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SEMI D7-94 © SEMI 1994, 2003 2 6.1.3 Surface Rou ghness Parame ter — Maximum height of t he profile Ry5(ISO 4287/1-1984)(=Rz (DIN4768-1990)) or 10 point height of irregularities which is close to Ry5, Rz (JIS B0601-1982)…

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SEMI D7-94 © SEMI 1994, 2003 1
SEMI D7-94 (Reapproved 0703)
FPD GLASS SUBSTRATE SURFACE ROUGHNESS MEASUREMENT
METHOD
This standard was technically reapproved by the Global Flat Panel Display Committee and is the direct
responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003;
to be published July 2003. Originally published in 1994.
1 Purpose
1.1 This document defines the method of FPD glass
substrate surface roughness measurement by stylus
method surface roughness measurement instrument.
2 Scope
2.1 This specification shall be used by vendors and/or
buyers of glass substrates for flat panel display and is
effective for all glass substrates used.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 ISO Standards
1
ISO486-1982 — Surface Roughness — Parameters,
Their Values and General Rules for Specifying
Requirements
ISO3274-1975 — Instruments for the Measurement of
Surface Roughness by the Profile Method — Contact
(Stylus) Instruments of Consecutive Profile
Transformation
ISO4287/1-1984 — Surface Roughness —
Terminology — Part 1: Surface and its Parameters
3.2 JIS Standard
2
JIS B0601-1982 — Definitions and Designation of
Surface Roughness
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,
Website: www.iso.ch
2 Japanese Industrial Standards, Available through the Japanese
Standards Association, 1-24, Akasaka 4-Chome, Minato-ku, Tokyo
107-8440, Japan. Telephone: 81.3.3583.8005; Fax: 81.3.3586.2014,
Website: www.jsa.or.jp
4 Terminology
4.1 Definitions
4.1.1 long wavelength cutoff — wavelength that the
attenuation ratio of its amplitude becomes 75% when
the traced profile is passed through the high-pass
wavelength filter which eliminates waviness element.
4.1.2 short wavelengh cutoff — wavelength that the
attenuation ratio of its amplitude becomes 75% when
the traced profile is passed through the low-pass
wavelength filter which eliminates noise element.
4.1.3 stylus method surface roughness measuring
instrument — instrument that traces on a section of a
surface by a stylus, records irregularity on the surface in
a enlarged form, and indicates its amplitude as
roughness parameters.
4.1.3.1 The type of instrument in this standard is
specified to an instrument which is sometimes called as
a profiler for very thin films and steps.
5 Measurement Instrument
5.1 Method — Stylus method surface roughness
measuring instrument defined in Sections 3.1 or 3.2, or
an instrument which meets those conditions.
5.2 Stylus
Material — diamond
Shape — circular cone or rectangular cone
Tip Radius — 2 µm or less
5.3 Measuring Force — 0.1 mN (0.01 gf) or above, 0.7
mN (0.07 gf) or less.
5.4 Sampling Interval — 1 µm or less.
5.5 Vertical noise amplitude p-p value: 3 nm (= 30 Å)
or less.
6 Measurement Conditions
6.1 Long Wavelength Cutoff, λc — 0.08 mm or close.
6.1.1 Short Wavelength Cutoff, λs — 0.0025 mm or
less.
6.1.2 Evaluation length, Le — 0.4 mm.
SEMI D7-94 © SEMI 1994, 2003 2
6.1.3 Surface Roughness Parameter — Maximum
height of the profile Ry5(ISO4287/1-1984)(=Rz
(DIN4768-1990)) or 10 point height of irregularities
which is close to Ry5, Rz (JIS B0601-1982).
7 Test Specimen
7.1 A clean FPD glass substrate. No stains or oils
should be seen by the naked eye.
8 Measurement Procedure
8.1 Contact the specimen on the stage of the instrument
and leave for five minutes to condition the specimen to
room temperature.
8.2 Put the stylus on the specimen, measure roughness
by tracing the surface, and calculate the defined
roughness parameter.
8.3 Change the measurement location to the location
near the previous location and measure again.
8.4 Change the measurement location to the location
defined in Section 9 and repeat the above measurement.
9 Measurement Location
9.1 Describe the measurement location on the report,
for example, measure the following two locations:
a. The center of the specimen.
b. The point which is 20 mm inside from both edges of
the orientation corner.
10 Calculations or Interpretation of Results
10.1 Show the measurement results in nm
(nanometers) and round fractions of 0.5 and over to the
next highest whole numbers.
Table 1 Example: Measurement Results
Maximum Height: Ry5 n1 n2
The Center **nm **nm
The Corner **nm **nm
Measurement Conditions
Surface — The pattern surface
Instrument — (type of instrument and name of maker)
Stylus tip radius — 2 µm
Tracing speed — ** µm/sec
Measuring force — 0.* mN
Cutoff λc — 0.08 mm
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
1 SEMI D9-0303 © SEMI 1994, 2003
SEMI D9-0303
TERMINOLOGY FOR FPD SUBSTRATES
This terminology was technically approved by the FPD Materials and Components Committee and is the
direct responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by
the Japanese Regional Standards Committee on January 10, 2003. Initially available at www.semi.org
January 2003; to be published March 2003. This document was originally published in 1994; previously
published November 2001.
1 Purpose
1.1 This document provides terms and definitions of
materials and defects within and on the surface of flat
panel display (FPD) substrates and of dimensional,
thermal, chemical, optical and mechanical properties of
FPD substrates.
2 Scope
2.1 These terms and definitions are applicable to both
front and back substrates used in FPD fabrication.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI D3 Quality Area Specification for Flat Panel
Display Substrates
SEMI D5 Standard Size for Flat Panel Display
Substrates
SEMI D7 FPD Glass Substrate Surface Roughness
Measurement Method
SEMI D11 Specification for Flat Panel Display
Glass Substrate Cassettes
SEMI D12 Specification for Edge Conditions of Flat
Panel Display (FPD) Substrates
SEMI D15 FPD Glass Substrate Surface Waviness
Measurement Method
SEMI D24 Specification for Glass Substrates Used
to Manufacture Flat Panel Displays
3.2 ASTM Standards
1
ASTM C336 — Standard Test Method for Annealing
Point and Strain Point of Glass by Fiber Elongation
Test Method (Elongation of Glass Fibers)
ASTM C338 — Standard Test Method for Softening
Point of Glass
ASTM C598 — Standards Test method for Annealing
Point and Strain Point by Beam Bending
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
NOTE 1: SEAJ Liquid Crystal Display Manufacturing
Equipment Dictionay is referred as to every term in Section 4.
4.1 Internal Defects
4.1.1 bubble a gaseous inclusion.
4.1.2 open bubble a gaseous inclusion which is so
close to the surface that it is obviously open and/or one
so close to the surface that it may be broken open with
the point of a soft lead pencil.
4.1.3 inclusion opaque or partially melted particle
of refractory or batch material embedded in glass. Its
size is usually determined by the size of the distorted
area.
4.1.4 devitrification a crystalline area within the
glass.
4.1.5 knot an embedded glassy, transparent, lump
having an irregular or tangled appearance. Its size is
usually determined by the size of the distorted area.
4.2 Material on the Surface
4.2.1 cullet small transparent glass particles that are
adhered or fused to the glass substrate surface.
4.2.2 particle a micron-size piece of foreign
material on the glass surface.
1 American Society for Testing and Materials, 100 Barr Harbor Drive
West Conshochocken, Pennsylvania, USA 19428-2959. Tel: 610-
832-9585, Fax: 610-832-9555, http://www.astm.org