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SEMI E131-0304 © SEMI 2004 1 SEMI E131-0304 SPECIFICATION FOR THE PHYSI CAL INTERFACE OF AN INTEGRATED MEASUREMENT MODU LE (IMM) INTO 300 mm TOOLS USING BOLTS-M This specification was technically approved by the Gl obal …

SEMI E129-1103 © SEMI 2003 28

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SEMI E131-0304 © SEMI 2004 1

SEMI E131-0304

SPECIFICATION FOR THE PHYSICAL INTERFACE OF AN

INTEGRATED MEASUREMENT MODULE (IMM) INTO 300 mm TOOLS

USING BOLTS-M

This specification was technically approved by the Global Physical Interfaces & Carriers Committee and is

the direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

approved by the North American Regional Standards Committee on December 4, 2003. Initially available at

www.semi.org February 2004; to be published March 2004.

1 Purpose

1.1 This document establishes the specification for the

interface requirements between an integrated

measurement module (IMM) and 300 mm tools using

an interface as defined by SEMI E63 (BOLTS-M).

NOTE 1: The 1997 and 2000 SIA roadmaps call for the

implementation of metrology integrated with process tools.

Such technology is important as specifications tighten the cost

of monitor substrates at larger size increases, and as materials

and processing steps become more complex.

NOTE 2: The 300 mm equipment generation offers an

opportunity for integration of measurement equipment

modules in a configuration that could be standard across

different tools.

1.2 The standard will permit the tool suppliers, robotics

suppliers, and measurement module suppliers, to

provide plug and play integrated measurement solutions

on a mechanical level.

1.3 It is the purpose of this standard to facilitate

process monitoring through rapid access to

measurement data, to reduce material handling between

process and measurement equipment, and to provide the

opportunity to increase process monitoring with a

minimum or no decrease in throughput.

2 Scope

2.1 This standard is intended to set an appropriate level

of specification that places minimal limits on

innovation while ensuring modularity and

interoperability at all mechanical interfaces. It

establishes the mechanical interface specifications for

integration of measurement modules intended for, but

not limited to, 300 mm process tools using a BOLTS-M

interface, while utilizing existing SEMI Standards as

much as possible.

2.2 This standard specifies that SEMI E63 is utilized

for the tool side of the interface.

2.3 This standard covers the following topics:

• General physical requirements for integration of

the IMM,

• Nominal wafer-seating plane within the IMM,

• Maximum outer dimensions of the IMM, in case it

is located at the front of a tool.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This standard does not specify the location of the

IMM relative to the tool.

3.2 This standard does not specify facility or

communication interfaces.

3.3 No materials requirements or micro-contamination

limits are given.

3.4 Substrate input and retrieval will be the obligation

of the tool.

4 Referenced Standards

4.1 SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes

Used to Transport and Store 300 mm Wafers

SEMI E15 — Specification for Tool Load Port

SEMI E15.1 — Specification for 300 mm Tool Load

Port

SEMI E47.1 — Provisional Mechanical Specification

for Boxes and Pods Used to Transport and Store 300

mm Wafers

SEMI E57 — Mechanical Specification for Kinematic

Couplings Used to Align and Support 300 mm Carriers

SEMI E63 — Mechanical Specification for 300 mm

Box Opener/Loader to Tool Standard (BOLTS-M)

Interface

SEMI E64 — Specification for 300 mm Cart to SEMI

E15.1 Docking Interface Port

SEMI E131-0304 © SEMI 2004 2

SEMI E127 — Specification for Integrated

Measurement Module Communications: Concepts,

Behavior, and Services (IMMC)

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

5 Terminology

5.1 Abbreviations and Acronyms

5.1.1 IMM — Integrated Measurement Module

5.2 Definitions

5.2.1 bilateral datum plane — a vertical plane that

bisects the substrates and that is perpendicular to both

the horizontal and facial datum planes. (As defined in

SEMI E57.)

5.2.2 BOLTS plane — a plane parallel to the facial

datum plane near the front of the tool where the

box/opener loader is attached. (As defined in SEMI

E63.)

5.2.3 facial datum plane — a vertical plane that bisects

the wafers and that is parallel to the front side of the

carrier (where wafers are removed or inserted). On tool

load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded. (As defined in SEMI

E57.)

5.2.4 horizontal datum plane — a horizontal plane

from which projects the kinematic-coupling pins on

which the carrier sits. On tool load ports, it is at the

load height specified in SEMI E15 and might not be

physically realized as a surface. (As defined in SEMI

E57.)

5.2.5 integrated measurement module (IMM) — a

measurement module intended to be integrated into

manufacturing equipment, and with the capability of

receiving substrates from the equipment, measuring

those substrates, and returning the substrates and the

measurement results to the equipment and other

concerned clients. (As defined in SEMI E127.)

5.2.6 measurement module — an equipment module

whose intended function is to measure or inspect the

product and to report the results. Measurement of the

product is the factory’s means of gaining feedback on

the manufacturing process. (As defined in SEMI

E127.)

5.2.7 nominal wafer-seating plane — horizontal plane

that bisects the wafer pick-up volume. (As defined in

SEMI E1.9.)

6 Requirements

6.1 The IMM is required to mate with an interface as

defined by SEMI E63. This includes meeting the

requirements for the hole opening, bolt hole pattern,

and other relevant requirements. Note that certain

requirements in SEMI E63, such as y76 (facial datum

plane when carrier is undocked), do not have relevance

for the IMM but will not be in conflict.

6.2 Use of Datum Planes — The location in space

where a substrate is delivered to an IMM is the

intersection of three orthogonal datum planes defined in

other standards: the facial datum plane, the nominal

wafer-seating plane and the bilateral datum plane. The

BOLTS plane, as in SEMI E63, is defined to be parallel

to, and at a distance of y70 from the facial datum plane.

6.2.1 Bilateral Datum Plane — All bilateral

dimensions of the interface are symmetric about the

bilateral datum plane as shown in Figure 1.

6.2.2 Facial Datum Plane — This is the vertical plane,

parallel to the BOLTS plane, which bisects the

substrate at the insertion and removal position of the

substrate inside of the IMM. The distance from the

BOLTS plane to the facial datum plane in the IMM is

determined by y70 of SEMI E63.

6.2.3 Nominal Wafer-Seating Plane — The nominal

wafer-seating plane is the horizontal plane within the

IMM where a substrate is to be loaded to or unloaded

from by the tool. It can be anywhere between the given

minimum and maximum values that follow. This range

is not defined by a single standard, rather it results from

a combination of dimensions of SEMI E1.9, SEMI

E15.1 and SEMI E47.1. (See Figure 1.)

6.2.3.1 The minimum value for a nominal wafer-

seating plane is the sum of (H + z44 + z8), measured

from the floor.

6.2.3.2 The maximum value for a nominal wafer-

seating plane is calculated by (H + z44 + z8 + (25-1) *

z12), measured from the floor.

6.2.3.3 For both calculations, H is from SEMI E15.1,

z44 is from SEMI E47.1, and z8 and z12 are from

SEMI E1.9.

6.3 Internal Clearances — There are requirements

relating to clearances inside the IMM. These relate to

robot arm requirements for substrate handoff, and can

be referenced from SEMI E1.9 and SEMI E47.1 as the

same restrictions apply.

6.3.1 This includes clearance in front of the wafer set-

down location of radius r3, and heights bounded by z11

and z10 relative to the nominal wafer-seating plane.

All clearance requirements above the highest and below

the lowest slot from SEMI E1.9 and SEMI E47.1 must