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SEMI E34-95 © SEM I 1995 1 SEMI E34-95 GUIDELINE FOR MA SS FLOW DEVICE RETURN NOTICE: This sa fety guideline does not p urport to address all of th e sa fety issues ass ociated with its use. It is th e responsibility of …

SEMI E33-94 © SEMI 1994 6

APPENDICES

The appendices are not an official part of this standard.

However, they contain relevant information for

customizing the basic standards for testing of

semiconductor equipment and facilities, and point out

areas of concern for which no standard currently exists.

A.1 Appendix A: Charged Wafer Testing

Due to overriding microcontamination concerns, non-

static-dissipative wafer carriers must be used during

semiconductor fabrication. It is suggested that any

equipment which handles wafers be tested with wafers

charged to 18 kV/in. The charge generator used for

801-2 testing can be used to charge the wafer. Some

experimentation will be required to determine the best

means to carry out this test. Alternately, the handling

mechanism may be challenged by air or contact

discharge directed to the mechanism.

It is suggested that wafer handlers be designed to

dissipate charge on incoming wafers in a controlled,

non-sparking manner. A simple AM radio tuned

between stations and placed near the handler has been

found to be a good qualitative means to detect sparking.

Sparking will result in pops and static being heard on

the radio.

A.2 Appendix B: ESD Test Methods

Although the contact method of ESD testing has been

found to be much more reproducible than the air

discharge, the air discharge is a more realistic

simulation of possible events that can occur in the

semiconductor factory. Also, the air discharge method

is the only realistic way to test objects that are primarily

fabricated from insulators, such as wet stations and

keyboards.

In addition to testing surfaces that come in contact with

humans and wafers, it is important to test any area of

the equipment that can be exposed to ESD. For

instance, wet stations are composed of assemblies

involving large masses of insulators in proximity to

metallic sensors and controllers. It is possible for the

insulating surfaces to build up charge, which then

sparks to a sensor or controller — all internal to the

equipment itself.

A.3 Appendix C: Future Directions

Items in this section are not requirements of this

standard, but are included to indicate currently ill-

defined goals for further improvements to

semiconductor factory EMC.

A.3.1 Static Charge — Minimization of static charge

promotes cleanliness, and avoids damage to material in

process and reticles.

It is suggested that electrostatic fields be held to under

200 V/cm (500 V/in). This would be applicable to

personnel, wafers, cassettes, cassette boxes, reticles,

reticle boxes, and all equipment and facility surfaces in

proximity to these items as well as all surfaces exposed

to filtered airflow. Measurements shall be made using a

properly-grounded electrostatic field meter in

accordance with its manufacturer's instructions.

A.4 Appendix D: National Requirements

A.4.1 U.S. — Section 5.1.1 Table 1, row 1.2: Radiated

immunity testing outside a shielded enclosure is legally

accomplished by obtaining an experimental license

from the FCC using FCC form 442. The FCC

recommends using techniques such as scanning or

hopping to avoid interference.

A.4.2 Europe — The earth port: Refer to Table 1.6 of

the informative annex to EN 50 082-2 for test

requirements applicable to the earth.

NOTICE: These standards do not purport to address

safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

SEMI makes no warranties or representations as to the

suitability of the standards set forth herein for any

particular application. The determination of the

suitability of the standard is solely the responsibility of

the user. Users are cautioned to refer to manufacturer’s

instructions, product labels, product data sheets, and

other relevant literature respecting any materials

mentioned herein. These standards are subject to

change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this standard, SEMI

takes no position respecting the validity of any patent

rights or copyrights asserted in connection with any

item mentioned in this standard. Users of this standard

are expressly advised that determination of any such

patent rights or copyrights, and the risk of infringement

of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E34-95 © SEMI 19951

SEMI E34-95

GUIDELINE FOR MASS FLOW DEVICE RETURN

NOTICE: This safety guideline does not purport to

address all of the safety issues associated with its use. It

is the responsibility of the users of this guideline to

establish appropriate safety and health practices and

determine the applicability of regulatory limitations

prior to use.

1 Purpose

Mass flow devices (mass flow controllers, mass flow

meters and flow control valves) are used as an integral

part of the chemical delivery system in semiconductor

processing equipment. Many of the chemicals used in

semiconductor processes can be hazardous to

equipment and personnel. Once exposed to these

chemicals, the contaminated mass flow devices can

present a hazard to repair personnel and equipment if

not handled properly.

Implementing the procedures outlined in this guideline

provide a mechanism to reduce the risk associated with

shipping and/or receiving any potentially hazardous

mass flow device used to monitor or control gases or

liquids.

2 Scope

This guideline is intended to:

Recommend and encourage the purging of devices used

with hazardous materials prior to removal to reduce the

risk of handling them.

Alert the recipient of possibly hazardous mass flow

devices to the nature of the hazard.

Establish mechanism for properly identifying and

documenting possibly hazardous mass flow devices by

using an orange tag and a health and safety disclosure

form.

3 Referenced Documents

49 CFR

— Title 49 of the Code of Federal

Regulations (CFR)

NFPA 704

— Standard System for the Identification

of Fire Hazards of Materials

1 United States Government Printing Office, Washington, D.C. 20402

2 National Fire Protection Association, Batterymarch Park, Quincy,

MA 02269

4 Terminology

4.1 hazardous materials — Those chemicals or

substances that are physical hazards or health hazards

as defined and classified in NFPA 704 whether the

materials are in use or in waste conditions.

4.2 mass flow controller (mfc) — A self-contained

device, consisting of a mass flow transducer, control

valve, and control- and signal-processing electronics,

commonly used in the semiconductor industry to

measure and regulate the mass flow of gas.

4.3 mass flow meter (mfm) — A self-contained device,

consisting of a mass flow transducer and signal-

processing electronics, commonly used in the

semiconductor industry to measure the mass flow of

gas.

4.4 material safety data sheet (msd s) — Written or

printed material concerning a hazardous material which

is prepared in accordance with the provisions of 29

CFR 1910.1200.

4.5 protective container — A sealable plastic bag or

other container which will keep hazardous material

from the mass flow device from contaminating the

outer package. The container should be transparent, if

possible.

4.6 purge — To dilute potentially harmful material in

the mass flow device by flowing an inert gas through

the device. Purging a chemical delivery line containing

a mass flow device with an inert substance is intended

to dilute hazardous materials and reduce the level of the

hazard. To be effective, the inert substance must be able

to reach all points within the chemical delivery system

in sufficient quantity to dilute the hazardous material to

safe levels. The nature of the hazard and the physical

configuration of the chemical delivery system must be

considered when developing a purge procedure.

4.7 safe — Free of conditions that can cause

occupational illness, injury, or death to personnel or

damage to or loss of equipment or property or the

environment.

5 Procedure

5.1 Disclosure Form

• Complete the disclosure form for mass flow device

return.

• Send the completed form via Fax or other suitable

method to the recipient of the mass flow device.

• Attach a copy of the form to the exterior of the

shipping container.

• Enclose another copy inside the package attached

to the protective plastic bag containing the mass

flow device during shipment.

• Retain the original form for your records.

5.2 Purging Prior to Removal — Thoroughly purge

the mass flow device following the applicable purge

procedure. Purge procedures are usually unique to the

equipment and installation. Obtain purging procedures

from your facilities manager, corporate safety

department, and/or the equipment manufacturer. If a

formal purge procedure is available, note on the

disclosure form the purge procedure document number

and source.

5.3 Equipment Removal — WARNING: Do not

remove the mass flow device until it has been properly

purged.

5.3.1 The person removing the mass flow device

should fill out an orange-colored device tag indicating

the process gas(es) or chemicals used, possible exterior

contamination and the purge procedure document

number prior to removal of the device. A sample orange

device tag is shown in Figure 1.

Figure 1

Sample Orange Device Tag

5.3.2 Carefully remove the mass flow device from the

installation or system.

5.3.3 The inlet and outlet ports should be sealed to

prevent any leakage into or out of the mass flow device.

5.3.4 The person removing the mass flow device

should attach the orange tag to the device.

5.4 Equipment Packaging — Package all mass flow

devices for shipment per government regulations

including the following:

5.4.1 Seal the device in a protective container to

prevent the contamination of the shipping package. If

the orange tag is not visible through the container, an

additional tag should be attached to the outside of the

container.

5.4.2 Place the device in a shipping container with

adequate packing to avoid damage to the device and the

protective container during shipment.

5.5 Shipping — Ship the device so that it conforms to

all applicable regulations of the countries of origin,

trans-shipment, and destination governing the shipment

of materials.