semi合集-English.pdf - 第7707页

SEMI T9-0200 © SEMI 1998, 2004 8 NOTICE: SEMI makes no warranties or represen tations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the s…

7 SEMI T9-0200 © SEMI 1998, 2004

Data Matrix ID Field

Bondin

Pad

Locating Holes

TOP VIEW

12 row x 26 column Field

ECC200

Simulated 22-character Message

1.2 mm

2.6 mm

0.3 mm, miminimum

2.0 mm, miminimum

Strip Rail

Strip Orientation Corner

Mark

Reference

Point

Strip Orientation Corner

Strip

Edge

Leading

(C2)

(

)

Figure 5

Leadframe with Data Matrix ID Field

Strip

Leading

Edge

Strip

Orientation

Corner

Strip

Leading

Edge

Strip

Leading

Edge

Data Matrix Field

Strip

Orientation

Corner

Strip

Orientation

Corner

Figure 6

Alternate Lead-Frame Configurations and

Suggested Data Matrix Field Locations

SEMI T9-0200 © SEMI 1998, 2004 8

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI T10-0701 © SEMI 20011

SEMI T10-0701

TEST METHOD FOR THE ASSESSMENT OF 2D DATA MATRIX DIRECT

MARK QUALITY

This specification was technically approved by the Global Traceability Committee and is the direct

responsibility of the North American Traceability Committee. Current edition approved by the North

American Traceability Committee on March 20, 2001. Initially available on SEMI at www.semi.org May

2001; to be published July 2001.

1 Purpose

1.1 This standard is intended to define the

methodology for the assessment of 2D Data Matrix

direct mark quality.

2 Scope

2.1 This standard defines assessme nt criteria,

metrology methods, and assessment reporting

procedures as applied to 2D Data Matrix code direct

marks on semiconductor related materials. Application

specifications, which refer to this standard, may further

limit its scope to more specific requirements of a

particular application.

2.2 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the user of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 This standard will not specifically address the

quality assessment of paper-printed labels and will be

limited to the usage of the Data Matrix symbology as

defined by the AIMI standard.

3.2 This standard will not specify the resulting

minimum, maximum or nominal values of any direct

mark assessment method which would be considered

acceptable for a 2D Data Matrix direct mark

application. Application specifications may define

these values with reference to this standard.

4 Referenced Standards

4.1 AIM International Technical S pecification

AIMI Uniform Symbology Specification - Data Matrix

5 Terminology

5.1 Definitions of terms relating to 2D Data Matrix

direct mark assessment are as follows:

1 AIM International, Inc., 11860 Sunrise Valley Drive, Suite 100,

Reston, VA 20191, tel 703.391.7621, fax 703.391.7624

5.1.1 alternating pattern of a Data Matrix code

symbol  a line of alternately filled and unfilled cells

indicative of the cell spacing along one of the major

axes of the Data Matrix symbol (see Figure 1).

5.1.2 binary value  a mark in the substrate surface

indicates the binary value of one. The absence of a

mark, or a smooth surface surrounding a cell center

point, indicates the binary value of zero.

5.1.3 cell, of a Data Matrix symbol  the area within

which a marking may be placed to indicate a binary

value. The cell is the smallest element of a two-

dimensional Data Matrix symbol. The cell shape is

generally quadrilateral, typically rectangular and ideally

square.

5.1.4 cell center point, of a Data Matrix symbol  the

point at which the centerline of a matrix row intersects

the centerline of a column.

5.1.5 cell size, of a Data Matrix sym bol  the number

of image pixels within a Data Matrix symbol cell.

Since the cell is generally rectangular in shape, the

resolution is specified in both the horizontal and

vertical directions of the cell.

5.1.6 cell spacing, of a Data Matrix symbol  the

vertical or horizontal distance between the cell center

points of contiguous cells.

5.1.7 centerline, of a row or a column  the line

positioned parallel to, and spaced equally between, the

boundary lines of the row or column.

5.1.8 edge  the location of a signi ficant change in

pixel brightness values between regions. It is the

point(s) that has the greatest amount of contrast

difference (change in intensity values) between pixels.

5.1.9 edge detection method  a me thod whereby the

location of an edge in an image is determined.

5.1.10 error correction  mathemati cal techniques,

which reconstruct the original information, based upon

the remaining data in a damaged or poorly marked

code. Reed Solomon and convolution are two such

techniques.