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SEMI E76-0299     SEMI 1998, 1999 2 and laws should be consulted to ensure that the equipm ent meets regulatory requiremen ts in each location. 3.3 This guide is not intended to address design issues related to safet…

SEMI E76-0299 



 SEMI 1998, 1999

SEMI E76-0299

GUIDE FOR 300 mm PROCESS EQUIPMENT POINTS OF

CONNECTION TO FACILITY SERVICES

This Guide was technically approved by the Global Facilities Committee and is the direct responsibility of

the North American Facilities Committee. Current edition approved by the North American Regional

Standards Committee on August 15, 1998. Initially available at www.semi.org January 1999; to be published

February 1999. Originally published September 1998.

This document replaces E76-0998 in its entirety.

1 Purpose

1.1 Factory design variations make it difficult for

equipment manufacturers to predict or agree on

consistent points of connection for hookup of equipment

to facility services. Similarly, device manufacturers

cannot easily pre-facilitate their factories for equipment

because the connections on the equipment are not

consistently located. Standardization of connection

locations and utilizing pre-facilitation strategies

decreases the cost of and time required for equipment

installation.

1.2 This document is a guide for 300 mm equipment

manufacturers to define the positioning of the

equipment points of connection (EPOC), required on

semiconductor processing equipment for hookup to

facility utility services. The document identifies

locations for the EPOC’s and provides EPOC

consistency recommendations that should allow for

efficient equipment installation. In addition, this

document defines strategies to support the device

manufacturer’s ability to pre-facilitate the utility point

of connection (UPOC). Recommendations for supplier-

provided EPOC documentation are also included.

2 Scope

2.1 This guide addresses three areas that are necessary

to improve the efficiency of and reduce the duration of

equipment installations.

a) Recommendations for EPOC location, grouping,

consistency and reduction to increase confidence in

the accuracy and repeatability of EPOC’s, and

reduce the amount of work required to hookup

equipment. As a result, device manufacturers can

employ standard pre-facilitation strategies and

increase the efficiency of equipment installation.

b) Pre-facilitation recommendations that provide the

ability for UPOC’s to be efficiently and accurately

installed prior to equipment delivery, thus allowing

immediate hook-up of the equipment upon arrival

in the wafer fab. This includes recommendations

for jigs, templates, mating pedestal bases, and

associated interface panels.

c) Documentation recommendations to be required by

the device manufacturer and provided by the

equipment supplier relative to EPOC location,

group, consistency, pre-facilitation strategies and

hardware. This includes additional documentation

recommended to support equipment installations

but not directly related to EPOC’s.

2.2 This guide applies to 300 mm semiconductor

processing equipment and any supplier-provided

support equipment for installation into new factories.

2.3 The following groups of utilities are covered in this

guide.

• Electrical Power

• Data communications

• Exhaust and other process effluents

• Process fluids (liquids and gases)

• Support equipment interconnects

2.4 The primary focus for this guide is hookup of

semiconductor processing equipment including but not

limited to the following equipment types.

• Etch equipment (Dry and Wet)

• Film deposition equipment (CVD, PVD and

Plating)

• Thermal equipment

• Surface prep and clean

• Photolithography equipment (Stepper and

Tracks)

• Chemical Mechanical Polishing equipment

• Ion Implant equipment

• Metrology equipment

3 Limitations

3.1 This standard does not apply to assembly and test

equipment.

3.2 International, national, and local codes, regulations

SEMI E76-0299

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 SEMI 1998, 1999

and laws should be consulted to ensure that the

equipment meets regulatory requirements in each

location.

3.3 This guide is not intended to address design issues

related to safety. Safety issues are addressed in other

SEMI standards (See SEMI S2).

4 Referenced Documents

4.1 SEMI documents

SEMI E6 — Facilities Interface Specifications

Guideline and Format

SEMI S2 — Safety Guideline for Semiconductor

Manufacturing Equipment

NOTE: All documents cited will be the latest published

versions.

5 Terminology

5.1 bottom feed — Equipment utility supply lines enter

the equipment from its underside typically through the

floor.

5.2 equipment configuration — Specifically, the

arrangement, location, type and quantity of EPOC’s

needed for installation. Also know as tool configuration.

5.3 equipment point of connection (EPOC) — A

fitting or other terminal provided with the processing

equipment (either external or internal) for utility

connection, the equipment end/termination of the

hookup. Also know as tool point of connection.

5.4 external connection — An external connection is

located outside the main frame of equipment.

5.5 facilities interface specification

— Documentation

provided by an equipment supplier that contains the

equipment requirements for utilities and installation

[SEMI E6].

5.6 facility services — Any gas, exhaust, liquid,

power, data communications or other material which are

supplied to or carried away from the equipment and

used in the process. Also referred to as utilities or

facilities.

5.7 footprint — The total area or floor space

consumed by a piece of equipment when viewed

perpendicular to the area of reference (e.g., normally,

when viewed from directly overhead and considering

the floor).

5.8 hazardous production materials (HPM) — A

solid, liquid, or gas that has a degree of hazard rating in

health, flammability, or reactivity of class 3 or 4 as

ranked by NFPA 704 and that is used directly in

research, laboratory, or production processes that have

as their end product materials that are not hazardous.

5.9 hookup — The set of activities and organization

required to accept incoming process equipment, move it

into place, connect the equipment to all facilities, and

test the connections. The connection of all necessary

facilities and interconnects required to make the

equipment package fully operational.

5.10 interconnect — Connections between equipment

mainframe and peripheral equipment subsystem

equipment [SEMI E6].

5.11 internal connection — An internal connection is

a utility connection to the equipment which is located

internal to the equipment and typically associated with

hazardous utilities.

5.12 interface box — An enclosure located between

the equipment mainframe and facility services typically

containing components for pressure regulation and

filtration. It functions to consolidate facility service

requirements to single points of connection. The

interface box can provide location and ability to pre-

facilitate equipment hookups in advance of equipment

delivery.

5.13 jig — A three dimensional fixture, typically a

frame that contains equipment installation aides which

serve to indicate location and type of connection needed

for equipment hook-up.

5.14 location plane — The common area on a piece of

equipment where EPOC’s may be located (e.g., back,

side, top, bottom).

5.15 pedestal — Structural support element upon

which equipment or raised floor rests.

5.16 pre-facilitation — The stage in the equipment

installation process that follows base build and precedes

equipment delivery/equipment hookup. Pre-facilitation

brings the various facilities services close to the new

equipment location, including new facilities services

and structural modifications required to prepare the

facility to accept the equipment.

5.17 pre-facilitation pedestal — A matching

equipment floor mounting surface intended to act as a

means to expedite equipment hookup, as well as, save

fab floor space by having pre-plumbed connections.

Ideally, the pedestal would be installed and facilitated to

the UPOC’s prior to the equipment arrival.

5.18 raised floor — The removable floor system

installed above the actual building floor within

cleanroom environments to control air flow and allow

access for utility routing and connection.

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5.19 seismic bracing — Structural reinforcement to

minimize damage due to earthquakes.

5.20 single line drop — A hookup strategy where a

piece of processing equipment has only one point of

connection per facility service. All manifolding for an

individual service is handled with in the equipment.

5.21 specialty gas — Non-bulk process gases typically

stored in cylinders and used to supply one or more

process equipment through specialized manifolds.

5.22 subfab — The area below or outside of the

cleanroom production area that can be a single or

multiple levels and may or may not be clean.

5.23 support equipment — Ancillary equipment not

part of the main chassis.

5.24 template — Provides a dimensional outline of the

equipment footprint including overall dimensions,

equipment datum point, utility connection/penetration

locations, equipment interconnect/penetration locations,

maintenance and access spaces, and wafer load/unload

stations. It can be made from any cleanroom compatible

material.

5.25 tool — Any piece of semiconductor fabrication or

inspection equipment designed to process wafers. Often

used synonymously with equipment in the silicon wafer

processing industry.

5.26 tool accommodation — A methodology by which

semiconductor processing equipment is installed in a

cost-effective and timely manner.

5.27 top feed — Where utility supply lines enter the

equipment from the topside.

5.28 utility point of connection (UPOC) — The mating

fitting or terminal provided by the facility for

interconnection with the EPOC for utility supply, the

facility end/termination of the hookup at the equipment.

Table 1. Equipment Point of Connection Location Recommendations

Facility Service / Utility

Bottom Location Plane

Preference

Back Location Plane

Alternate

Gas, Bulk Bottom Back (lower)

Gas, Specialty Bottom Back (lower) Back

Exhaust, Corrosive Bottom Back (lower) Back

Exhaust, Flammable Bottom Back (lower) Back

Exhaust, Solvent Bottom Back (lower) Back

Exhaust, General Bottom Back (lower) Back

Chemical Supply, Inorganic Bottom Back (lower)

Chemical Supply, Organic Bottom Back (lower)

Ultrapure Water Bottom Back (lower)

Cooling Water Bottom Back (lower)

Hot Ultrapure Water Bottom Back (lower)

Drain, Inorganic Bottom Bottom Back (lower)

Drain, Waste Chemical, Organic Bottom Bottom Back (lower)

Power, 100V Bottom Back (above wet EPOC)

Power, 200/400V Bottom Back (above wet EPOC)

Fire Suppression Bottom Back

Ancillary Component Interconnect Bottom Back (above wet EPOC)

Signal Cable Bottom Back (above wet EPOC)

Vacuum Foreline Bottom Bottom Back

Process Vacuum Bottom Back

NOTE: Connections located on the top are not recommended because of possible interference with overhead wafer

handling and minienvironment equipment.