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SEMI P9-0298 © SE MI 1988, 1998 3 Table 3 Sust aining Test s — Imaging Characte ristic Measur ed Property Varia ble Fixed Conditi ons Test Me thods Focus Resolution Focus Substrate Expos ure energy Film thickness Exposur…

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SEMI P2-0298 © SEMI 1988, 1998 2
Table 1 Sustaining Tests — Resist Coating
Characteristic Measured Property Variable Fixed Conditions Test Methods
Thickness curve Film thickness Spin speed Viscosity/Solids ASTM F 804
Substrate
Measurement method
Softbake
Coating program
Acceleration
Dispense volume
Exhaust rate
Environment
Film uniformity Film thickness Across As above
Wafer to wafer
Striations Fringes As above
Film thickness variation Before and after developing
Cleanliness Particles In/On coating Filtration ASTM F 863
On substrate after removal Housekeeping
External sources
Defect size
Test method
Film integrity Pin holes Film thickness As above ASTM F 890
Table 2 Sustaining Tests — Characteristic Information
Characteristic Measured Property Variable Fixed Conditions Test Methods
Threshold energy Film thickness Exposure energy Measurement method
Calculation method
Exposure conditions
Developer type
Developer normality
Development time
Rinse type(s)
Agitation/Spray
Softbake
Environment
Development rate Film thickness Exposure energy As above
Development time
Contrast Film thickness Exposure energy As above ASTM F 1059
Film thickness
Resist loss Film thickness Development conditions As above
Scum Resist residue Environment As above
SEMI P9-0298 © SEMI 1988, 19983
Table 3 Sustaining Tests — Imaging
Characteristic Measured Property Variable Fixed Conditions Test Methods
Focus Resolution Focus Substrate
Exposure energy Film thickness
Exposure method
Exposure conditions
Measurement method
Developer type
Developer normality
Development time
Development method
Rinse type(s)
Agitation/Spray
Development time
Softbake
Environment
Exposure requirements Line width Exposure energy As above ASTM F 527
Image size ASTM F 528
Table 4 Extended Testing — Resist Coating
Characteristic Measured Property Variable Fixed Conditions Test Methods
Planarization Film thickness variation Film thickness Coating method
Topography Spin speed
Softbake
Environment
Orientation of topography
Table 5 Extended Testing — Imaging
Characteristic Measured Property Variable Fixed Conditions Test Methods
Focus latitude Line width Exposure energy Substrate
Film thickness variation Focus Film thickness
Resolution Exposure method
Exposure conditions
Line width
Developer type
Developer normality
Development time
Development method
Rinse type(s)
Agitation/Spray
Softbake
Environment
Exposure latitude As above Exposure energy As above
Development latitude As above Development normality Line width
Contrast Development time Exposure conditions ASTM F 1059
Threshold energy Development temperature Developer type
Exposure energy Development method
SEMI P2-0298 © SEMI 1988, 1998 4
Characteristic Measured Property Variable Fixed Conditions Test Methods
Rinse type(s)
Agitation/Spray
Softbake
Environment
Rinse latitude As above Composition As above
Developer overlap
Rinse time
Softbake latitude As above Softbake time Line width
Softbake temperature Exposure energy
Exposure conditions
Exposure energy Film thickness
Ramp rate
Development conditions
Environment
Thickness latitude As above Film thickness As above
Exposed Energy Substrate
Resolution As above Exposure method Substrate
Exposure energy Exposure energy
Film thickness Exposure conditions
Development conditions Measurement method
Softbake conditions Developer type
Development method
Rinse type(s)
Agitation/Spray
Focus
Softbake
Environment
Resist profile Wall angle As above As above
Corner rounding Pre/Post treatment Hardbake conditions
Shape