample at a rate of 5°C/min. to at least
200°C.
5.6 Calculate α(CTE), using the formula:
CTE =
DL()DY()
DT
()
L
()
°
°
°
°
°
°
where: L
(T+10°)
=Length at Temperature 10° higher than
temperature at which CTE is being measured. L
(T-
10°)
=Length at Temperature 10° lower than temperature
at which CTE is being measured
∆Y = Y axis sensitivity in mils./in
.
∆T = change in temperature (20°C)
L = initial sample height (mils)
K =
LIT CTE
EXP.CTE
for aluminum standard
5.7 Run two (2) samples for each lot and record the
average.
5.8 An aluminum standard should be run to determine
the calibration factor K for the Y (length) axis per 5.4
above, as necessary to insure the accuracy of the
instrument's calibration.
5.9 Temperature readings should b e calibrated
periodically per manual instructions.
6 Report
6.1 Data is to include the orientati on for which the
sample is measured (e.g., perpendicular to flow).
6.2 CTE is reported as a function o f temperature. CTE
is to be reported every 10°C increments.
6.3 Report molding conditions and post-mold cure
conditions.
6.4 Report specimen size.
NOTE: For many materials, the Glass Transition Temperature
(Tg) may be determined by drawing tangents to the curve at
the points of minimum and maximum slope. The point at
which the tangents intersect is the T
g
. The slopes of the lines
are referred to as α 1 (below T
g
) and α2 (above T
g
).
SEMI G13-88 © SEMI 1981, 1996 2
7 References
ASTM D 696
1
— Coefficient of Linear Thermo
Expansion Plastic
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G14-88 © SEMI 1982, 19961
SEMI G14-88
GUIDELINE FOR SPECIFYING THE DIMENSIONS AND TOLERANCES
USED TO MANUFACTURE PLASTIC MOLDED DIP PACKAGE
TOOLING
1 Preface
1.1 This document is a guideline for the ordering of
tooling required to mold and form plastic molded DIP
semiconductor packages. It is to be used by packaging
engineers, mold manufacturers, and end-of-line tool
makers as the basis for defining the limits of
manufacturing tolerances.
2 Applicable Documents
2.1 This document specifically refers to:
JEDEC Publication No. 95
1
— JEDEC Registered and
Standard Outline for Semiconductor Devices
2.2 Related information may also be found in:
MIL-STD-100
2
— General Engineering Drawing
Practices
ANSI Y14.5
3
— Dimensioning and Tolerancing
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
3 Selected Definitions — Pr oduct Criteria
Tolerance Limits
3.1 mismatch and offset — Defined with respect to
package only. All statements will be equally applicable
in two (2) axes. All mismatch and offset measurements
are made after molding and prior to trimming.
3.1.1 cavity to frame offset — Will be measured prior
to any trimming operation. Offset will be defined as the
difference in bottom cavity position with respect to a
leadframe datum. The offset measurement will exclude
leadframe tolerances. (See Figure 1.)
3.1.2 top to bottom cavity mismatch — Characterized
by the fact that the top and bottom cavities in the mold
are not aligned properly, causing a mismatch condition.
The measurement shall be stated as the difference in the
top cavity position relative to the bottom cavity
position. (See Figure 2.)
1 JEDEC, 20001 Eye Street N.W., Washington, D.C. 20006
2 Military Standards, Naval Publications and Form Center, 5801
Tabor Ave., Philadelphia, PA 19120
3 ANSI, 1430 Broadway, New York, NY 10018
3.2 parting line protrusions — Those plastic excesses
which remain as a normal characteristic after normal
trimming and molding operations. (See Figure 4.)
3.3 top or bottom protrusions — Those plastic
excesses (includes ejector pin “crowns”) which remain
as normal characteristics extending from the smooth
surface of the molded package.
3.4 variations in lead position — Defined with respect
to a 90° angle from the top or bottom of the smooth
surface of the molded package as viewed on the end or
side projections. (See Figure 4.)
3.5 shoulder width intrusions/protrusions — Any
variations in straightness along the defined shoulder
width caused by dambar removal. (See Figure 4.)
3.6 package warpage — Any non-linear dimensional
change from the mold cavity characteristic, usually
caused by incorrect package design or molding
practices. (See Figure 5.)
3.7 shoulder bend location — Measured from the
outermost point of the inner shoulder bend radius. (See
Figure 6.)
4 Ordering Information
Purchase orders for tooling for plastic molded DIP
semiconductor packages furnished to this specification
shall include the following items:
1. A package tooling outline drawing showing all
required dimensions listed in 5. Package surface finish
to be included.
2. A list of any tolerance limits which differ from
the SEMI standards detailed in 6.
3. The type of tooling steel required.
4. The type of leadframe material to be used,
including a drawing.
5. The type of plastic to be molded (if
proprietary, a statement of its shrinkage characteristics).
6. Sampling plan for compliance to 7.
7. The number of spare parts or expendable parts
desired.
8. Type of molding press to be used, including
power requirements.