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SEMI G3-90 © SEMI 1 980, 199 6 4 7.2.2.2 W ire Bond Finger Pullb ack — A 0 .010" (0. 254 mm) maxi mum fro m the c avit y edge and the mini mum e xpo sed wire bo nd lea d leng th mu st mee t the dimens ion on th e pr…

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SEMI G3-90 © SEMI 1980, 19963
6 Materials
6.1 Ceramic
6.1.1 Alumina content 90% minimum.
6.1.2 Color — Opaque or white.
6.2 Metallization
6.2.1 Refractory metallization (provide adequate bond
strength to ceramic).
6.2.2 Nickel plating (if designated).
6.2.3 Precious or noble metal plating.
6.2.4 Nickel/gold per MIL-M-38510 except gold
plating shall conform to MIL-G-45204, Type III and
have a thickness of 60 microinches minimum.
6.3 Braze Material — An alloy with a melting point
equal to or greater than 750°C which will provide
specified bond strength of the lead to the ceramic.
6.4 Lead Material
6.4.1 Iron nickel cobalt alloy per MIL-M-38510, Type
A.
6.4.2 Iron nickel alloy per MIL-M-38510, Type B.
7 Defect Limits
7.1 Ceramic
7.1.1 Cracks — None allowed.
7.1.2 Chips
7.1.2.1 Corner — 0.762 mm (0.030") × 0.762 mm
(0.030") × 0.762 mm (0.030") max.
7.1.2.2 Edge — 2.54 mm (0.100") × 0.762 mm
(0.030") × 0.762 mm (0.030") max. (Chips can not be
encroached or exposed any metallized area.)
7.1.2.3 Seal Area
7.1.2.3.1 7.62 mm (0.300") and 10.16 mm (0.400")
Row Spacing Parts — .762 mm (0.030") × 2.54 mm
(0.100")
7.1.2.3.2 15.24 mm (0.600") Row Spacing Parts —
1.27 mm (0.050") × 0.381 mm (0.015") × 0.381 mm
(0.015") max.
7.1.2.3.3 22.86 mm (0.900") Rowing Spacing Parts —
1.52 mm (0.060") × 0.508 mm (0.020") × 0.508 mm
(0.020") max.
7.1.2.3.4 Chips cannot reduce the seal width by more
than 1/3 of the design width.
7.1.3 Burrs and Projections
7.1.3.1 Top Plane Excluding Seal Area — 0.102 mm
(0.004") max.
7.1.3.2 Seal Area — 0.025 mm (0.001") max. above
metallization.
7.1.3.3 Wire Bond Finger Areas — 0.025 mm (0.001")
max. above metallization.
7.1.3.4 Die Attach Surface — 0.025 mm (0.001") max.
above metallization excluding a 0.203 mm (0.008")
perimeter on 7.62 mm (0.300") centerline packages,
0.254 mm (0.010") perimeter on 10.16 mm (0.400")
centerline packages and 0.381 mm (0.015") perimeter
on 15.24 mm (0.600") centerline packages, 0.508 mm
(0.020") perimeter on 22.86 mm (0.900") row center
package.
7.1.4 Camber — Ceramic-maximum of 0.004
inch/inch (mm/mm).
7.1.5 Flatness
7.1.5.1 Seal Area — 0.050 mm (0.002") TIR on 7.62
mm (0.300") row center packages, 0.0635 mm
(0.0025") TIR on 10.16 mm (0.400") and 15.24 mm
(0.600") row center packages.
7.1.5.2 Die Attach — Die attach pad to be flat to
within 0.051 mm (0.002") TIR to exclude a 0.203 mm
(0.008") perimeter on 7.62 mm (0.300") centerline
packages, 0.254 mm (0.010") perimeter on 10.16 mm
(0.400") centerline packages and 0.381 mm (0.015")
perimeter on 15.24 mm (0.600") centerline packages.
7.2 Metallization
7.2.1 Voids
7.2.1.1 Seal Area — On the outer half of the seal area
width, maximum of 3 voids no larger than 0.127 mm
(0.005") in diameter are permissible. On the inner half,
maximum of 3 voids no larger than 0.381 mm (0.015")
in diameter or larger than 1/3 of the seal area width,
whichever is the smaller. The distance between any 2
voids shall be at least 0.762 mm (0.030").
7.2.1.2 Wire Bond Fingers — A 0.254 mm (0.010") ×
0.010" (0.254 mm) void free area within the specified
wire bond finger area as defined be the procurement
drawing.
7.2.1.3 Die Attach Surface — Maximum 0.010"
(0.254 mm) diameter by a distance greater than 0.030"
(0.762 mm) with no more than 3 voids.
7.2.2 Metallization Misalignment — See Figure 3.
7.2.2.1 Seal Plane Rundown — Internal cavity — not
to exceed 25% of the cavity layer thickness. External
cavity — not to be less than 0.010" (0.254 mm) outside
the cavity.
SEMI G3-90 © SEMI 1980, 1996 4
7.2.2.2 Wire Bond Finger Pullback — A 0.010"
(0.254 mm) maximum from the cavity edge and the
minimum exposed wire bond lead length must meet the
dimension on the procurement drawing or specification.
7.2.2.3 Wire Bond Finger Rundown — Not to exceed
25% of the ceramic layer thickness or 0.005" (0.127
mm), whichever is the smaller.
7.3 Lead Attachment
7.3.1 Voids in Braze
7.3.1.1 Gold Plated Leadframes — 75% of the braze
fillet will be void free.
7.3.1.2 Nickel or Bare Leadframes — 75% of the
braze fillet will be void free.
7.3.2 Lead Alignment
7.3.2.1 Misalignment Leads to Braze Pads — The
leads shall not overhang the braze pads by more than
25% of the measured paddle width nor reduce the
clearance between adjacent pad or lead to less than 50%
of the clearance between adjacent metallizations.
7.3.2.2 Lead Offset — Lead centerlines must be
aligned to within 0.015" (0.381 mm) relative to the
position of the leads on the opposite side of the
package.
7.3.2.3 Lead-to-Lead Alignment — 0.010" ± 0.010"
(0.254 mm ± 0.254 mm) measured at the base of the
ceramic on the same side.
8 Sampling
Sampling sizes must meet the requirements of MIL-
STD-105; although single, double, or multiple samples
may be used.
9 Test Methods
9.1 Mechanical, Electrical and Thermal Test Methods
9.1.1 Gold Plating Quality
9.1.1.1 Purity and adhesion of the gold plated package
shall be tested by placing parts on a calibrated heater
block at:
Condition A — 450°C ± 10°C for two minutes in air, or
Condition B — 470°C ± 10°C for one minute in
nitrogen.
9.1.1.2 After cooling at room temperature the
packages will be visually examined for the following
criteria:
9.1.1.2.1 Blisters on the leadframe are acceptable only
on the tie bar (that portion removed during trim).
Blisters on the bonding fingers shall not exceed 0.003"
(0.076 mm) diameter with a maximum of 1 blister per
finger and 5 blisters per package of any size. Blisters on
the seal ring shall not exceed 0.005" (0.127 mm)
diameter. Blisters on the die attach pad shall not exceed
0.010" (0.254 mm) diameter with a maximum of 5
blisters per package greater than 0.005" (0.127 mm)
diameter.
9.1.1.2.2 Slight discoloration of the gold at the die
attach pad edges up to 0.025" (0.635 mm) from the
cavity walls is acceptable. Discoloration of the bonding
fingers, seal ring surface or external leads is not
acceptable.
9.1.1.2.3 There shall be no flaking or peeling of the
package plating when viewed at 15× magnification.
9.1.1.2.4 Superficial stains left during drying or prior
operations is not cause for rejection.
9.1.2 Lead Pull — Four pounds (1.8 kg) minimum at a
45° angle from the lead’s original plane.
9.1.3 Lead Fatigue — Test per MIL-STD-883,
Method 2004.2, Test Condition B2, Section 3.2.
9.1.4 Thermal Characteristics — Test per MIL-STD-
883, Method 1012, Test Conditions A, B, C, D, and E.
9.2 Functional Test Methods
9.2.1 Die Attach Quality — Perform destructive die
shear test post environmental testing per MIL-STD-
883, Method 2019.1, Section 3.2C.
9.2.2 Wire Bond Quality — Perform minimum pre-
seal and post-seal bond strength test per MIL-STD-883,
Method 2011.2, Test Condition D. Reject for bonds
which cause plating to lift from the base metal of the
die attach surface or bonding fingers.
9.2.3 Solderability — Test per MIL-STD-883, Method
2003.2.
9.2.4 Insulation Resistance — Test per MIL-STD-883,
Method 1003.
9.2.5 Hermetic and Environmental Testing
9.2.5.1 The hermetic integrity of the package must be
maintained after all environmental testing. Hermetic
checks shall comply with MIL-STD-883, Method
1014.3, Test Condition A
1
or B and C.
9.2.5.2 Environmental testing shall include, but not be
limited to, the following:
1. Temperature Cycle — MIL-STD-883, Method
1010.2 Condition C
2. Thermal Shock — MIL-STD-883, Method 1011.2,
Condition C
SEMI G3-90 © SEMI 1980, 19965
3. Centrifuge — MIL-STD-883, Method 2001.2,
Condition E
4. Mechanical Shock — MIL-STD-883, Method
2002.2, Condition B
9.2.6 Sequence of Events and Incoming Testing —
During incoming inspection the sequence of testing
shall be:
1. Die Attach
2. Wire Bond
3. Pre-Seal Bond Pull
4. Seal
5. Environmental Test
6. Fine Leak
7. Gross Leak
8. Trim
9. Post-Seal Bond Pull
10.Radiography
11. Die Shear
12. Solderability
NOTE: An initial vendor qualification on the thermal and
electrical characteristics of the package may be performed.
The characteristics tested will be:
1. Insulation Resistance — MIL-STD-883, Method
1003, Test Condition D
2. Thermal Dissipation — MIL-STD-883, Method
1012
10 Packaging and Marking
10.1 Packaging — Containers selected shall be strong
enough and suitably designed to provide maximum
protection against crushing, spillage, and other forms of
damage to the container or its contents. Containers shall
afford protection of the contents to contamination from
exposure to excessive moisture or oxidation by gases.
Packaging materials shall be so selected to prevent any
contamination of the ceramic component parts with
paper fibers or organic particles.
10.2 Marking — The outer containers shall be clearly
marked to identify the user stock number, user purchase
order number, drawing number, quantity, and vendor
lot number.
11 Product Design
11.1 Leadframe Paddle Width and Standoff — (See
Figure 5.)
NOTE: A geometric symbol adjacent to an identifying lead
number 1 shall be considered appropriate for packages with
all leads isolated from the die attach.
NOTE: Lead number 14 is common to die attach surface and
is identified by placing this number where lead number 1 is
located.
11.1.1 Leadframe paddle width shall be 1.14 mm
(0.045") ± 0.178 mm (0.007").
11.1.2 Standoff shall be 1.02 mm ± 0.254 mm (0.040"
± 0.010").
11.1.3 Hole Diameter shall be 0.032" – 0.033" (0.813
mm – 0.838 mm).
11.2 Substrate/Terminal Commonality on Sidebrazed
Laminate Packages — If no leads are common to the
die attach surface, the lead one identification shall be a
geometric symbol (Figure 6).
Figure 6
Lead Identification