semi合集-English.pdf - 第5027页

SEMI M18-0704 © SEMI 1990, 2004 13 ♦ 11.7 Thickness Nominal [ ] ± Tolerance [ ]µm 100117 Test Method [ ]SEMI MF95; [ ]SEMI MF110; [ ]FT-IR; [ ]SEMI MF 672(SRP); [ ]DIN 50436; [ ]DIN 50437; [ ]Other:_____ ♦ 11.8 Thickness…

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SEMI M18-0704 © SEMI 1990, 2004 12
8.16 Stains [ ] 100102
9. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
9.01 [ ] Specified According to SEMI M1 Table 1 100103
OR SPECIFIED INDIVIDUALLY
9.1 Edge Chips
3
[ ]SEMI M1 Table 1 [ ]Other: 100104
9.2 Cracks, Crow's Feet
3
[ ]SEMI M1 Table 1 [ ]Other: 100105
9.3 Contamination/Area
3
[ ]SEMI M1 Table 1 [ ]Other: 100106
9.4 Saw Marks
3
[ ]SEMI M1 Table 1 [ ]Other: 100107
9.5 Stains [ ] 100108
9.6 Roughness [ ] 100109
9.7 Brightness [ ] 100110
9.8 Scratches – macro [ ]None; [ ]Cum Length =[ ]mm 100165
9.9 Scratches – micro [ ]None; [ ]Cum Length =[ ]mm 100166
9.10 Localized Light
Scatterers
Size: [ ] µm Count: ≤ [ ]
Size: [ ] µm Count: ≤ [ ]
100167
100168
10. OTHER CHARACTERISTICS
10.1 Bulk defects by X-ray
topography
[ ]Value:_____ 100169
Method [ ]DIN 50443/1; [ ]Other:_____
Part 3 Epitaxial Wafer
CUSTOMER:
P
ART NUMBER: REVISION
D
ATE:
TESTING LEVEL EDI Sub
WAFER TEST PIECE
Code Param
REQUIRED
ITEM SPECIFICATION
100% SAMP
LE
100% SAMP
LE
ID ID
11. GENERAL EPITAXIAL WAFER AND LAYER CHARACTERISTICS
THE ITEMS LISTED IN THIS TABLE MAY BE
11.01 [ ] Specified According to SEMI M11 Table [ ] 100170
OR SPECIFIED INDIVIDUALLY
♦
11.1 Conductivity
Type/Structure
[ ]n/n+ [ ]p/p+ [ ]Other:_____ 100111
♦
11.2 Dopant [ ]B [ ]Phos [ ]As 100112
11.3 Silicon Source Gas [ ]SiH
4
; [ ]SiH
2
Cl
2
; [ ]SiHCl
3
; [ ]SiCl
4
100113
11.4 Growth Method Reactor Type [ ] Pressure [ ] 100114
♦
11.5 Net Carrier Density
(Resistivity)
Nominal [ ] ± Tolerance [ ] (check unit
below)
100115
Units [ ]10[ ]atoms/cm
3
; [ ]Ωcm
Test Method [ ]ASTM F419 - [ ]Gated, [ ]Ungated,
[ ]Schottky; [ ]SEMI MF374 (4-Pt);
[ ]SEMI MF525 (SRP); [ ]SEMI MF1392 (Hg-
CV); [ ] SEMI MF1393; [ ]DIN 50439; [ ]DIN
50444; [ ]DIN 50447; [ ]Other ____
♦
11.6 Net Carrier Density
Variation
[ ]Not greater than [ ]%
[ ]SEMI M2; [ ]SEMI M11 Table [ ]
100116
Measurement Position [ ]SEMI M2; [ ]SEMI M11; [ ]Other:_____
Calculation [ ]SEMI M2; [ ]SEMI M11; [ ]Other:_____
SEMI M18-0704 © SEMI 1990, 2004 13
♦
11.7 Thickness Nominal [ ] ± Tolerance [ ]µm 100117
Test Method [ ]SEMI MF95; [ ]SEMI MF110; [ ]FT-IR;
[ ]SEMI MF 672(SRP); [ ]DIN 50436;
[ ]DIN 50437; [ ]Other:_____
♦
11.8 Thickness Variation [ ]Not greater than [ ]%
[ ]SEMI M2; [ ]SEMI M11 Table [ ]
100118
Measurement Position [ ]SEMI M2; [ ]SEMI M11; [ ]Other:______
Calculation [ ]SEMI M2; [ ]SEMI M11; [ ]Other:______
11.9 Transition Width Not greater than [ ]µm 100119
Measurement Position
Calculation
11.10 Flat Zone Not less than [ ]µm 100120
Measurement Position
Calculation
11.11 Phantom Layer [ ]None 100121
12. MECHANICAL CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
12.01 [ ] Specified According to SEMI M11 Table [ ] 100135
OR SPECIFIED INDIVIDUALLY
12.1 Bow Not greater than [ ] µm 100122
Method [ ]SEMI MF534; [ ]JIS H 611; [ ]Other:_____
12.2 Warp Not greater than [ ] µm
Method [ ] SEMI MF657; [ ] SEMI MF1390;
[ ]Other:______
100123
100124
SEMI
MF657
SEMI
MF1390
12.3 Sori Not greater than [ ] µm 100125
12.4 Flatness/Global Acronym
2
: [ ][ ][ ][ ] Value _____µm 100126
Method [ ]SEMI MF1530 [ ]DIN 50441/3 [ ]Other
12.5 Flatness/Site Acronym
2
:[ ][ ][ ][ ]
Value ____µm
Site Size __×__ mm
Total Sites __
% Usable Area __
[ ] Include partial sites
[ ] Offset: x = [ ] mm, y = [ ] mm
100127
100128
100129
100130
100131
100132
100134
100161
100222
100223
SF3R
SF3D
SFLR
SFLD
SFQR
SFQD
SBIR
SFSR
SFSD
SBID
12.6 Fixed Quality Area Value: [ ]mm dia 100172
13. FRONT SURFACE VISUAL INSPECTION CHARACTERISTICS
THE ITEMS LISTED IN THIS SECTION MAY BE
13.01 [ ] Specified According to [ ]SEMI M2 Table 1 or [ ]SEMI M11 Table [ ] 100135
OR SPECIFIED INDIVIDUALLY
13.1 Stacking Faults
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100136
Method [ ] ASTM F522 [ ] DIN 50446 [ ]Other
13.2 Slip
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100137
Method [ ] ASTM F47 [ ] ASTM F80 [ ] SEMI MF523
[ ]DIN 50446 [ ]Other
SEMI M18-0704 © SEMI 1990, 2004 14
13.3 Large Point Defects
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100138
Method [ ] SEMI MF523 [ ] ASTM F815 [ ] DIN
50446
[ ] Other:
13.4 Total Points Defects
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100139
Method [ ] SEMI MF523 [ ] ASTM F815 [ ] DIN
50446
[ ] Other:
13.5 Scratches
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100140
Method [ ] SEMI MF523 [ ]Other
13.6 Dimples
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100141
Method [ ] SEMI MF523 [ ]Other
13.7 Orange Peel
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100142
Method [ ] SEMI MF523 [ ]Other
13.8 Cracks/Fractures
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100143
Method [ ] SEMI MF523 [ ]Other
13.9 Crow's Feet
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100144
Method [ ] SEMI MF523 [ ]Other
13.10 Edge Chips
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100145
Method [ ] SEMI MF523 [ ]Other
13.11 Edge Crown
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100146
Method [ ] DIN 50446 [ ]Other
13.12 Haze
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100147
Method [ ] SEMI MF523 [ ]Other
13.13 Foreign Matter
4
[ ]SEMI M2 Table 1; [ ]SEMI M11 Table [ ];
[ ]Other:
100148
Method [ ] SEMI MF523 [ ]Other