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SEMI M52-0703 © SEMI 2002, 2003 7 Item Recommended S pecification Comment References 1.11 Cassette Filling Modes random access and loading, programmable empty slot filling 1.12 Automatic Wafer ID reading user specific 1.…

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SEMI M52-0703 © SEMI 2002, 2003 6
6.4.7 In this guide, a hierarchy of variability levels is used to describe the performance of measurement equipment
that is calibrated and adjusted/aligned according to the supplier's procedures. The various terms are defined in
Section 5. These variability levels are consistent with terms defined in SEMI E89 but not fully interchangeable.
Their relation is indicated in parentheses.
6.4.7.1 Level 1 variability: standard deviation σ
1
(SEMI E89 static repeatability)
6.4.7.2 Level 2 variability: standard deviation σ
2
(SEMI E89 dynamic repeatability)
6.4.7.3 Level 3 variability: standard deviation σ
3
(SEMI E89 reproducibility)
6.4.7.4 In addition two levels of systematic off-set between different tools are defined:
6.4.7.5 Matching tolerance (difference of means ∆
m
)
6.4.7.6 Correlation (regression curve)
6.4.8 Explicitly specified in the present guide is mainly level 3 variability and matching tolerance.
6.4.9 For SSIS, downward compatibility is subject to limitations imposed by changes in geometry and number of
detectors.
6.4.10 For sizing calibration, deposition CRMs are available from a variety of sources. On the other hand, a
reference standard for the defect coordinate performance is not available.
7 Related Documents
7.1 Glossary of Terms Related to Particle Counting and Surface Microroughness of Silicon Wafers,
SEMATECH
Technology Transfer 95082941A-TR
8
7.2 International Technology Roadmap for Semiconductors: 1999 edition
1
Table 1 Generic Equipment Characteristics
Item Recommended Specification Comment References
1 WAFER HANDLING
1.1 Robot End-Effector
optional wafer edge or backside contact edge as defined by
SEMI M1
1.2 Scan Stage
optional wafer edge or backside contact edge as defined by
SEMI M1
1.3 Wafer Contact Materials
contact materials to leave metals and
organics on wafers less than as defined
in ITRS 99.
1.4 Wafer Detection
protection of accidental contact due to
e.g. cross-slotting double slotting, etc.
1.5 Wafer Rotational Alignment
random in, aligned out
1.6 Number of Cassette Stations
2-4, arbitrary sender/receiver
assignment
1.7 Type of Cassettes
open, FOUP/SMIF, FOSB to be specified
alternatively
SEMI E1.9, SEMI E19,
SEMI E47, SEMI
E47.1, SEMI M31
1.8 Cassette Loading
manual/guided vehicle, conveyor belt
1.9 Automatic Cassette ID
user specific
1.10 Wafer Seating
vertical or off-horizontal during setting
cassette on station
by operator
8 International SEMATECH, 2706 Montopolis Drive, Austin, TX 78741-6499, USA Website: www.sematech.org
SEMI M52-0703 © SEMI 2002, 2003 7
Item Recommended Specification Comment References
1.11 Cassette Filling Modes
random access and loading,
programmable empty slot filling
1.12 Automatic Wafer ID reading
user specific
1.13 Particulate Contamination
front surface: <0.001 PWP per cm
2
,
>90 nm LSE
back surface: <0.001 PWP per cm
2
>120 nm LSE, 0 PWP >250 nm LSE,
0 scratches >120 nm LSE
verify with mirror
polished wafer
surfaces for front
and backside
excluding
contamination from
cassette
2 RELIABILITY
2.1 E-MTBF
p
>2000 h SEMI E10
2.2 E-MTTR
according to service contract SEMI E10
2.3 Equipment Dependent Uptime
>95 % per year SEMI E10
2.4 Response Time
<1 day
2.5 Statistical Process Control (SPC)
performance
automated
2.6 Statistical Process Control (SPC)
machine parameters
automated
3 PROCEDURAL
3.1 Acceptance Testing
user specific
3.2 Transport and Assembly
user specific
3.3 Quality Assurance
supplier conforming with
ISO 9000/9001
ISO9000/9001
3.4 Warranty
>1 year
3.5 Test certificates
user specific
3.6 Spares Availability
>5 years after notification
from supplier
3.7 Change Control
supplier conforming with
ISO 9000/9001
ISO9000/9001
4 DOCUMENTATION
4.1 Installation
required
4.2 Operation
required
4.3 Service
required
5 COMPUTER, USER INTERFACE, CONNECTIVITY
5.1 Computer Operating System
- Microsoft Windows NT 4.0 or higher,
or Unix
SEMI M52-0703 © SEMI 2002, 2003 8
Item Recommended Specification Comment References
5.2 Display
cleanroom compatible, class 10
(Federal Standard) or class 4 (ISO)
FED-STD 209E
ISO 14644-1
5.3 Keyboard
cleanroom compatible, class 10
(Federal Standard) or class 4 (ISO)
FED-STD 209E
ISO 14644-1
5.4 Pointing Device
cleanroom compatible, class 10
(Federal Standard) or class 4 (ISO)
FED-STD 209E
ISO 14644-1
5.5 Printer
cleanroom compatible, class 10
(Federal Standard) or class 4 (ISO)
FED-STD 209E
ISO 14644-1
5.6 Data Processing
- reprocessing of data
- parallel processing in different modes
during measurement including sorting
- multiprocessing: e.g. recipe editing,
up/downloading during measurements
different modes
refer to data
evaluation
5.7 Data Access
- access to basic measurement results:
- data available at SECS/GEM/HSMS
interface in real time
refers to all
functions as defined
in Table 3
SEMI E5
SEMI E30
SEMI E37
5.8 Data Analysis (Online/Offline )
on-line/off-line
5.9 Recipe Control
- complete recipe generation off-line
without machine specific data
(calibration curves)
- off-line recipe editing
- remote recipe control by host
computer
- recipes are compatible between
different software versions
5.10 Operating Sequence
complete remote control: recipe
download, start, stop, define data
evaluation via SECS/GEM
SEMI E5
SEMI E30
5.11 Data Interfaces
- SECS/
- GEM
- optional additionally a mass data
standard transfer protocol (e.g. FTP)
SEMI E5
SEMI E30
www.w3.org/Protocols/
rfc959
5.12 Material Tracking System Support
required, details user specific
5.13 Output File Format
standardized formats:
- ASCII or XML for measurement
results and optional for raw data
- IEEE for raw data (floating point)
- JPEG (or equivalent) for raw data
(image data)
ISO/IEC 8859,
ISO 8879
ISO/IEC 10646-1
www.w3.org
IEEE 754, IEEE 854
ISO/IEC 10918
5.14 Network Communications
Standards Support
Ethernet, Fast Ethernet IEEE 802 and
subsequent standards
5.15 SECS/GEM (SEMI Equipment
Communication Standard
II/Generic Model for
Communications and Control of
Manufacturing Equipment)
required SEMI E5
SEMI E30