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SEMI G72.2-099 7 © SEMI 1997 2 Figure 1 388 Pin Plas tic Ball Grid Array 35×35 mm Body De sign

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SEMI G72.2-0997 © SEMI 19971
SEMI G72.2-0997
DESIGN PROPOSAL FOR BALL GRID ARRAY DESIGN LIBRARY:
388 PIN PLASTIC BALL GRID ARRAY
Table 1 Plastic Ball Grid Array (PBGA) General Design Characteristics
Ball Count Signal I/O Body Size Pitch Matrix Array
Thermal
Enhan.
Profile
Height
Cavity
Orient.
Wirebond
Rings
388 304
35×35
1.27
26×26
depopulated
6×6
2.33 up 2
Substrate
Material
Metal
Layers
Die Inter-
connect
Encapsulation
Design / Material
Ball
Composition
JEDEC
Designation
Precondition-
ing Level
Design
No.
SEMI
Designa-
tion No.
BT Laminate 2(2S0P0G) wirebond overmolded epoxy 63/37 Sn/Pb MO-151
BAR-2, B
Level 3,Rev 0 PBD0002 G72.2
SEMI G72.2-0997 © SEMI 1997 2
Figure 1
388 Pin Plastic Ball Grid Array 35×35 mm Body Design
SEMI G72.2-0997 © SEMI 19973
Table 2 388 Pin Plastic Ball Grid Array 35×35 mm Body Design
Design
No.PBD0002 SEMI Standard BGA Design Library Revision Initial
Date
10/22/96
Page
2 of 10
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad (*3) I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
w/b ring 1 A1 3
w/b ring 1 A2 3
304 A3 4
300 A4 4
296 A5 4
293 A6 4
289 A7 4
285 A8 4
283 A9 4
279 A10 4
275 A11 4
272 A12 4
268 A13 4
264 A14 4
260 A15 4
258 A16 4
254 A17 4
251 A18 4
248 A19 4
244 A20 4
242 A21 4
238 A22 4
234 A23 4
231 A24 4
229 A25 4
w/b ring 1 A26 3
1B1 1
w/b ring 1 B2 3
302 B3 4
298 B4 4
295 B5 4
291 B6 4
287 B7 4
284 B8 4
281 B9 4
277 B10 4
273 B11 4
270 B12 4
266 B13 4
262 B14 4
259 B15 4
256 B16 4
252 B17 4