semi合集-English.pdf - 第5234页

SEMI M40-0200 © SE MI 2000 16 12 2.76 2.4 8/ 0.32 2.50/ 0.32 2.43/ 0.42 2.47/ 0.31 7.30 6.566/ 0.91 6.521/ 0.75 6.146/ 1.05 6.478/ 0.77 Ac id etche d, 200 mm 13 327.2 332.0/ 6.73 335.0/ 16.25 352.6/ 12.37 334.5/ 13.76 82…

100%1 / 7923
SEMI M40-0200 © SEMI 200015
R1-4.2 Results
R1-4.2.1 The average values of each site pattern is reported here together with the corresponding standard
deviation. The average might be considered as the characteristic roughness of the entire surface whereas the
standard deviation is a measure of roughness inhomogeneity. The results are summarized in Tables R1-1 and R1-3.
These averages and standard deviations are called site average or site standard deviation for the respective site
patterns for each wafer and each filter length applied.
R1-4.2.2 The variation in average values obtained with the different site patterns employed can be obtained by
calculating 1) the average ofthe individual site averages and the standard deviation for each wafer and 2) the average
of the individual site standard deviations and the corresponding standard deviation. These averages are called wafer
average and wafer standard deviation, respectively. The corresponding standard deviations are called standard
deviation of wafer average and standard deviation of wafer standard deviation. They are reported in Table R1-3 and
Table R1-5 and in Figure R1-2 and Figure R1-3.
R1-4.2.3 The site average roughness values found range from 0.09 A for final polished wafers to 350 A for acid
etched wafers for a 10 µm filter and from about 5 A to 2200 A, respectively, for a 250 µm filter. In total, a range of
about four and a half orders of magnitude is covered. The site standard deviation for the different site patterns is
around 10-15% of the average roughness of the wafer indicating a homogeneous roughness of the wafer surfaces.
The difference between the site patterns ii, iii, iv and v for the relative site standard deviation is small, typically
about 1-2 %. Exceptions are for the 200 mm final polished wafers with standard deviations of about 50-60% for the
10 µm filter.
R1-4.2.4 According to the values in Tables R1-3 & R1-5, the standard deviations of the wafer averages are less than
10 % in any case (Figure RI). The standard deviations of the various site standard deviations (Figure A3) are also
smaller than or about 10 % with respect to the wafer average. This indicates that in the present case any site pattern
—with the exception of the single site measurement at the wafer center—represents the “true” mean roughness of
the entire surface and its standard deviation reasonably well.
Table R1-1 Results of Roughness Measurements, 10 and 30 µm Filters
Wfr # Average/Standard Deviation, A
10 µm Filter
Average/Standard Deviation, A
30 µm Filter
Site pattern i ii iii iv v i ii iii iv v
Final polished, 150 mm 1 0.08 0.086/
0.005
0.089/
0.009
0.090/
0.007
0.086/
0.008
0.36 0.390/
0.020
0.396/
0.030
0.389/
0.028
0.396/
0.025
2 0.09 0.090/
0.007
0.094/
0.010
0.090/
0.005
0.093/
0.009
0.43 0.408/
0.037
0.413/
0.035
0.410/
0.028
0.410/
0.035
3 0.09 0.090/
0.000
0.092/
0.008
0.090/
0.005
0.092/
0.007
0.41 0.404/
0.018
0.401/
0.030
0.387/
0.022
0.402/
0.027
4 0.09 0.090/
0.000
0.097/
0.010
0.090/
0.004
0.095/
0.009
0.40 0.402/
0.015
0.420/
0.025
0.414/
0.016
0.415/
0.024
Final polished, 200 mm 5 0.23 0.14/
0.05
0.15/
0.06
0.15/
0.06
0.14/
0.06
1.17 0.746/
0.35
0.827/
0.33
0.795/
0.32
0.769/
0.29
6 0.26 0.13/
0.07
0.15/
0.06
0.15/
0.06
0.14/
0.06
1.36 0.746/
0.35
0.846/
0.36
0.801/
0.33
0.768/
0.32
7 0.10 0.13/
0.03
0.12/
0.04
0.13/
0.06
0.13/
0.04
0.53 0.736/
0.23
0.699/
0.23
0.752/
0.32
0.726/
0.22
8 0.09 0.12/
0.02
0.11/
0.02
0.12/
0.03
0.12/
0.02
0.50 0.648/
0.15
0.626/
0.14
0.636/
0.18
0.644/
0.13
Pre-polished, 200 mm 9 2.64 2.41/
0.25
2.45/
0.32
2.39/
0.39
2.42/
0.29
7.21 6.398/
0.77
6.538/
0.83
6.387/
0.91
6.432/
0.78
10 2.64 2.56/
0.36
2.69/
0.19
2.37/
0.41
2.64/
0.27
6.84 6.760/
0.95
7.147/
0.50
6.419/
1.00
7.022/
0.27
11 2.75 2.77/
0.07
2.78/
0.10
2.46/
0.45
2.78/
0.09
7.30 7.310
0.19
7.302/
0.30
6.545/
1.05
7.305/
0.27
SEMI M40-0200 © SEMI 2000 16
12 2.76 2.48/
0.32
2.50/
0.32
2.43/
0.42
2.47/
0.31
7.30 6.566/
0.91
6.521/
0.75
6.146/
1.05
6.478/
0.77
Acid etched, 200 mm 13 327.2 332.0/
6.73
335.0/
16.25
352.6/
12.37
334.5/
13.76
826.2 873.5/
43.16
869.5/
50.22
906.5/
28.56
874.4/
46.13
14 337.9 344.9/
18.74
344.7/
9.19
353.1/
12.11
345.3/
13.00
876.8 899.9/
60.49
915.5/
24.15
930.0/
43.19
912.5/
39.69
15 339.5 340.5
8/13.4
2
335.2/
6.07
363.4/
7.22
337.0/
9.58
887.7 913.7/
68.10
879.1/
24.64
966.1/
30.75
891.7/
47.65
16 337.6 331.8/
8.84
337.6/
13.37
348.7/
9.26
335.4/
12.41
922.8 886.1/
37.57
896.0/
38.04
921.8/
27.16
890.2/
37.14
Table R1-2 Results of Roughness Measurements, 80 and 250 µm Filters
Wfr. # Average/Standard Deviation, A
80 µm filter
Average/Standard Deviation, A
250 µm filter
Site pattern i ii iii iv v i ii iii iv v
Final polished, 150 mm 1 1.33 1.426/
0.075
1.416/
0.134
1.434/
0.108
1.426/
0.115
4.34 4.678/
0.484
4.836/
0.632
4.786/
0.435
4.813/
0.578
2 1.57 1.470/
0.112
1.482/
0.147
1.444/
0.112
1.471/
0.133
5.34 4.944/
0.312
5.441/
0.613
4.592/
0.434
5.258/
0.591
3 1.49 1.460/
0.025
1.472/
0.131
1.357/
0.080
1.466/
0.108
4.81 4.788/
0.403
5.164/
0.823
4.353/
0.507
5.047/
0.735
4 1.33 1.394/
0.089
1.446/
0.115
1.461/
0.069
1.435/
0.106
4.09 4.528/
0.619
4.814/
0.584
4.934/
0.503
4.760/
0.585
Final polished, 200 mm 5 3.29 2.582/
0.45
2.638/
0.71
2.531/
0.65
2.566/
0.60
7.33 6.676/
0.45
6.627/
0.99
6.560/
0.95
6.592/
0.82
6 3.65 2.560/
0.65
2.724/
0.79
2.510/
0.67
2.590/
0.69
7.49 6.804/
0.57
6.834/
0.93
6.443/
0.92
6.772/
0.80
7 2.02 2.682
/0.72
2.493/
0.56
2.641/
0.81
2.602/
0.61
5.45 6.914/
1.37
6.601/
0.81
7.057/
1.47
6.810/
0.97
8 1.97 2.400/
0.45
2.317/
0.40
2.279/
0.54
2.375/
0.40
5.56 6.268/
0.59
6.342/
0.69
6.232/
1.08
6.374/
0.62
Pre-polished, 200 mm 9 11.12 9.94/
1.06
10.19/
1.09
10.10/
1.27
10.02/
1.04
15.15 14.25/
1.31
14.50/
1.18
14.47/ 14.36/
1.22
10 10.13 10.54/
1.34
11.05/
0.78
10.27/
1.35
10.92/
1.03
14.40 15.44/
2.01
15.58/
0.77
14.59/
1.88
15.62/
1.28
11 11.29 11.35/
0.31
11.26/
0.45
10.13/
1.23
11.29/
0.41
15.75 16.56/
0.59
16.27/
0.81
14.83/
1.26
16.42/
0.74
12 10.60 10.11/
1.10
9.86/
0.95
9.92/
1.12
9.90/
0.99
14.42 14.33/
1.31
14.10/
1.14
14.41/
1.26
14.17/
1.21
Acid etched, 200 mm 13 1257.0 1404/
140.8
1391/
123.44
1439/
88.10
1406/
122.83
1789.6 2127/
331.59
2118/
295.83
2185/
270.70
2147/
291.78
14 1421.9 1460/
109.9
1514/
53.27
1497/
95.92
1501/
78.94
2154.6 2256/
154.21
2366/
222.41
2322/
216.72
2349/
203.72
15 1374.7 1500/
199.2
1396/
94.33
1549/
95.25
1438/
147.56
1970.4 2350/
508.52
2071/
257.41
2348/
198.70
2186/
384.36
16 1478.4 1421/
109.9
1450/
108.89
1477/
104.51
1437/
109.71
2006.4 2075/
186.85
2219/
297.40
2264/
252.44
2180/
271.75
R1-4.2.5 The five-point site pattern appears to represent the average surface reasonably well for wafers where the
roughness does not vary more than by a factor of about two across the entire surface. Patterns with a higher number
of sites are recommended for problematic surfaces.
SEMI M40-0200 © SEMI 200017
Table R1-3 Average Over Site Patterns ii, iii and iv (wafer average) and Corresponding Relative Standard
Deviation for Each Wafer
Wfr # Avg. of Averages, A Relative Std. Dev. of Averages, %
Filter 10 µm 30 µm 80 µm 250 µm 10 µm 30 µm 80 µm 250 µm
Final polished,
150 mm
1 0.088 0.392 1.425 4.767 2.34 0.90 0.65 1.69
2 0.091 0.410 1.465 4.992 2.80 0.66 1.33 8.55
3 0.091 0.397 1.430 4.768 1.41 2.29 4.43 8.52
4 0.092 0.412 1.434 4.759 4.17 2.22 2.45 4.38
Final polished,
200 mm
5 0.146 0.789 2.584 6.606 6.09 5.15 2.07 1.24
6 0.145 0.798 2.598 6.694 7.79 6.25 4.32 3.25
7 0.128 0.729 2.605 6.857 4.16 3.74 3.81 3.40
8 0.116 0.637 2.332 6.281 3.35 1.76 2.66 0.89
Pre-polished,
200 mm
9 2.418 6.441 10.08 14.41 1.35 1.31 1.23 0.96
10 2.541 6.775 10.59 15.21 6.30 5.37 4.18 3.54
11 2.669 7.052 10.91 15.89 6.89 6.23 6.20 5.83
12 2.469 6.411 9.96 14.28 1.54 3.60 1.30 1.13
Acid etched, 200
mm
13 339.87 883.15 1411.66 2143.24 3.27 2.30 1.78 1.68
14 347.57 915.12 1490.70 2314.67 1.37 1.64 1.87 2.40
15 346.41 919.62 1481.90 2256.45 4.32 4.77 5.29 7.13
16 339.38 901.30 1449.77 2185.77 2.52 2.04 1.93 4.52
Table R1-4 Average Over the Standard Deviations of the Site Patterns ii, iii and iv (wafer standard devia-
tion) and the Corresponding Relative Standard Deviations for Each Wafer Normalized to the Wafer Average
Wfr # Avg. of Std. Deviations, A Relative Std. Dev. of Std. Devs, %
Filter 10 µm 30 µm 80 µm 250 µm 10 µm 30 µm 80 µm 250 µm
Final polished,
150 mm
1 0.007 0.026 0.106 0.517 2.2 1.4 2.1 2.2
2 0.007 0.033 0.123 0.453 2.8 1.2 1.4 3.0
3 0.004 0.023 0.079 0.578 4.6 1.6 3.7 4.6
4 0.005 0.019 0.091 0.569 5.5 1.4 1.6 1.3
Final polished,
200 mm
5 0.059 0.302 0.603 0.797 3.8 6.2 5.3 4.6
6 0.065 0.347 0.703 0.807 4.0 1.8 2.9 3.1
7 0.042 0.261 0.699 1.219 10.4 7.3 4.9 5.2
8 0.025 0.156 0.463 0.789 4.7 4.0 3.1 4.1
Pre-polished,
200 mm
9 0.320 0.834 1.14 1.397 3.1 1.1 1.1 1.8
10 0.321 0.816 1.17 1.553 4.4 4.0 3.2 4.5
11 0.205 0.516 0.663 0.889 7.9 6.6 4.5 2.2
12 0.353 0.901 1.06 1.234 2.2 2.3 0.9 0.6
Acid etched,
200 mm
13 11.78 40.65 117.5 299.4 1.4 1.3 1.9 1.4
14 13.35 42.61 86.4 197.8 1.4 2.0 2.0 1.6
15 8.90 41.16 129.6 321.5 1.1 2.6 4.1 7.3
16 10.49 34.25 107.8 245.6 0.7 0.7 0.2 2.5