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SEMI G72-0997 © SE MI 1997 1 SEMI G72-0997 SPECIFICA TION FOR BALL GRID A RRAY DESIGN LIBRA RY 1 Purpose The purpos e of th is specification is to prom ote i ndu str y use of co mmon BGA des igns that may be distinguishe…

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standard set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials or equipment mentioned

herein. These standards are subject to change without

notice.

By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights

asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised

that determination of any such patent rights or

copyrights, and the risk of infringement of such rights,

are entirely their own responsibility.

SEMI G71-0996 © SEMI 1996, 2004 6

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI G72-0997 © SEMI 19971

SEMI G72-0997

SPECIFICATION FOR BALL GRID ARRAY DESIGN LIBRARY

1 Purpose

The purpose of this specification is to promote industry

use of common BGA designs that may be distinguished

by their form, fit, function, and reliability requirements

and to record designs by category that meet these

requirements.

2 Scope

2.1 This document provides a library of company-

sponsored BGA designs for the purpose of promoting

the use of these common designs and to minimize the

unnecessary proliferation of new designs. New designs

will be added as they become sponsored by and

approved by member companies.

2.2 This library shall include ceramic, plastic, tape,

metal and other (as new categories of designs are

identified and added to this specification) BGA designs

that are fully compliant with existing JEDEC-registered

or standard mechanical outlines. Proposals for new

designs may be balloted in parallel with congruent

JEDEC registrations or standards, but will not be

published in this library until such registration and/or

standard is an approved JEDEC outline.

2.3 Controlling dimensions are metric (Systems

International units).

3 Referenced Documents

3.1 SEMI Documents

SEMI International Standards Compilation of Terms

Regulations Governing SEMI Standards Committees

3.2 ASME

ASME Y14.5M-94 — Dimensioning and Tolerancing

3.3 EIA/JEDEC

EIA JEDEC Publication 95 — Registered and Standard

Outlines for Semiconductor Devices

JEDEC BGA Design Guide 95-1 — Section 14

J-STD-020 —

1 American Society of Mechanical Engineers, 22 Law Drive,

P.O. Box 2900, Fairfield, New Jersey 07007-2900.

2 Electronic Industries Association, Joint Electron Device

Engineering Council, 2500 Wilson Blvd., Arlington, VA 22201,

(703) 907-7560.

JESD 22-A113 — Preconditioning of Plastic Surface

Mount Devices Prior to Reliability Testing

4 Terminology

4.1 ball grid array (BGA) package — A square or

rectangular substrate package with an array of metallic

balls on one surface of the package. The metallic balls

form the electrical and mechanical connection between

the package and the PC board or socket.

4.2 column grid array — Same as ball grid array

except that metallic columns are used in place of the

metallic balls for the electrical and mechanical

interconnection between the package and the PC board.

NOTE 1: In the text of this specification, whenever ball grids

are mentioned, a reference to column grids is also implied.

4.3 wire bond ring — Metalized area in the shape of a

complete or partial ring surrounding the die mounting

area intended for group electrical interconnections.

5 Ordering Information

5.1 Order of Precedence — To avoid conflicts, the

order of precedence when ordering ball grid array

substrates or assembled packages when using BGA

Library Designs from this specification shall be as

follows:

a. Purchase Order

b. Customer BGA Drawing

c. BGA Library Design from this specification

d. Referenced Documents from Section 3.0

e. Other related documents

6 General Design Character istics Listing

Format

6.1 Each design addition to this library shall include a

general design characteristics description which shall be

listed in Appendix 1 of this specification and also be

formatted on top of the title block for each design

drawing.

6.1.1 Description listings in the General Design

Characteristics, Appendix 1 shall be organized into

category sections: Plastic, Ceramic, Tape, Metal, or

Other.

6.1.2 These descriptions shall be listed across a row of

characteristics classification columns and may

determine the uniqueness of each design.

SEMI G72-0997 © SEMI 1997 2

6.2 The characteristics classification columns may be

used in a data base format to sort the design listings

sequentially, top to bottom according to their sequential

listing by column, left to right, in the following order.

These listings and their descriptive designations are as

follows:

6.2.1 Ball Count — List the actual number of balls on

the package.

6.2.2 Signal I/O — List the available balls for

individual signal I/O. This does not include balls that

are interconnected with other balls, bond rings, power

or ground planes or other electrically interconnected

features, such as die attach pads.

6.2.3 Body Size — List ##×## (i.e., 27×27) to

represent JEDEC Publication 95 registration values in

millimeters for “D” & “E” nominal body dimensions.

6.2.4 Pitch — List number representing JEDEC

Publication 95 registration values in millimeters for the

“e” pitch dimension.

6.2.5 Matrix — List ##×## (i.e., 20×20) to represent

JEDEC Publication 95 matrix values determined by the

number of balls on the outside row and column.

6.2.6 Array — List either Full, Staggered, Peripheral,

or Depopulated:

• Full — Completely filled matrix, as defined by the

JEDEC Publication 95 registration and variation

shown for each design.

• Staggered — A full matrix which has been

depopulated by every other ball in each row and

column.

• Peripheral — Balls missing in the center of the

BGA package. Outer rows of the matrix are fully

populated.

• Depopulated — Any variation not described by

full, staggered, or peripheral as described above.

NOTE 2: Any of the above matrix designs may have one ball

missing from its defined matrix description above, for

purposes of package orientation, and still be classified

according to that description.

6.2.7 Thermal Enhancement — List #×# (i.e., 6×6) or

“Cu Slug,” to designate either a specific matrix of balls

for thermal enhancement purposes or copper heat slug

for the same. Other metal slugs may be listed by their

appropriate metal constituent. List “N/A” if the design

has no thermal enhancement.

6.2.8 Profile Height — List the dimension of the

nominal profile height in millimeters.

6.2.9 Package Cavity Orientation — List either up or

down with reference to the board to which the package

design would be surfaced mounted (a cavity facing the

board would be cavity, down).

6.2.10 Wire bond Rings — List the number of wire-

bond rings. If the design has no rings, list “N/A.”

6.2.11 Substrate Materials — Generic description of

the materials the substrate is made from, excepting the

electrical trace and solder mask materials.

6.2.12 Metal Layers — The number of metal

interconnect layers in the BGA substrate. List a(bscpdg)

where:

a= total number of metal layers

b= number of signal layers

s= signal layer designator

c= number of power layers

p= power layer designator

d= number of ground layers

g= ground layer designator

e.g., 4(2slplg) would have 4 total layers made up of 2

signal layers and 1 power and ground layer each.

6.2.13 Die Interconnect — Interconnect method for

electrically connecting the die to the package. Normal

methods include wire bond, flip chip and TAB.

6.2.14 Encapsulation Design — Design description.

Normal categories are over-molded, liquid encapsulant

or lid.

6.2.15 Encapsulation Material — General description

of the material used to mechanically cover or

encapsulate the chip or die. The materials normally

used are epoxy for over-molding or liquid encapsulant

designs, metal, ceramic or laminate for lid designs.

6.2.16 Ball Composition — Description of the

material and composition of the ball. Should include a

percentage of tin/lead or other metals, if solder ball

(i.e., 63/37 Sn/Pb, alloy coated, copper or plastic).

6.2.17 JEDEC Designation — List JEDEC

designation from its Publication 95. This should include

registration or standard number, the specific variation

and revision designations (i.e., MO-151, BAE-1, B)

(this indicates Issue, Revision B).

6.2.18 Preconditioning Level — The specified

JEDEC, J-STD-020 moisture sensitivity performance

level requirement. This should also include a reference

to the revision of the J-STD-020 specification (e.g.,

Level 4, Revision A).

NOTE 3: JEDEC, JESD 22 - A113 specifies the moisture

preconditioning requirement for the moisture test to J-STD-

020.