semi合集-English.pdf - 第5028页

SEMI M18-0704 © SEMI 1990, 2004 14 13.3 Large Point Defects 4 [ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ]; [ ]Other: 100138 Method [ ] SEMI MF523 [ ] ASTM F815 [ ] DIN 50446 [ ] Other: 13.4 Total Points Defects 4 [ ]SEMI M…

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SEMI M18-0704 © SEMI 1990, 2004 13
♦
11.7 Thickness Nominal [ ] ± Tolerance [ ]µm 100117
Test Method [ ]SEMI MF95; [ ]SEMI MF110; [ ]FT-IR;
[ ]SEMI MF 672(SRP); [ ]DIN 50436;
[ ]DIN 50437; [ ]Other:_____
♦
11.8 Thickness Variation [ ]Not greater than [ ]%
[ ]SEMI M2; [ ]SEMI M11 Table [ ]
100118
Measurement Position [ ]SEMI M2; [ ]SEMI M11; [ ]Other:______
Calculation [ ]SEMI M2; [ ]SEMI M11; [ ]Other:______
11.9 Transition Width Not greater than [ ]µm 100119
Measurement Position
Calculation
11.10 Flat Zone Not less than [ ]µm 100120
Measurement Position
Calculation
11.11 Phantom Layer [ ]None 100121
12. MECHANICAL CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
12.01 [ ] Specified According to SEMI M11 Table [ ] 100135
OR SPECIFIED INDIVIDUALLY
12.1 Bow Not greater than [ ] µm 100122
Method [ ]SEMI MF534; [ ]JIS H 611; [ ]Other:_____
12.2 Warp Not greater than [ ] µm
Method [ ] SEMI MF657; [ ] SEMI MF1390;
[ ]Other:______
100123
100124
SEMI
MF657
SEMI
MF1390
12.3 Sori Not greater than [ ] µm 100125
12.4 Flatness/Global Acronym
2
: [ ][ ][ ][ ] Value _____µm 100126
Method [ ]SEMI MF1530 [ ]DIN 50441/3 [ ]Other
12.5 Flatness/Site Acronym
2
:[ ][ ][ ][ ]
Value ____µm
Site Size __×__ mm
Total Sites __
% Usable Area __
[ ] Include partial sites
[ ] Offset: x = [ ] mm, y = [ ] mm
100127
100128
100129
100130
100131
100132
100134
100161
100222
100223
SF3R
SF3D
SFLR
SFLD
SFQR
SFQD
SBIR
SFSR
SFSD
SBID
12.6 Fixed Quality Area Value: [ ]mm dia 100172
13. FRONT SURFACE VISUAL INSPECTION CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
13.01 [ ] Specified According to [ ]SEMI M2 Table 1 or [ ]SEMI M11 Table [ ] 100135
OR SPECIFIED INDIVIDUALLY
13.1 Stacking Faults
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100136
Method [ ] ASTM F522 [ ] DIN 50446 [ ]Other
13.2 Slip
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100137
Method [ ] ASTM F47 [ ] ASTM F80 [ ] SEMI MF523
[ ]DIN 50446 [ ]Other
SEMI M18-0704 © SEMI 1990, 2004 14
13.3 Large Point Defects
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100138
Method [ ] SEMI MF523 [ ] ASTM F815 [ ] DIN
50446
[ ] Other:
13.4 Total Points Defects
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100139
Method [ ] SEMI MF523 [ ] ASTM F815 [ ] DIN
50446
[ ] Other:
13.5 Scratches
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100140
Method [ ] SEMI MF523 [ ]Other
13.6 Dimples
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100141
Method [ ] SEMI MF523 [ ]Other
13.7 Orange Peel
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100142
Method [ ] SEMI MF523 [ ]Other
13.8 Cracks/Fractures
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100143
Method [ ] SEMI MF523 [ ]Other
13.9 Crow's Feet
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100144
Method [ ] SEMI MF523 [ ]Other
13.10 Edge Chips
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100145
Method [ ] SEMI MF523 [ ]Other
13.11 Edge Crown
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100146
Method [ ] DIN 50446 [ ]Other
13.12 Haze
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100147
Method [ ] SEMI MF523 [ ]Other
13.13 Foreign Matter
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100148
Method [ ] SEMI MF523 [ ]Other
SEMI M18-0704 © SEMI 1990, 2004 15
13.14 Localized Light
Scatterers (LLS)
4
[ ]SEMI M11 Table 1
[ ]Other:
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
100173
100174
100175
100176
100177
100178
100179
100180
100181
100182
100183
100184
100185
100186
100187
100188
100189
100190
100191
100192
100193
≥0.50 µ
≥0.30 µ
≥0.20 µ
≥0.19 µ
≥0.18 µ
≥0.17 µ
≥0.16 µ
≥0.15 µ
≥0.14 µ
≥0.13 µ
≥0.12 µ
≥0.11 µ
≥0.10 µ
≥0.09 µ
≥0.08 µ
≥0.07 µ
≥0.06 µ
≥0.05 µ
≥0.04 µ
≥0.03 µ
≥0.02 µ
Method [ ]SEMI MF523; [ ]SEMI MF1620; [ ]JIS H
614;
[ ]JEIDA 24; [ ]Other:______
13.15 Surface Edge
Exclusion
[ ]2 mm; [ ]3 mm; [ ]4 mm; [ ]5 mm ;
[ ]Other:____
100194
14. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
14.01 [ ] Specified According to SEMI M11 Table [ ] 100195
OR SPECIFIED INDIVIDUALLY
14.1 Contamination
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:_____
100149
14.2 Scratches -- macro [ ]None; [ ]Cum Length =[ ] mm 100196
14.3 Scratches -- micro [ ]None; [ ]Cum Length =[ ] mm 100197
14.4 Localized Light
Scatterers
[ ]SEMI M11 Table [ ]; [ ]Other:_____
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
100198
100199
15. OTHER CHARACTERISTICS
Part 4 Epitaxial Wafer with Buried Layer
CUSTOMER:
P
ART
N
UMBER: REVISION
D
ATE:
TESTING LEVEL EDI Sub
WAFER TEST PIECE
Code Param
REQUIRED
ITEM SPECIFICATION
100% SAMP
LE
100% SAMP
LE
ID ID
16. PHOTOLITHOGRAPHY CHARACTERISTICS
16.1 Mask ID [ ] Number: [ ]; [ ]None 100150