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SEMI E49.7-0304 © SEMI 1995, 2004 2 3.3 System design issues outside t hose that directly impact liquid purity or qu ality are not within the scope of this document’s recommendations and are left to the individual sy ste…

SEMI E49.7-0304 © SEMI 1995, 2004 1

SEMI E49.7-0304

PURITY GUIDE FOR THE DESIGN AND MANUFACTURE OF

ULTRAPURE WATER AND LIQUID CHEMICAL SYSTEMS IN

SEMICONDUCTOR PROCESS EQUIPMENT

This guide was technically approved by the Global Liquid Chemicals Committee and is the direct

responsibility of the North American Liquid Chemicals Committee. Current edition approved by the North

American Regional Standards Committee on December 4, 2003. Initially available at www.semi.org

February 2004 to be published March 2004. Originally published 1995, last published July 2002.

This standard was editorially modified in January 2004 to correct a typographical error. A change was made

to Section 10.5.4.

1 Purpose

1.1 The objective of this document is to provide

recommendations that will help maintain the quality of

the liquid being delivered. Recommendations are given

for activities specific to polymer ultrapure water and

liquid chemical systems used in Semiconductor process

equipment.

NOTE 1: As with any SEMI guide, the practices outlined

herein are recommendations, not specifications. Users of this

document should recognize that alternate practices are not

excluded as long as they produce results that are equivalent to

those produced using the recommendations outlined here and

meet the requirements of the end user.

2 Scope

2.1 It is within the scope of this standard to recommend

procedures that complement the requirements in SEMI

F57 with the goal of ensuring the quality of the liquid

being delivered. Recommendations are provided in the

following areas:

• Manufacturing Facility

• Utilities

• System Design

• Pre-Production and Inspection

• Assembly

• System Testing

• Packaging

• Traceability

2.2 For the purposes of this document, systems include

all liquid delivery components inside semiconductor

process equipment and ancillary support equipment, as

well as additional plumbing provided by the OEM with

the processing equipment. This includes any assembly

of two or more liquid delivery components provided

with or within semiconductor process equipment.

2.3 Typical semiconductor process equipment with

ultrapure water and liquid chemical delivery systems

includes, but is not limited to the following:

• Wafer Handling Equip.

• Wafer Cleaning Systems

• Chemical Filtration/Mixing Skids provided by

OEM

• Wet Clean Stations

• Wafer Scrubbers

• CMP

• Photolithography coaters and developers

• Ion Implanters

• Metrology equipment

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This standard does not define the performance

requirements of components, which may be addressed

by SEMI F57. Nor does this standard define the

performance requirements of equipment systems.

Facility distribution systems are also outside the scope

of this standard.

3.2 Organic liquids, such as isopropyl alcohol and

methyl alcohol, are typically in contact with stainless

steel or other non-polymeric components. The polymer

systems described within this document are NOT

intended for use with such organic liquids. Refer to

SEMI E49.4, SEMI E49.5, and SEMI E49.6 for

information on stainless steel components.

SEMI E49.7-0304 © SEMI 1995, 2004 2

3.3 System design issues outside those that directly

impact liquid purity or quality are not within the scope

of this document’s recommendations and are left to the

individual system designers.

3.4 Polymer systems described within this document

are intended for use in ultrapure water and liquid

chemical delivery only. Their performance

requirements may exceed the needs of systems used in

drainage and other lesser quality liquids.

4 Referenced Standards

4.1 SEMI Standards

SEMI C3.28  Standard for Nitrogen (N2), VLSI

Grade in Cylinders, 99.9996% Quality

SEMI C41  Specifications and Guidelines for 2-

Propanol

SEMI E49  Guide for Standard Performance,

Practices, and Sub-Assembly for High Purity Piping

Systems and Final Assembly for Semiconductor

Manufacturing Equipment

SEMI E49.4  Guide for High Purity Solvent

Distribution Systems in Semiconductor Manufacturing

Equipment

SEMI E49.5  Guide for Ultrahigh Purity Solvent

Distribution Systems in Semiconductor Manufacturing

Equipment

SEMI E49.6  Guide for Subsystem Assembly and

Testing Procedures – Stainless Steel Systems

SEMI F34  Guide for Liquid Chemical Pipe Labeling

SEMI F57  Provisional Specification for Polymer

Components Used in Ultrapure Water and Liquid

Chemical Distribution Systems

SEMI F61  Guide for Ultrapure Water System Used

in Semiconductor Processing

4.2 Federal Standard (FED-STD)

Fed Stand 209E — Airborne Particulate Cleanliness

Classes in Cleanrooms and Clean Zones

1 Available from General Service Administration, Federal Supply

Service Bureau, Specification Section, Suite 8167, 470 East L' Enfant

Place SW, Washington, D.C. 20407.

4.3 ISO Document

ISO 14644  Cleanrooms and Associated Controlled

Environments – Part 1 Classification of Air Cleanliness

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 See Section 4 of SEMI E49.

6 Manufacturing Facility Recommendations

6.1 Cleanroom Class designations as used within this

document are defined within Federal Standard 209E

Airborne Particulate Cleanliness Classes in Clean

rooms and Clean Zones. (ISO standard 14644-1

classifications are listed parenthetically.)

6.2 Materials Storage Area  The storage area for

components and assemblies should be a dedicated

enclosed area, protected from the elements and

separated from other materials. Only components and

assemblies that have passed inspection, and are clean

and packaged should be placed in the storage area.

6.3 Gowning Area  Gowning area should be Class

10,000 (ISO Class 7) or better. All personnel working

in cleanrooms should follow appropriate gowning

protocol such as: wear booties prior to entering the

gowning area; and wear gowns, hood, boots, gloves,

and safety glasses before entering clean areas.

6.4 Staging Area  Staging Area should be Class

10,000 (ISO Class 7) or better. The staging area (if

used) should be located immediately outside the

assembly cleanroom, with appropriate access to the

assembly cleanroom.

6.5 Assembly Areas  All production operations such

as cutting, welding, cleaning, assembly, final

integration, final test, and packaging (if applicable)

should be performed in a class 10,000 (ISO Class 7)

cleanroom or better.

7 Utility Recommendations

7.1 Nitrogen (Uses include leak testing of non-brittle

materials, drying, and purging.)

• Nitrogen quality should meet requirements of

SEMI C3.28.

• Particle filtration should be 99.99999% removal of

0.003 micron particles.

2 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,

Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30

Website: www.iso.ch

SEMI E49.7-0304 © SEMI 1995, 2004 3

NOTE 2: Use 316L electropolished tubing or PFA tubing for

purge piping. (Use tubing that does not degrade N

7.2 Ultrapure Water (Uses include cleaning and

rinsing.)

• Resistivity ≥ 18 mega ohm-cm @ 25° C (77° F)

• TOC — < 20 ppb

• Silica — < 5 ppb

• Particles — < 1 particle/milliliter @ 0.1 µ m size

• Bacteria — < 10 colonies/100 milliliter

• Hot Ultrapure Water Temperature — 80° C

(176° F), minimum

NOTE 3: If testing requirements dictate, access to higher

quality ultrapure water may be appropriate in portions of the

facility. Additional information related to ultrapure water

facility design and terminology may be obtained in SEMI

F61.

7.3 2-Propanol/IPA (Uses include cleaning.)

• 2-Propanol/IPA quality should meet requirements

of SEMI C41, Grade 1

7.4 Clean Dry Air (CDA) or Oil Free Air (Uses include

pneumatic control and air actuation.)

7.4.1 CDA is not recommended for use on cleaned

wetted surfaces. Nitrogen is recommended for drying

cleaned wetted surfaces because the purity level is

clearly defined and controlled.

8 System Design Recommendations

8.1 General Recommendations — The intent of this

section is to recommend design practices that ensure the

quality of the liquid being delivered. These

recommendations should be considered along with

design constraints such as minimizing liquid

consumption, cost, ensuring maintainability, and

limiting complexity. In addition, the appropriateness

and simplicity of the facility interface should be

considered.

8.2 Component Recommendations — Components

should limit system exposure to ionic, metallic, total

organic carbon, and particle contamination.

8.2.1 All applicable components should comply with

SEMI F57.

8.2.2 For components not addressed in SEMI F57, a

discussion of recommended materials (similar to that

found in SEMI F57) may benefit the reader and is

therefore provided.

8.2.2.1 Care should be taken to ensure that the

materials are compatible with the liquid streams for

long term applications. Additionally, it is important

that the materials used be compatible with the

application temperature and/or sanitization methods

such as ozone, UV light and/or hydrogen peroxide.

8.2.2.2 These recommendations often imply the use of

existing materials of choice, such as high purity grades

of perfluoroalkoxy (PFA), polytetrafluoroethylene

(PTFE), and polyvinylidene fluoride (PVDF).

However, unique design specifications or new materials

may result in instances where significant efficiencies

may be achieved while maintaining substantially

equivalent performance. These scenarios could result

in the use of new or existing materials such as

ethylenechlorotrifluoroethylene (ECTFE), polyether-

etherketone (PEEK), polypropylene (PP), acetal resin

(such as Delrin®™

, Celcon®™

and others),

polyvinyl chloride (PVC), perfluoromethylether-based

perfluoroalkoxy (MFA), etc.

8.2.2.3 Due to purity and traceability issues,

reprocessed or regrind material is not recommended.

8.3 Joining Recommendations — Joining technology

that is free of dead space and entrapment areas is

recommended to reduce negative effects such as

microbial proliferation and impacts to slurry particle

size distribution. For this reason pipe thread

connections are not recommended.

8.3.1 Tubing should be joined with flare fittings, or

similar dead space free technology. Preparation and

joining of fittings should be performed in accordance

with component manufacturer recommendations.

8.3.1.1 Care should be taken to ensure that dissimilar

flare fittings are not joined together. When possible,

one style of fitting should be used throughout the

system. Manufacturers should be consulted prior to

using similar style fittings from different manufacturers

interchangeably.

8.3.2 Pipe should be joined with welds that minimize

dead space and entrapment areas. Preparation and

welding should be performed in accordance with

component manufacturer’s recommendations.

NOTE 4: Users of this guideline are cautioned that suitable

welding methods, such as thermal butt welding, may be

covered by patents or other intellectual property.

8.3.2.1 Glue, solvent, or thermal socket welding of

pipe is not recommended.

8.4 System Volume Recommendations — When

possible, dead volumes should be eliminated and

overall system volume should be minimized to reduce

negative effects on purity as well as flush times.

3 Delrin is a trademark of DuPont; Celcon is a trademark of Hoechst

Celanese.