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SEMI E22-0697 © SEMI 1991, 2002 6 Figure R1-1 Vertical Plane Exclusion Zone (Elevation View) (Restricted Case for SE MI Standard Cassette Access) NOTICE: The user’s atten tion is called to the possibility that compliance…
SEMI E22-0697 © SEMI 1991, 2002 5
RELATED INFORMATION 1
NOTE: The material contained in these application notes is not an official part of SEMI E22, and it is not meant to modify or
supersede it in any way. Rather, these notes are provided primarily as a source of information to aid in the application of the
standard. As such, they are to be considered as reference material only. The standard should be referred to in all cases.
R1-1 Wafer Transport
R1-1.1 The standard (see Section 6.1) does not require
that the entire transport module end effector move in a
horizontal attitude while the wafer does have this
requirement. For example, the transport module end
effector may have a component of motion in a plane
other than the horizontal during wafer transport across
the interface plane.
R1-2 Variables — Definitions and Dimensions
R1-2.1 The function of Table 2 (see Section 6.2) is to
list the numerical values for the wafer dependent
variables used in Figures 1 and 2. The values are wafer
size dependent so as not to penalize the design of a
transport module end effector when handling only small
diameter wafers. For example, the physical size of a
transport module end effector for a 100 mm diameter
wafer may be smaller than that for a 200 mm diameter
wafer.
R1-3 Vertical Plane Exclusion Zone
R1-3.1 The development of the numeric values
specified in the standard (see Section 6.5) and given in
Figure 2 are described below.
R1-3.2 The 3 mm height above the wafer transport
plane (defined in SEMI E21) allows for transport
module end effectors which use contraints (e.g., a
cupped device or pins) to ensure the wafer does not
slide. Also, this may be necessary if the wafer is
transported with the circuit side facing down.
R1-3.3 The 7 mm value allows for a 4 mm thickness
below the wafer transport plane to accommodate a
structurally and thermally strong transport module end
effector design.
R1-3.4 The 12.5 mm thickness allows for process or
cassette modules with a minimum slot opening value of
less than 32 mm (see SEMI E21).
R1-3.5 The 200 mm minimum length part of the
exclusion zone allows for a transport module end
effector of limited reach to pass into modules with slot
openings smaller than the minimum value of 32 mm.
R1-3.6 The 23 mm thickness allows for the presence
of a “wrist” joint or for additional rigidity in the
transport module end effector.
R1-3.7 The 120 mm length is specified as a fixed
number to ensure that multiple wafer sizes (and
transport module end effectors) do not necessarily
demand a change in geometry of the receiving module
around the wafer transport position.
R1-3.8 The minimum nominal clearance above and
below the exclusion zone is 1.5 mm on both sides of the
transport module end effector when it passes through
the minimum slot opening. This takes into account the
exclusion zone size due to the vertical travel the
transport module end effector may experience.
R1-3.9 A subset of the vertical plane exclusion zone
(see Figure R1-1) is required by a transport module end
effector which must access wafers directly from SEMI
standard or equivalent cassettes. The vertical plane
exclusion zone described in the standard (see Figure 2)
was not subject to these restrictions since a single
generic transport module end effector design was found
not to be practical.
R1-4 Transport Module End Effector Exclusion
Volume
R1-4.1 This volume as described in Section 6.6 is
intended to be the volume within which the transport
module end effector has complete autonomy. Therefore,
process and cassette modules are not allowed to violate
this volume during wafer transport. This prevents
mechanical interference between the transport module
end effector and the process or cassette module.
SEMI E22-0697 © SEMI 1991, 2002 6
Figure R1-1
Vertical Plane Exclusion Zone (Elevation View)
(Restricted Case for SEMI Standard Cassette Access)
NOTICE: The user’s attention is called to the possibility that compliance with this standard may require use of an
invention covered by patent rights. By publication of this standard, Semiconductor Equipment and Materials
International (SEMI) takes no position respecting the validity of any patent rights asserted in connection with any
item mentioned in this standard. In particular, users of the specification should be aware that Drytek, Inc., A Unit of
General Signal, 16 Jonspin Road, Wilmington, MA 01887-1087, Phone: (508) 657-3933, has neither claimed nor
disclaimed that compliance with this specification would require use of an invention covered by one or more of its
patents. Users of this standard are expressly advised that determination of any such patent rights, and the risk of the
infringement of such rights, are entirely their own responsibility.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E22.1-1296 © SEMI 1992, 2002 1
SEMI E22.1-1296 (Reapproved 1102)
CLUSTER TOOL MODULE INTERFACE 300 mm: TRANSPORT
MODULE END EFFECTOR EXCLUSION VOLUME STANDARD
This standard was technically reapproved by the Global Physical Interfaces & Carriers Committee and is the
direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition
reapproved by the North American Regional Standards Committee on July 21, 2002. Initially available at
www.semi.org October 2002; to be published November 2002. Originally published in 1992; previously
published December 1996.
1 Introduction
1.1 The standard provides the requirements to change
the limits of applicability of SEMI E22 from 100 mm to
200 mm diameter wafers to 300 mm diameter wafers.
2 Referenced Standards
2.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E22 — Cluster Tool Module Interface: Transport
Module End Effector Exclusion Volume Standard
3 Requirements
3.1 Wafer Transport Plane Exclusion Zone — All
fixed dimensions remain the same as for SEMI E22
with the following exception. The 25 mm and 10 mm
dimenions for the rectangular space excluded from the
front of the Paddle Exclusion Zone are expanded and
defined by Variables I and H respectively. These
variables are shown in Figure 1. Variables for 250 mm
and 300 mm diameter wafers are specified in Table 1.
Table 1 Wafer Transport Plane Exclusion Zone
Dimensions for 250 mm and 300 mm Diameter
Wafers
Wafer Size
Vbl
250 mm (10 in. nom.) 300 mm (12 in. nom.)
A 270 mm (10.63 in.) 320 mm (12.60 in.)
B 215 mm (8.46 in.) 250 mm (9.84 in.)
C 130 mm (5.12 in.) 225 mm (8.86 in.)
D 122 mm (4.80 in.) 147 mm (5.79 in.)
E 135 mm (5.31 in.) 160 mm (6.30 in.)
F 145 mm (5.71 in.) 170 mm (6.69 in.)
G 122 mm (4.80 in.) 147 mm (5.79 in.)
H 75 mm (2.95 in.) 154 mm (6.06 in.)
I 117 mm (4.61 in.)
F
G I
Wafer
Transport
Position
Wafer
Transport
A
xis
Fork Exclusion Zone
Paddle Exclusion Zone
Pedestal or Pin
Exclusion Zone
C
H
B
A
Transport
Module
D
E
10 (0.39)
Figure 1
New Wafer Transport Plane Exclusion Zone Dimensions