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SEMI G69-0996 © SEMI 1996, 2004 8 12.2.2 True Adhesive Strength — The true adhesive strength (CKic) ex cludi ng residual stress, is calculated as follows: K ic MPa m K ib1 K ib2 2 where : K ib1 : Apparent adhesive…
7 SEMI G69-0996 © SEMI 1996, 2004
12 Calculation
12.1 Shear and Pull Method
12.1.1 The adhesive strength is calculated as follows:
12.1.1.1 Adhesive Strength (N/mm
2
) = Peak Load (N)/Nominal Adhesive Area (mm
2
)
12.2 Three-Point Bending Method
12.2.1 Apparent Adhesive Strength — Apparent adhesive strength including residual stress, is calculated using the
stress intensity factor K
i
as follows:
K
i
4 10
6
cosh(
)
G
p
1
p
a
1
a
where
G=3
1
t
p
3
p
t
p
3
a
t
p
p
t
a
a
k
P
2
a
2
2b
2
k=4t
p
t
a
p
a
t
p
t
a
2
t
p
2
p
t
a
2
a
2
1
2
ln
p
p
1
a
a
a
1
p
j
3 4
j
(j = p or a)
P : Peak load (N)
a : Pre - crack length (m)
b : Sample width (m)
t
p
: Thickness of molding compound (m)
t
a
: Thickness of leadframe (m)
p
: Young' s modulus of molding compound (Pa)
a
: Young' s modulus of leadframe (Pa)
p
: Shear modulus of molding compound (Pa)
a
: Shear modulus of leadframe (Pa)
p
: Poisson' s ratio of molding compound
a
: Poisson' s ratio of leadframe
SEMI G69-0996 © SEMI 1996, 2004 8
12.2.2 True Adhesive Strength — The true adhesive strength (CKic) excluding residual stress, is calculated as
follows:
K
ic
MPa m
K
ib1
K
ib2
2
where :
K
ib1
: Apparent adhesive strength when testing is performed with molded side up (MPa m
)
K
ib2
: Apparent adhesive strength when testing is performed with leadframe side up (MPa m
)
13 Report
13.1 The following items should be reported:
13.1.1 Leadframe
13.1.1.1 Material Designation
13.1.1.2 Thickness
13.1.1.3 Production Method (etching or stamping)
13.2 Pre-Treatment — In case that surface pre-treatment is necessary, the process and their condition should be
reported as follows:
13.2.1 Pre-treatment by plating
13.2.1.1 Plating type
13.2.1.2 Plating thickness
13.2.2 Post treatment after plating
13.2.2.1 Corrosion prevention treatment
13.2.2.2 Cleaning treatment
13.2.2.3 Coupling material
13.2.3 Pre-treatment by heating
13.2.3.1 Temperature
13.2.3.2 Atmosphere
13.2.3.3 Oven or Hot Plate
13.3 Molding Compound
13.3.1 Material Designation
13.4 Molding Compound Configuration and Dimension
13.5 Molding Condition
13.5.1 Pre-heat condition (Temperature, Time)
13.5.2 Molding condition (Cure temperature, Cure time, Injection speed, Injection pressure)
13.5.3 Post-cure condition (Temperature, Time)
13.5.4 Sample storage conditions
13.6 Measurement Method (Shear, Pull, or Three-point bending method)
13.7 Measurement Equipment
9 SEMI G69-0996 © SEMI 1996, 2004
Adhesive Strength (maximum, minimum, average, and where possible, standard deviation,