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SEMI G35-87 © SEMI 198 6, 1987 3 with this specificatio n, together with a report of the test results, shall be furnis hed at the time of shipment. 7.2 In the i nterest of controlling in s p e ction cost s, the supplier …

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SEMI G35-87 © SEMI 1986, 1987 2
6 Test Methods
6.1 Visual Inspection
6.1.1 For reference purposes the required appearance
and associated properties for any specific lead finish are
specified in the detailed SEMI specification for the
specific lead finish to be evaluated.
6.1.2 Purpose
6.1.2.1 Visual inspection shall be performed to
evaluate application of the required lead finish.
Magnification at 10× preferred.
6.1.3 Failure Criteria
6.1.3.1 Finish is wrong type, is missing, or is non-
adherent (has peeling, flaking, or blistering).
NOTE: Variations in color are not cause for failure unless
there is evidence of corrosion and flaking or pitting.
6.1.3.2 Finish contains foreign material or surface
contamination such as water marks.
6.1.3.3 Leads and terminations shall be electrically
sound and mechanically intact. Nothing in the lead
finish shall detract from lead integrity.
6.2 Solderability
6.2.1 The purpose of the test, terms and definitions,
apparatus, and materials to be used are specified in
MIL-STD-883, Method 2003.
6.2.2 Procedure to be used shall be as specified in
MIL-STD-883, Method 2003, except as specified
below.
6.2.2.1 Aging as specified in MIL-STD-883, Method
2003, shall not be performed. (See Section 6.2.2.2.)
6.2.2.2 At user’s option, pre-aging at the indicated
level below shall be performed:
1. Condition A — No pre-age.
2. Condition B — 5 hours at 150°C in Air
Atmosphere.
3. Condition C — 5 hours at 200°C in Air
Atmosphere.
4. Condition D — 4 hours suspended in Steam
Atmosphere.
5. Condition E — 8 hours suspended in Steam
Atmosphere.
NOTE: See definition section for above noted atmospheric
conditions.
6.2.3 Failure criteria shall be as specified in MIL-
STD-883, Method 2003, except as specified below.
6.2.3.1 Coverage shall be 90% on major flat
(excluding non-functional areas). Non-functional areas
include end of termination, edges in clad materials, and
areas above the seating plane.
6.3 Lead Fatigue/Lead Finish Adherence
6.3.1 The purpose of the test, apparatus, and procedure
to be used are as specified in MIL-STD-883, Method
2004, Test Condition B1, except as specified below.
6.3.1.1 Purpose of this test is limited to a check of lead
finish integrity after stressing.
6.3.1.2 Three (3) leads per device shall be tested.
6.3.1.3 Three (3) cycles of rotation shall be used.
6.3.2 Failure Criteria
When examined at 10× magnification, any evidence of
peeling, or gross discontinuity shall be considered a
device failure.
6.4 Thickness
6.4.1 Thickness, when specified, shall be measured in
functional lead area. On flat leads, measure in the
center of the major flat. On round leads, measure below
the seating plane and above the gauge plane.
6.4.2 Thickness, when specified, shall be measured in
accordance with ASTM B 568 (Measurement of
Coating Thickness by X-Ray Spectrometry) as the
preferred method.
6.4.3 Thickness may be measured as an alternative to
the above by either ASTM B 567 (Beta Backskatter
Principle) or ASTM B 487 (Cross Section Principle).
6.5 Hardness
6.5.1 Hardness, when specified, shall be measured in
functional lead area. On flat leads, measure in the
center of the major flat. On round leads, measure below
the seating plane and above the gauge plane.
6.5.2 Hardness shall be tested only when specified as a
Lead Finish Detail (e.g., for socketing application).
6.5.3 Hardness shall be tested in accordance with
ASTM E 384 (Standard Test Methods for Micro-
Hardness of Materials), or ASTM E 10 (Standard Test
Method for Brinnel Hardness for Metallic Materials),
whichever is appropriate (see detailed specification or
procurement document).
7 Certification
7.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier’s certification that
the material was manufactured and tested in accordance
SEMI G35-87 © SEMI 1986, 19873
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
7.2 In the interest of controlling inspection costs, the
supplier and the purchaser may agree that the material
shall be certified as capable of meeting certain
requirements. In this context, capable of meeting shall
signify that the supplier is not required to perform the
appropriate tests in Section 6. However, if the user
performs the test and the material fails to meet the
requirement, the material may be subject to rejection.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G36-88 © SEMI 1986, 19881
SEMI G36-88
SPECIFICATION FOR DIMENSIONS AND TOLERANCES USED TO
MANUFACTURE PLASTIC MOLDED HIGH DENSITY TAB QUAD
SEMICONDUCTOR PACKAGE TOOLING
1 Preface
This document is for the ordering of tooling required to
mold and form plastic high density TAB quad
semiconductor packages. It is to be used by packaging
engineers, mold manufacturers, and end-of-line
toolmakers as the basis for defining the limits of
manufacturing tolerances.
2 Applicable Documents
2.1 ANSI Specification
1
Y14.5 — Dimensioning and Tolerancing
2.2 JEDEC Specification
2
Pub No.95 — JEDEC Registered and Standard Outline
and Standard Outline for Semiconductor Devices
2.3 Military Specification
3
MIL-STD-100 — Engineering Drawing Practices
3 Selected Definitions — Pr oduct Criteria
Tolerance Limits
mismatch and offset — defined with respect to package
only. All statements will be equally applicable in two
(2) axes. All mismatch and offset measurements are
made after molding and prior to trimming.
cavity to frame offset — will be measured prior to any
trimming operation. Offset will be defined as the
difference in bottom cavity position with respect to a
leadframe datum. The offset measurement will exclude
leadframe tolerances (see Figure 2).
top to bottom cavity mismatch — characterized by the
fact that the top and bottom cavities in the mold are not
aligned properly, causing a mismatch condition. The
measurement shall be stated as the difference in the top
cavity position relative to the bottom cavity position
(see Figure 1).
package warpage — any non-linear dimensional
change from the mold cavity characteristic, usually
caused by incorrect package design or molding
practices (see Figure 3).
1 ANSI, 1430 Broadway, New York, NY 10018
2 JEDEC, 2001 Eye Street N.W., Washington, D.C. 20006
3 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
parting line protrusions — those plastic excesses which
remain as a normal characteristic after normal molding,
deflashing, trimming, and singulation (see Figure 4).
top, bottom protrusions — those plastic excesses
(includes ejector pin crowns) which remain as a normal
characteristic extending from the smooth surface of the
molded package.
variations in lead location — defined with respect to a
90° angle from the top or bottom of the smooth surface
of the molded package as viewed on the end or side
projections (see Figure 4).
lead shoulder intrusions and protrusions — any
variations in straightness along the defined shoulder
essentially caused by dambar removal (see Figure 4).
lead position overlay (footprint) — (See Figure 5.)
shoulder bend location — measured from the outermost
point of the shoulder bend radius (see Figure 6).
lead co-planarity — defined as the vertical lead
position with respect to a reference plane measured
after forming. The reference plane is defined by the
three lowest leads from the bottom of the package (see
Figure 6).
4 Ordering Information
4.1 Purchase orders for tooling for plastic molded high
density TAB semiconductor packages furnished to this
specification shall include the following items:
1. A package tooling outline drawing showing all
required dimensions listed in Section 5. Package
surface finish to be included.
2. A list of any tolerance limits which differ from
those in Section 6.
3. The type of tooling steel required.
4. The type of leadframe material and temper to be
used.
5. The type of plastic to be molded (if proprietary, a
statement of its shrinkage characteristics) and
molding temperature.
6. Sampling plan shall be determined between vendor
and purchaser.
7. The number of spare parts or expendable parts
desired.