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SEMI E107-1102 © SEMI 2001, 2002 3 Item Name Data Type Size Description DieCoordinate String 13 The die coordinates’ orig in location and coordinate axis direction for expressing location coordinates within a die. See Fi…

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SEMI E107-1102 © SEMI 2001, 2002 2
5.1.8 electrical failure information — failure
information generated by test equipment; e.g. Bit Map
Data, Bin Data and Analog Data.
5.1.9 error class — specifies the type of electrical
failure configuration in a memory cell group. Bit-fail,
line-fail and block-fail are examples.
5.1.10 fail bit map data — data representing memory
cell electrical failure information according to its
location information, in units of the die or wafer.
5.1.11 inspection information — inspection results for
a wafer, indicating defect location and defect details
obtained as the result of inspection used in wafer
fabrication and the inspection process, such as
appearance inspection, contaminant inspection, etc.
5.1.12 test equipment — equipment which tests the
electrical characteristics and functions of
semiconductor devices.
5.1.13 test program name — name of program used on
test equipment when testing a die electrically.
5.1.14 yield management system (YMS) — a system
that stores visual inspection data of geometrical defects
on wafer and electrical test data of each die. The
system processes those data statistically to discover
correlation between them. Correlation leads to
discovery the cause of failures and understanding of
production situation in order to help improve yield.
Defect data is standardized in SEMI E30.1 (ISEM).
6 Requirements
6.1 Map Data Item — All map data items appear in
map data except those standardized in this document
shall be specified in the common map data item
document, SEMI G81.
6.2 Map Data Format — All map data formats appear
in map data except those standardized in this document
shall be specified in the common map data format
document, SEMI G85.
7 General
7.1 General File Format
NOTE 2: A standard for Data representation is currently
under development.
8 Description
8.1 The fail-bit map data item specifications defined in
this document are shown in Table 2. The columns in
this table are described in the following sections.
8.1.1 Item Name Column — The name by which the
data item is referenced.
8.1.2 Data Type Column — The type of the data as
defined in Table 1.
Table 1 Data Types and Sizes
Type Definition
String A string of ASCII characters from zero to
“Size” characters in length.
Integer A string of numeric characters (0..9) that
represent an integer value.
Float A string representing a floating point
value in exponent format.
8.1.3 Size Column — See SEMI G81.
8.1.4 Description Column — See SEMI G81.
8.1.5 Coordinate System Conventions — See SEMI
G81.
Table 2 Data Items for YMS Link
Item Name Data Type Size Description
Comment String 256 Comment Area.
[Comment] = ‘Engineering Test’
TestProgramName String 256 Name of test program when test equipment obtains test data.
[TestProgramName] = ‘pro123a’
TestEquipmentId String 256 Test equipment identification code.
[TestEquipmentId] = ‘tester1’
SEMI E107-1102 © SEMI 2001, 2002 3
Item Name Data Type Size Description
DieCoordinate String 13 The die coordinates’ origin location and coordinate axis direction for
expressing location coordinates within a die.
See Figure 2 and Table 7.
[DieCoordinate] = ‘TopLeftXY’
[DieCoordinate] = ‘BottomLeftXY’
[DieCoordinate] = ‘TopLeftYX’
[DieCoordinate] = ‘BottomLeftYX’
[DieCoordinate] = ‘TopRightXY’
[DieCoordinate] = ‘BottomRightXY’
[DieCoordinate] = ‘TopRightYX’
[DieCoordinate] = ‘BottomRightYX’
ErrorClassList String --- Error type category list, per error class definition. See Figure 2.
ErrorClassNumber String 3 Error class number from 0 to 255.
ErrorQuality String 16 Describes the quality of the specified [ErrorClassNumber]. This may be
“bit-fail” or “line-fail” or some other value defined by an application.
ErrorDescription String 256 A description of the specified [ErrorClassNumber], e.g. “100MHz”.
FailBitDataTemplate String --- Defines the data items and order for expressing the fail bit error class data
analyzed within a die by die address and coordinate values within the die.
See Figure 2.
Defines the items and order for outputting the following fail bit data. See
Table 3.
FailBitData String --- The list of data expressing the fail bit error class. Data analyzed within a
die in accordance with the fail bit data definition. Expresses it as die
address and coordinates within a die.
See Figure 2.
AnalogDataTemplate String --- Defines analog data items and order. These are measured values such as
voltage, current, etc. on measuring semiconductor device’s electrical
characteristics by the test equipment, setting values which are test
parameters when measuring, and limit values which are decision parameters
if test results are pass or fail.
See Table 4.
Invalid String 14 Defined to indicate invalid data for Analog Data field.
AnalogData String --- List of analog data, per analog data definition. These are the semiconductor
device’s electrical characteristics measured by the test equipment.
ErrorTotal Integer 10 Total number of electrical errors in the tested/analyzed substrate, by error
class type.
TestDie Integer 10 Total number of dies which were tested/analyzed on the substrate.
Table 3 Data Items for FailBitDataTemplate
Item Name Data Type Size Description
Seq Integer 10 Sequential number assigned in ascending order, starting with 1.
XAddress Integer 5 X address of defective die with fail bit data.
YAddress Integer 5 Y address of defective die with fail bit data.
XMin Float 14 X minimum coordinate value of fail bit data’s error range. Unit ‘um’.
XMax Float 14 X maximum coordinate value of fail bit data’s error range. Unit ‘um’.
YMin Float 14 Y minimum coordinate value of fail bit data’s error range. Unit ‘um’.
YMax Float 14 Y maximum coordinate value of fail bit data’s error range. Unit ‘um’.
XCenter Float 14 X-direction center point coordinate value of fail bit data’s error range. Unit ‘um’.
YCenter Float 14 Y-direction center point coordinate value of fail bit data’s error range. Unit ‘um’.
XSize Float 14 X-direction size of fail bit data’s error range. Unit ‘um’.
SEMI E107-1102 © SEMI 2001, 2002 4
Item Name Data Type Size Description
YSize Float 14 Y-direction size of fail bit data’s error range. Unit ‘um’.
Area Float 14 Area of fail bit data’s error range. Unit ‘um’.
DefectCate String 16 Category name of fail bit data.
XMinPhysic Integer 10 X minimum cell physical address of fail bit data’s error range.
XMaxPhysic Integer 10 X maximum cell physical address of fail bit data’s error range.
YMinPhysic Integer 10 Y minimum cell physical address of fail bit data’s error range.
YMaxPhysic Integer 10 Y maximum cell physical address of fail bit data’s error range.
IoNumber Integer 10 Cell logical IO number of fail bit data’s error range.
XMinLogic Integer 10 X minimum cell logical address of fail bit data’s error range.
XMaxLogic Integer 10 X maximum cell logical address of fail bit data’s error range.
YMinLogic Integer 10 Y minimum cell logical address of fail bit data’s error range.
YMaxLogic Integer 10 Y maximum cell logical address of fail bit data’s error range.
Table 4 Data Items for AnalogDataTemplate
Item Name Data Type Size Description
XAddress Integer 5 X address of die with analog data.
YAddress Integer 5 Y address of die with analog data.
TestNumber Integer 7 Test number corresponding to analog data.
Note String 256 Note
Measure Float 14 Analog data measured value.
MeasureUnit String 4 Unit of above. See Tables 5 and 6.
Std Float 14 Standard deviation, etc., for measuring analog data.
Parameter Float 14 Analog data measurement parameter value.
ParameterUnit String 4 Unit of above. See Tables 5 and 6.
UpperLimitData Float 14 Upper limit of first type of parameter for judging analog data.
LowerLimitData Float 14 Lower limit of first type of parameter for judging analog data.
TestResult String 256 Analog data PASS/FAIL or decision result such as category type number, etc.
Table 5 Unit Table
Unit Code Description
s Seconds
Hz Hertz
A Amperes
V Volts
Ohm Ohms
W Watts
F Farad
H Henry
% Percent
dB Decibel
lsb Least Significant Bit
rad Radian
deg Degree
Table 6 Prefix Symbol Table
Prefix Symbol Multiplicative
T 10
12
G 10
9
M 10
6
k 10
3
m 10
-3
u (micro) 10
-6
n 10
-9
p 10
-12
Example:
[MeasureUnit] = ‘V’ or ‘mV’
[ParameterUnit] = ‘A’ or ‘uA’
The units above are a subset of those in Section 9
(“Units of Measure”) of SEMI E5 (SECS-II).