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SEMI E137-1104 © SEMI 2004 1 SEMI E137-1104 GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION, UNPACKING, AND RELOCATIO N OF SEMICONDUCTOR MANUFACTURING EQUIPMENT This guide was technically approved by the Global Ga se…
SEMI E136-1104 © SEMI 2004 5
9.3.9 Testing — With the connections made according
to Figure 2, apply main power to the RF generator and
allow 15 minutes for stabilization. The power reading
obtained on the calorimeter will represent the total
power output of the RF generator, including harmonics.
9.3.9.1 Begin RF generator testing at a power level that
represents 10% of the maximum output power of the
RF generator.
9.3.9.2 Repeat the test at RF generator power levels of
40% of maximum, 70% of maximum, and maximum
power.
9.3.9.3 Also, conduct tests corresponding to each range
on the RF generator power output meter.
NOTE 7: Calibrate the calorimeter power meter to the DC
standard at each power level used.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E137-1104 © SEMI 2004 1
SEMI E137-1104
GUIDE FOR FINAL ASSEMBLY, PACKAGING, TRANSPORTATION,
UNPACKING, AND RELOCATION OF SEMICONDUCTOR
MANUFACTURING EQUIPMENT
This guide was technically approved by the Global Gases Committee and is the direct responsibility of the
North American Gases Committee. Current edition approved by the North American Regional Standards
Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published
November 2004.
NOTICE: This standard replaces SEMI E49.1, which has been removed from publication as of the November 2004
(1104) publication cycle.
1 Purpose
1.1 The objective of this document is to establish
standard guidelines for activities specific to the final
assembly, packaging, transportation, unpacking, and
relocation of semiconductor manufacturing equipment
(SME) to the cleanroom manufacturing area.
2 Scope
2.1 This standard has been developed as a guide for
final assembly through relocation of SME, separate
subassemblies, and components from the customer’s
loading dock/receiving area to their cleanroom
manufacturing area for both high and ultrahigh purity
applications.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 Specific guidance associated with environment,
health, and safety (EHS) concerns are not in the scope
of this document.
NOTE 1: The SEMI EHS Technical Committee is working
on a new related safety guideline document that provides EHS
considerations for SME preparation, packaging, shipping, and
handling including the handling of shipping and packaging
materials.
3.2 Process specifications related to wafer particles
and/or quality (e.g., ionic contamination) are not in the
scope of this document. Parameters, such as particles
per wafer pass (PWP), should be in the customer’s
specific equipment process performance specification.
4 Referenced Standards
4.1 SEMI Standards
SEMI C41 — Specifications and Guidelines for 2-
Propanol
SEMI F63 — Guidelines for Ultrapure Water Used in
Semiconductor Processing
4.2 ISO Standard
1
ISO 14644-1 — Cleanrooms and Associated Controlled
Environments, Part 1: Classification of Air Cleanliness
4.3 APA The Engineered Wood Association
2
NOTE 2: The APA Engineered Wood Association was
formerly known as the American Plywood Association.
PS 1 — Voluntary Product Standard for Construction
and Industrial Plywood
4.4 USA Department of Defense (DOD)
3
MIL-D-3464 — Military Specification – Desiccants,
Activated, Bagged, Packaging Use and Static
Dehumidification
MIL-PRF-131 — Performance Specification – Barrier
Materials, Watervaporproof, Greaseproof, Flexible,
Heat-sealable
1 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30,
Website: /www.iso.ch
2 APA-The Engineered Wood Association, 7011 So. 19th, Tacoma,
WA 98466, (253) 565-6600, Fax: (253) 565-7265 Website:
http://www.apawood.org
3 United States of America (USA) Department of Defense (DOD)
ASSIST Quick-Search, Website:
http://www.dodssp.daps.mil/products.htm
SEMI E137-1104 © SEMI 2004 2
4.5 Western Wood Products Association (WWPA)
4
Western Lumber Grading Rules (WLGR)
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 DOD — Department of Defense
5.1.2 EPS — Expanded Polystyrene
5.1.3 IPA — Isopropyl Alcohol (2-propanol)
5.1.4 ISO — International Organization for
Standardization
5.1.5 PO — Purchase Order
5.1.6 PWP — Particles Per Wafer Pass
5.1.7 SEMI — Semiconductor Equipment and
Materials International
5.1.8 SME — Semiconductor Manufacturing
Equipment
5.1.9 UPW — Ultrapure Water
5.1.10 USA — United States of America
5.1.11 WLGR — Western Lumber Grading Rules
5.1.12 WWPA — Western Wood Products Association
6 Cleaning and Wrapping Materials
6.1 For cleaning and triple wrap packaging, the
following materials are recommended:
6.1.1 UPW (reference SEMI F63)
6.1.2 IPA (reference SEMI C41)
6.1.3 Ultralow particle generation, ultralow extractable
ion level, polyester, ISO ST 14644-1 (subsequently
called ISO) Class 5 cleanroom-compatible swabs and
wipes with sealed edges
6.1.4 Ultralow particle generation, hydrocarbon-free,
ultralow extractable ion level, ~150 µm (0.006 in.)
thick, natural polyethylene film
6.1.5 Ultralow particle generation adhesive tape
4 Western Wood Products Association (WWPA), 522 SW Fifth Ave.
Suite 500, Portland, Oregon 97204-2122, Tel: 503-224-3930, Fax:
503-224-3934, Website: http://www.wwpa.org
7 Assembly and Pre-Packaging Procedures
7.1 Pre-Assembly
7.1.1 Machining, sawing, welding, brazing, grinding,
sanding, and other manufacturing operations
incompatible with cleanrooms should be completed
before components are brought into the clean assembly
area.
7.1.2 All SME components should be vacuumed,
blown off with filtered air, and cleaned with a solution
of 10 to 70% IPA diluted in UPW using wipes and
swabs immediately prior to being brought into the clean
assembly area.
7.1.3 Cutting oils, lubricants, and solder flux should be
removed before components are brought into the clean
assembly area.
7.2 Clean Assembly Area
7.2.1 All components of the SME should be assembled
in at least an ISO Class 6 or better (ISO Class 5
preferred) cleanroom.
7.2.2 A set of clean assembly tools should be
maintained in the clean assembly area.
7.2.2.1 If this is not possible, tools should be
vacuumed, blown off with filtered air, and cleaned with
a solution of 10 to 70% IPA diluted in UPW using
wipes and swabs immediately prior to each time they
reenter the clean assembly area.
7.2.2.2 The assembly tools in the clean assembly area
should be cleaned periodically and as needed if they
become contaminated during usage.
7.3 Pre-Packaging
7.3.1 All SME with water (including UPW) or other
liquids should be fully emptied and completely dried
using dry, hydrocarbon-free air or nitrogen.
7.3.1.1 All SME with UPW that comes in direct
contact with the production units (e.g., wafers) should
have lines, baths, tanks, etc. flushed with a bacteria
retardant (e.g., H
2
O
2
solution, iodine/UPW solution)
before emptying them fully.
7.3.2 All utility lines should be capped before and
during shipment.
7.3.3 The SME with vacuum chambers should have
these chambers and vacuum lines sealed and shipped
under vacuum.
7.3.4 The SME should be clearly marked showing
correct lifting points for removal from shipping
container.