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SEMI M31-0705 © SEMI 1998, 2005 20 z 61  15 z 60 = 8 ± 0. 5 y 64 = 4 2.1 ± 0.5 z 62  18 y 62  28 y 65  104 facial datum plan e horizontal datum plane of load por t y 63 = 37.3 ± 0.5  = 30 ± 0.5 ° z 63 = 7.5 ± 0 . 5 …

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SEMI M31-0705 © SEMI 1998, 2005 19
Value Specified Symbol
Used
Figure
Number
Manual Door Auto-Door
Datum Measured from Feature Measured to
z47
#1
8, 9, 11 210 ± 1 mm
(8.27 ± 0.04 in.)
for 13-wafer FOSB
and
330 ± 1 mm
(12.99 ± 0.04 in.)
for 25-wafer FOSB
external horizontal datum
plane
bottom of robotic handling flange
z48
#1
8, 9, 11 15 mm (0.59 in.) minimum
b
ottom of robotic handling
flange
encroachment of FOSB top underneath
robotic handling flange
z49
#1
8, 9, 11 8 mm (0.31 in.) maximum bottom of robotic handling
flange
top of robotic handling flange and
upper door frame volume
z50
#1
11 5 mm (0.20 in.) minimum
b
ottom of robotic handling
flange
encroachment of FOSB top underneath
the center hole in the top robotic
handling flange
z60 14 8.0 ± 0.5 mm
(0.31 ± 0.02 in.)
external horizontal datum
plane
top of slot in center retaining feature
z61 14 15 mm
(0.59 in.) minimum
external horizontal datum
plane
top of chamber above slot in center
retaining feature
z62 14 18 mm
(0.71 in.) minimum
external horizontal datum
plane
top of front retaining feature
z63 14 7.5 ± 0.5 mm
(0.30 ± 0.02 in.)
external horizontal datum
plane
top of ramp on front retaining feature
z65 8, 9 7 mm (0.28 in.) minimum horizontal datum plane upper boundary of cylindrical fork-lift
p
in holes in left and right bottom
conveyor rails
#1
These dimensions are for optional features.
#2
These dimensions pertain to the manual door only.
facial
datum
plane
center
retaining
feature
y
62
28
r
60 =16
±0.5
r
64
9.5
x
64
35
bilateral
datum
plane
x
60
=8.0±0.5
r
61 16
front
retaining
feature
y
64
=42.1
±0.5
y
63
=37.3
±0.5
x
68
25
y
65
104
Figure 13
Bottom View of Retaining Features on Bottom of FOSB
SEMI M31-0705 © SEMI 1998, 2005 20
z
61
15
z
60
= 8 ± 0.5
y
64 = 42.1 ± 0.5
z
62
18
y
62
28
y
65
104
facial
datum plane
horizontal datum plane
of load port
y
63 = 37.3 ± 0.5
= 30
± 0.5°
z
63 = 7.5
± 0.5
r 61
16 (above
z
60)
r 60 = 16 ± 0.5 (below
z
60)
front side of the box
where wafers are accessed
Figure 14
Side View of Retaining Features on Bottom of FOSB
6 Related Documents
6.1 SEMI Standards
SEMI E22.1 — Cluster Tool Module Interface 300 mm: Transport Module End Effector Exclusion Volume
Standard
SEMI E63 — Mechanical Specification for 300 mm Box Opener/Loader to Tool Standard (BOLTS-M) Interface
SEMI M28 — Specification for Developmental 300 mm Diameter Polished Single Crystal Silicon Wafers
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
SEMI M31-0705 © SEMI 1998, 2005 21
APPENDIX 1
APPLICATION NOTES
NOTICE: This appendix is an official part of SEMI M31 and was approved by full letter ballot procedures on
July 15, 1999.
A1-1 Although FOSB parameters supporting effective reuse and cleaning (washing/drying) are not defined in this
document, it is essential that these capabilities be considered for a successful overall shipping box design.
A1-2 It is important to note that shipping boxes containing wafers are typically bagged for shipment to the IC
manufacturer. It is therefore important to design the outer surfaces of the shipping box to be compatible with this
common practice.
A1-3 Information about Automated-shippable Door
A1-3.1 When Automated-shippable door is used, the following contents should be understood for wafer quality.
A1-3.2 Rear of Door (y51): Increasing the value of y51, might have impact to the capability for absorbing drop
shock and wafer rotation during transportation, especially for x-direction since decreasing the area of holding wafer
by front wafer retainer.
A1-4 Items which need to be considered for automated-shippable door closing and opening process:
A1-4.1 When close or open the automated-shippable door by SEMI E62 compliant load port, not only SEMI E62
defined f30 and f34, but also consideration of other factors which may not be defined by SEMI E62, such as speed,
acceleration and deceleration of door closing and opening, are needed.
A1-4.2 Excessive f34 may cause deformation of the box, as well as breakage of wafers which are contained in the
box. Door may be closed with lesser f34 by deploying designs which utilize door and box related forces, such as
latch key torque.
A1-4.3 It needs to be considered that door may rebound at door opening process.
A1-4.4 Retaining features force (f61): It is noted that strong clamping force may produce plastic deformation.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user's attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
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