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SEMI T10-0701 © SEMI 2001 8 which are the incorrect binary value. Divide this number by the total number of pixels within the L finder pattern. 100% pixels of # total pixels incorrect of # Defects F.P. × = (12) 8 Interpr…

SEMI T10-0701 © SEMI 20017

7.5.3 Data Matrix Cell Height

7.5.3.1 Compute the Data Matrix Cell Height

(DMCH) using the distance between P1 and P2,

dist(P1,P2), the distance between P3 and P4,

dist(P3,P4) and the number of rows M as follows:

P4)dist(P3,P2)dist(P1,

DMCH

(6)

Report the Data Matrix Cell Height.

7.6 Data Matrix Mark Misplaceme nt

7.6.1 Data Matrix Mark Misplacement measures the

average misplacement of Data Matrix marks from their

respective ideal Data Matrix Cell Center Points as

defined in Section 7.1.3. The Mark Misplacement is

measured separately in horizontal and vertical

directions relative to the average width of the marks in

the respective direction.

7.6.2

Using the mark cell horizontal and vertical edge

locations, as determined in Section 7.4.2, compute the

image coordinate of the midpoint between the edges of

each mark in the corresponding horizontal and vertical

directions. In the horizontal direction, for each mark

calculate its misplacement MH

as the distance between

the detected midpoint and its ideal cell center point. In

the vertical direction, for each mark calculate its

misplacement MV

as the distance between the detected

midpoint and its ideal cell center point.

7.6.3

Horizontal Mark Misplacemen t

7.6.3.1 In the horizontal direction, for a given number

of columns N, and the Data Matrix Cell Width

(DMCW) as computed in Section 7.5.2, compute the

Horizontal Mark Misplacement (HMM)as follows:

100%

DMCWn

HMM ×

= (7)

where n = N/2 if N is even or n = N/2+1 if N is odd.

Report the Horizontal Mark Misplacement.

7.6.4

Vertical Mark Misplacement

7.6.4.1 In the vertical direction, for a g iven number of

rows M, and the Data Matrix Cell Height (DMCH) as

computed in Section 7.5.3, compute the Vertical Mark

Misplacement (VMM) as follows:

100%

DMCHm

VMM ×

= (8)

where m = M/2 if M is even and m = M/2+1 if M is

odd. Report the Vertical Mark Misplacement.

7.7 Unused Error Correction

7.7.1 The error correction capacity of Reed-Solomon

decoding is expressed in the equation:

pdte −≤+ 2

where: (9)

e is the number of erasures,

t is the number of errors,

d is the number of error correction codewords,

p is the number of codewords reserved for

error detection.

7.7.2 Values for d and p are defined by the AIMI

Symbology Specification (often depending on symbol

size), while e and t are determined during a successful

decode. Compute the Unused Error Correction as

follows:

()

100%

2te

1.0UEC ×

−

−=

(10)

Report the Unused Error Correction value.

7.7.3

In symbols with more than one (e.g. interleaved)

Reed-Solomon block, calculate the Unused Error

Correction for each block independently and report the

value for each block.

7.8

Cell Defects and Finder Patter n Defects

7.8.1 If the error correction capacity of the Data

Matrix symbol is not exceeded then the Cell Defect

measurement can be made. Because the Data Matrix

symbol has been decoded, the correct binary value of

each cell is known.

7.8.2

Based upon the Data Matrix Grid as defined in

Section 7.1.2 (Figure 4), and the total matrix size,

identify the number and location of all pixels which fall

within the bounds of the Data Matrix Grid. Based upon

the reflectance threshold determined by the Symbol

Contrast measurement, assign a binary value to each

pixel within the Data Matrix Grid. Accumulate the

total number of identified image pixels, which are the

incorrect binary value. Divide this number by the total

number of pixels within the Data Matrix Grid.

100%

pixelsof#total

pixelsincorrectof#

DefectsCell ×= (11)

7.8.3 Finder pattern quality can be c alculated in a

similar manner. Based on the Data Matrix Grid as

defined in Section 7.1.2 (Figure 4), determine the

number and location of image pixels which fall within

the bounds of the L finder pattern of the Data Matrix

Grid. Using the reflectance threshold determined by

the Symbol Contrast measurement, assign a binary

value to each pixel within the L finder pattern.

Accumulate the total number of identified image pixels,

SEMI T10-0701 © SEMI 2001 8

which are the incorrect binary value. Divide this

number by the total number of pixels within the L

finder pattern.

100%

pixelsof#total

pixelsincorrectof#

DefectsF.P. ×= (12)

8 Interpretation of Results

8.1 Result Significance

8.1.1 The significance of the assessment results will

depend on the mark/reader application. Open system

applications in which multiple marker and reader

systems of various types at multiple sites are used will

require stricter adherence to desired mark assessment

results. If the mark is intended to survive subsequent

processing steps after marking which will affect mark

characteristics, then reassessment may be necessary to

ensure continued readability.

9 Reporting Results

9.1 Assessment Results

9.1.1 The results of each assessment shall be reported

and listed individually.

9.2 Additional Information

9.2.1 The following items should als o appear in the

report:

• identification of the mark under assessment;

• operator identification;

•

location of where the assessment was done;

• description of specific marking and reading

equipment used.

9.3 Supplemental Information

9.3.1 Supplemental information can be reported

optionally. This information provides further details

about the size, content and color polarity of the Data

Matrix symbol.

9.3.2

Symbol Type indicates the ECC (error

correction) level of the analyzed symbol. See the AIMI

Specification for details on ECC levels other than ECC

200.

9.3.3

Symbol Size indicates the tota l size of the

matrix, including the L and alternating patterns per the

AIMI specification.

9.3.4 Image Polarity can be Dark on Light or Light on

Dark. The first term refers to the polarity of the L, the

second the polarity of the quiet zone.

9.3.5 Encoded Data shows the printa ble encoded

characters only. As many lines as needed will be

included for larger symbols.

9.3.6

Data Codewords and Error Co dewords (ECC

200 only) shows the actual encoding codewords that are

contained in the symbol. Codewords, which contain

errors, may be indicated or highlighted. By referring to

Annex M of the AIMI Specification the exact physical

location of codewords can be determined.

9.3.7

Encodation Scheme (ECC 0 through 140 only)

reports the “Base” number, which relates to the density

or efficiency with which the data has been encoded in

the symbol. For more detailed information refer to

Section 5 of the AIMI Specification.

10 Precision and Accuracy

10.1 Pixel Resolution

10.1.1 The pixel resolution shall be sp ecified for all

assessments. This value determines the precision,

accuracy and repeatability of each resulting

measurement.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standard set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user's attention is called to the possibility that

compliance with this standard may require the use of

copyrighted material or of an invention covered by

patent rights. RVSI Acuity CiMatrix has filed a

statement with SEMI asserting that the patented or

copyrighted item can be used by the public for the

purpose of implementing this standard without specific

license and without payment of royalty or other charge.

Attention is also drawn to the possibility that some

elements of this standard may be subject to patented

technology or copyrighted items other than those

identified above. Semiconductor Equipment and

Materials International (SEMI) shall not be held

responsible for identifying any or all such patented

technology or copyrighted items. By publication of this

standard, SEMI takes no position respecting the validity

of any patent rights or copyrights asserted in connection

with any item mentioned in this standard. Users of this

standard are expressly advised that determination of

any such patent rights or copyrights and the risk of

infringement of such rights are entirely their own

responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI T11-0703

SPECIFICATION FOR MARKING OF HARD SURFACE RETICLE

SUBSTRATES

This specification was technically approved by the Global Traceability Committee and is the direct

responsibility of the North American Traceability Committee. Current edition approved by the North

American Regional Standards Committee on April 11, 2003. Initially available at www.semi.org June 2003;

to be published July 2003. Orignally published November 2002.

1 Purpose

1.1 This specification provides a symbology for

marking hard surface reticle substrates within the edge

exclusion area of the substrate.

2 Scope

2.1 This specification defines the geometric and spatial

relationships and content (including error checking and

correcting code) of square two-dimensional, machine-

readable, Data Matrix symbols for pattern-surface

marking of resist-coated 6 inch reticle substrates that

comply with the specifications of SEMI P1.

2.1.1 This specification addresses only the Data Matrix

field characteristics and location. This Data Matrix

field may contain the information previously contained

in various bar code symbols on 6 inch reticles. The

format of such information is not detailed in this

specification.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This specification does not cover any other code

fields on the reticle. These might be stepper-specific or

user-specific or both. The location, symbology and

content of these other fields, if they exist, are

determined between reticle supplier and user.

NOTE 1: Data Matrix symbology is applicable to a broad

range of semiconductor products including virgin wafers,

processed and patterned FPD substrates, lead frames and

reticles. The format and algorithms of this code are based on

two-dimensional symbology specified in ISO/IEC 16022 —

International Symbology Specification – Data Matrix.

3.2 Although this specification does not specify the

marking techniques to be employed when complying

with its requirements, it is assumed that the symbol will

be obtained by exposure of individual dots in a resist

coating with an e-beam, laser or other pattern-

generation tool.

NOTE 2: An experiment executed by International Sematech

found such e-beam marks to be suitable for the application.

4 Referenced Standards

4.1 SEMI Standard

SEMI P1 — Specification for Hard Surface Photomask

Substrates

4.2 ANSI Standard

ANSI MH10.8.2 — Data Application Identifier

Standard

4.3 ISO/IEC Standard

ISO/IEC 16022 — International Symbology

Specification – Data Matrix

4.4 Uniform Code Council Standard

Manufacturer Identification Codes

NOTICE: As listed or revised, all documents cited

shall be the latest publications of adopted standards.

5 Terminology

5.1 Terms relating to the data matrix code symbol

characteristics are defined in ISO/IEC 16022.

5.2 Definitions of terms relating to the marking area

are as follows:

5.3 Definitions

5.3.1 mark area — a rectangular area containing the

mark field(s) and the surrounding quiet zone.

5.3.2 mark field — an area within which all mark

elements occur.

1 American National Standards Institute, New York Office: 11 West

42nd Street, New York, NY 10036, USA. Telephone: 212.642.4900;

Fax: 212.398.0023 Website: www.ansi.org

2 International Organization for Standardization, ISO Central

Secretariat, 1, rue de Varembe, Case postale 56, CH-1211 Genava 20,

Switzerland. Telephone: 41.222.749.01.11; Fax: 41.22.733.34.30

Website: www.iso.ch

3 Uniform Code Council, 8163 Old Yankee Road, Dayton, Ohio

45458 Website: www.uc-council.org