semi合集-English.pdf - 第1568页
SEMI E36.1-0704 © SEMI 2004 5 5.9 Element Name — Component 5.9.1 Element Description — The Component element represents a physical or logi cal part of semiconductor manufacturi n g equi pment. The co ntent of a Component…
SEMI E36.1-0704 © SEMI 2004 4
5.6.2.5 Equipment — Supplier-defined identifier for a specific type of semiconductor manufacturing equipment.
5.7 Element Name — Recipe
5.7.1 Element Description — The Recipe element defines a semiconductor manufacturing equipment recipe or set
of instructions pertaining to the process, test or qualification on the specified semiconductor manufacturing
equipment. The content of the Recipe element is not interpreted.
5.7.2 Metadata — In addition to the metadata available from the E36Item tag, the Recipe element supports the
following additional metadata, all in the e36base namespace:
5.7.2.1 RecipeType
5.7.2.1.1 Process — Use this value if the recipe is for the processing of wafers on the specific semiconductor
manufacturing equipment.
5.7.2.1.2 Test — Use this value if the recipe is for testing to validate an adjustment or functional operation of a
component or semiconductor manufacturing equipment.
5.7.2.1.3 Qualification — Use this value if the recipe is for the qualification of equipment parameters within the
specified range limits on the specified semiconductor manufacturing equipment.
5.8 Element Name — Procedure
5.8.1 Element Description — The Procedure element describes a sequence of equipment related operations,
typically performed by operations or service personnel. The content of a Procedure element is interpreted as
information describing the sequence of operations or instructions represented by the procedure.
5.8.2 Metadata — In addition to the metadata available from the E36Item tag, the Procedure element supports the
following additional metadata, all in the e36base namespace:
5.8.2.1 ProcedureType
5.8.2.1.1 Maintenance — To include procedures but not limited to calibrations, qualifications, retrofits, cleaning,
repair, preventive, corrective, diagnostic, troubleshooting, and software around semiconductor manufacturing
equipment.
5.8.2.1.2 Installation — To include procedures but not limited to, setup, startup, and install around semiconductor
manufacturing equipment.
5.8.2.1.3 Operation — To include procedures around the operation of semiconductor manufacturing equipment.
5.8.2.1.4 ToolRemoval — To include procedures but not limited to, shipping, decontamination, and de-install
around semiconductor manufacturing equipment.
5.8.2.1.5 Safety — To include procedures concerning safety during the handling, assembly, installation, use, and
removal of semiconductor manufacturing equipment.
5.8.2.1.6 Usage — To include procedures of usage of a non-technical nature.
5.8.2.2 ScheduleType — For periodic procedures, describes the frequency pattern exhibited by the procedure. On
specific semiconductor manufacturing equipment, one of:
5.8.2.2.1 Wafer Based.
5.8.2.2.2 CalendarTimeBased.
5.8.2.2.3 ProcessTimeBased.
5.8.2.3 ScheduleUnits — For periodic procedures, describes the nominal frequency for performing the procedure.
5.8.2.3.1 When scheduleType is Wafer Based, this is the number of wafers.
5.8.2.3.2 When scheduleType is CalendarTimeBased, this is the number of elapsed days.
5.8.2.3.3 When scheduleType is ProcessTimeBased, this is the number of elapsed process hours based on the
specific semiconductor manufacturing equipment.
SEMI E36.1-0704 © SEMI 2004 5
5.9 Element Name — Component
5.9.1 Element Description — The Component element represents a physical or logical part of semiconductor
manufacturing equipment. The content of a Component element is not interpreted.
5.9.2 Metadata — In addition to the metadata available from the E36Item tag, the Component element supports the
following additional metadata, all in the e36base namespace:
5.9.2.1 SupplierPartNumber — Contains a supplier-defined part number for an identified system or component on
specific semiconductor manufacturing equipment.
5.9.2.2 OEMPartNumber — Original Equipment Manufacturer Part number system or component on a
semiconductor manufacturing equipment set.
5.9.2.3 PartName — Contains the Supplier designated part name for a system or component on specific
semiconductor manufacturing equipment set.
5.9.2.4 OEMName — Original Equipment Manufacturer Company Name for an identified system or component on
a specific semiconductor manufacturing equipment set.
5.10 Element Name — Narrative
5.10.1 Element Description — The Narrative element represents arbitrary content related to the specific
semiconductor manufacturing equipment. The content of a Narrative element is interpreted as text and graphics.
5.10.2 Metadata — None.
5.11 Element Name — ErrorCode
5.11.1 Element Description — The ErrorCode element represents an equipment-generated error code on a specific
equipment set. The content of an ErrorCode is interpreted as text describing the error code. This text should be
applicable to the context of the end-user.
5.11.2 Metadata — In addition to the metadata available from the E36Item tag, the ErrorCode element supports the
following additional metadata, all in the e36base namespace:
5.11.2.1 ErrorNumber — An alphanumeric string defined by the supplier to identify the error on a specific
semiconductor manufacturing equipment set.
5.12 Element Name — Media
5.12.1 Element Description — The Media element represents a generic linked media resource. The content of a
Media element is not interpreted.
5.12.2 Metadata — In addition to the metadata available from the E36Item tag, the Media element supports the
following additional metadata, all in the e36base namespace:
5.12.2.1 MediaURL — A well-formed URL describing the location of the file containing the media element data.
5.12.2.2 Caption — A short description of the information contained in the media element, suitable for presentation
to the end user.
5.12.2.3 MediaCategory — Captures the basic purpose of the media element.
5.12.2.3.1 ElectricalSchematic — A schematic diagram representing electrical application, theory, and/or process
for the specified semiconductor manufacturing equipment.
5.12.2.3.2 MechanicalDrawing — A drawing or diagram showing the mechanical structure of a part, number of
associated parts, assembly of parts and/or associated parts for the specified semiconductor manufacturing equipment
or represent of this equipment in part or in its entirety.
5.12.2.3.3 PlumbingSchematic — A schematic diagram representing Gas/Pneumatic/Vacuum/Hydraulic
application, theory, and/or process for the specified semiconductor manufacturing equipment.
5.12.2.3.4 FacilityLayout — A diagram noting specific installation requirements (space, electrical, plumbing,
environmental) for the specified semiconductor manufacturing equipment.
SEMI E36.1-0704 © SEMI 2004 6
5.12.2.3.5 EquipmentTemplate — A pre-designed, pre-cut guide to aid in determining space requirements
(footprint) for the specified semiconductor manufacturing equipment.
5.12.2.3.6 PartLocator — Actual assembly or component part location and number for the specified semiconductor
manufacturing equipment.
5.12.2.3.7 FlowChart — Instructional steps included in operations and maintenance or troubleshooting on a specific
semiconductor manufacturing equipment set.
5.12.2.3.8 ProcessChart — Characterization data for the process on a specific semiconductor manufacturing
equipment set.
5.12.2.3.9 Diagram — To include block and engineering diagrams for the specified semiconductor manufacturing
equipment.
5.12.2.3.10 ScreenCapture — Includes the duplication of a displayed computer screen saved to a file.
5.12.2.3.11 Photograph — Includes any image bearing the likeness of an object obtained by photographic capture
of that object.
5.13 Element Name — SafetyItem
5.13.1 Element Description — The SafetyItem element represents an item of safety related information per SEMI
S13-0298, SEMI S2, ANSI Z400.1, ANSI/RIA R15.06, CDRH-21, CE Mark Machinery Directive, EN/IEC 60204,
or NFPA 79-1997. The content of the SafetyItem element is the expression of the information.
5.13.2 Metadata — None.
5.14 Element Name — Company
5.14.1 Element Description — The Company element defines a company, as a legal entity, within the context of the
SEMI E36 specification. The content of a Company element will be interpreted as a description of the referenced
company that manufactures the specific semiconductor manufacturing equipment.
5.14.2 Metadata — In addition to the metadata available from the E36Item tag, the Company element supports the
following additional metadata, all in the e36base namespace:
5.14.2.1 CompanyName — String name of referenced company. (mandatory)
5.14.2.2 CompanyURL — URL to homepage of referenced company. (mandatory)
5.15 Element Name — Publisher
5.15.1 Description — The Publisher element specifies the business unit within a company that represents ownership
of the content for specific semiconductor manufacturing equipment set. The content of a Publisher element can be
interpreted as a description of the referenced business unit.
5.15.2 Metadata — In addition to the metadata available from the E36Item tag, the Publisher element supports the
following additional metadata, all in the e36base namespace:
5.15.2.1 BusinessUnit — Supplier-defined string name of referenced business unit plus referenced company.
5.15.2.2 BusinessUnitURL — URL to homepage of appropriate business unit within referenced company.
6 Requirements
6.1 The standard was segmented into two levels for the following reasons. First, organizing the work into these
segments makes each segment more coherent. Next, layering the segments provides a flexible means for adopting
the standard incrementally.
6.1.1 The metadata depends on the identity layer. The internal structure layer implies the identity layer.
6.2 Identifiers The use of identifiers is critical in the design. Each of the levels requires them to function. The
reason is that being able to unambiguously identify an item independently of the item itself enables elegant solutions
to many problems:
• Item Versioning