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SEMI G13-88 © SEMI 198 1, 1996 1 SEMI G13-88 STA N DARD TEST METHOD FOR EXP A NSION CH A R ACTERISTICS OF MOLDI NG COMPOUNDS 1 Scope 1.1 This s pecification describes th e procedure for measuring the Coefficient of Therm…

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SEMI G11-88 © SEMI 1981, 19963
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G13-88 © SEMI 1981, 19961
SEMI G13-88
STANDARD TEST METHOD FOR EXPANSION CHARACTERISTICS OF
MOLDING COMPOUNDS
1 Scope
1.1 This specification describes the procedure for
measuring the Coefficient of Thermal Expansion (CTE)
and Glass Transition Temperature (T
g
) of thermosetting
molding compounds.
2 Apparatus
2.1 Mold — Producing 0.1–0.2" c ubes or equivalent
with an aspect ratio of 0.8–1.
2.2 Transfer Press
2.3 Micrometer — (0.0001 accuracy)
2.4 Thermomechanical Analyzer (TMA) (Dupont
Model 943, Perkin-Elmer TMS-1, or equivalent)
2.5 Recorder and Power Supply (Dupont Model
990, Perkin-Elmer UUI, or equivalent)
2.6 Oven — (200° ± 5°C capabilit y)
3 Materials
3.1 Nitrogen (Gas)
3.2 Nitrogen (Liquid)
4 Sampling
4.1 Mold samples according to pro duct specifications.
4.2 Postcure the specimen in acco rdance with the
material specification, and allow two (2) hours for
cooling in a desiccator.
5 Procedure
5.1 Select a sample, making certain that all sides are
flat and smooth. Measure the height of the sample with
a micrometer to the nearest 0.0001 inch.
5.2 Place the sample into the TMA sample holder and
bring the expansion probe down slowly until it just
makes contact with the sample. Place sample on fixture
per Instruction Manual. Add 3.0–5.0 grams to weight
tray. Adjust the Linear Variable Differential
Transformer (LVDT) to bring the recorder pen on scale.
The LVDT is then zeroed with the zero switch.
Readjust LVDT, if necessary, to bring pen on scale.
5.3 In a nitrogen atmosphere, heat the sample at a rate
of 20°C/min. to its post-cure temperature.
5.4 Without changing LVDT or pr obe position, use
liquid nitrogen to cool the sample to a temperature at
least 100°C below the deviation from α
1
.1.
5.5 Heat the sample at a rate of 5°C/min. to at least
200°C.
5.6 Calculate α(CTE), using the formula:
CTE =
DL()DY()
DT
()
L
()
°
°
°
°
°
°
where: L
(T+10°)
=Length at Temperature 10° higher than
temperature at which CTE is being measured. L
(T-
10°)
=Length at Temperature 10° lower than temperature
at which CTE is being measured
Y = Y axis sensitivity in mils./in
.
T = change in temperature (20°C)
L = initial sample height (mils)
K =
LIT CTE
EXP.CTE
for aluminum standard
5.7 Run two (2) samples for each lot and record the
average.
5.8 An aluminum standard should be run to determine
the calibration factor K for the Y (length) axis per 5.4
above, as necessary to insure the accuracy of the
instrument's calibration.
5.9 Temperature readings should b e calibrated
periodically per manual instructions.
6 Report
6.1 Data is to include the orientati on for which the
sample is measured (e.g., perpendicular to flow).
6.2 CTE is reported as a function o f temperature. CTE
is to be reported every 10°C increments.
6.3 Report molding conditions and post-mold cure
conditions.
6.4 Report specimen size.
NOTE: For many materials, the Glass Transition Temperature
(Tg) may be determined by drawing tangents to the curve at
the points of minimum and maximum slope. The point at
which the tangents intersect is the T
g
. The slopes of the lines
are referred to as α 1 (below T
g
) and α2 (above T
g
).
SEMI G13-88 © SEMI 1981, 1996 2
7 References
ASTM D 696
1
— Coefficient of Linear Thermo
Expansion Plastic
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.