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SEMI E57-0305 © SEMI 1996, 2005 7 R1-2 All of the dimensions for the kinematic coupling pi n surfaces a nd locations are gi ven as ranges so that any roundness, cylindricity, perp e ndicula rity, bendi ng, or misalignm e…
SEMI E57-0305 © SEMI 1996, 2005 6
RELATED INFORMATION 1
APPLICATION NOTES
NOTICE: This related information is not an official part of SEMI E57. This related information was approved for
publication by full letter ballot procedures.
R1-1 The three features on the bottom of the wafer carrier that mate with the six pins underneath are not specified
in this standard. These three features are recommended to be inverted V-shaped grooves, each of which extends
along a line that is perpendicular to, and co-planar with, the nominal wafer center line (as shown in Figure R1-1).
Such grooves are likely to work well even when shrunken or slightly misaligned (such as when they do not all line
up with the nominal wafer center line). Other mating features are also possible, such as those shown in Figure R1-2
where one pin is contacted on the top. Front-opening boxes may need to contact the pins on the side to provide
pressure against a front mechanical interface. Such options are why the top and sides of the pins are toleranced so
tightly. When designing the mating features on the bottom of the wafer carrier, it is suggested that designers follow
the recommendations given in the book (listed in §6) by Dr. Alexander H. Slocum.
Figure R1-1
Recommended Mating Features
Figure R1-2
Alternative Mating Features
SEMI E57-0305 © SEMI 1996, 2005 7
R1-2 All of the dimensions for the kinematic coupling pin surfaces and locations are given as ranges so that any
roundness, cylindricity, perpendicularity, bending, or misalignment of the pins must be contained within the limits
given.
R1-3 As shown in Figure R1-3, these couplings can also be used to support 200 mm pods as an addition to the
requirements given in SEMI E19.4. However, concurrent implementations for both 200 and 300 mm wafer carriers
may be covered by patent claims.
facial
datum
plane
bilateral datum plane
200-mm
wafer
200-mm
SMIF
pod door
Figure R1-3
Application to 200 mm Pods
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E62-0705 © SEMI 1997, 2005 1
SEMI E62-0705
PROVISIONAL SPECIFICATION FOR 300 mm FRONT-OPENING
INTERFACE MECHANICAL STANDARD (FIMS)
This provisional specification was technically approved by the global Physical Interfaces & Carriers
Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on
April 7, 2005. It was available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally
published in 1997; previously published March 2003.
1 Purpose
1.1 This standard specifies the tool side of the interface between a process or metrology tool and a front-opening
box used to transport and store 300 mm wafers (which may or may not be in removable cassettes) in an IC factory.
2 Scope
2.1 This standard is intended to set an appropriate level of specification that places minimal limits on innovation
while ensuring modularity and interchange-ability at all mechanical interfaces. Only the physical interface is
specified; no materials requirements or micro-contamination limits are given. The interface specified in this standard
can be for a sealed mini-environment, but it could also just be a well-defined automation interface.
2.2 This standard is provisional because the front-opening interface is a new technology. Once interface testing is
done, this standard should be modified and upgraded from provisional status.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish appropriate safety and health practices and determine the
applicability of regulatory or other limitations prior to use.
3 Referenced Standards and Documents
3.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E47.1 — Provisional Mechanical Specification for Boxes and Pods Used to Transport and Store 300 mm
Wafers
SEMI E57 — Mechanical Specification for Kinematic Couplings Used to Align and Support 300 mm Wafer
Carriers
3.2 ISO Standard
1
ISO 4287 — Geometrical Product Specifications (GPS) — Surface texture: Profile method — Terms, definitions
and surface texture parameters
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI E57).
4.1.2 box — a protective portable container for a cassette and/or substrate(s).
1 International Organization for Standardization, ISO Central Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland.
Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30 Website: www.iso.ch