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SEMI S2-0703a E © SEMI 1991, 2004 1 SEMI S2-0703a E ENVIRONMENTAL, HEALTH, A ND SAFETY GUIDELINE FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT This safety guideline was technicall y approved by th e Global Environmental, Hea…

SEMI S1-0701

RELATED INFORMATION 1

MINIMUM LETTER HEIGHT CALCULATIONS

NOTE: This related information is not an official part of SEMI S1 and is not intended to modify or supersede the official

guideline. It has been derived from the informative Annex B of ANSI Z535.4-1998. Publication is authorized by vote of the

responsible committee. Determination of the suitability of this material is solely the responsibility of the user.

R1-1 A common concern when designing safety labels is determining the minimum letter height of text. This

Related Information describes one method that may be used to determine a minimum letter height.

Table R1-1 Examples of Word Message Uppercase Letter Heights at Various Viewing Distances

Viewing Distance Minimum Letter Height for

FAVORABLE Reading

Conditions

Recommended Letter Height

for FAVORABLE Reading

Conditions

Recommended Letter

Height for UNFAVORABLE

Reading Conditions

300 mm (12 in.) or less* 2 mm (0.08 in) 2 mm (0.08 in) 2 mm (0.08 in)

600 mm (24 in.) 2.5 mm (0.10 in) 4 mm (0.16 in) 4 mm (0.16 in)

900 mm (35 in.) 3 mm (0.12 in) 4.75 mm (0.19 in) 6 mm (0.24 in)

1.2 m (47 in.) 3.5 mm (0.14 in) 5.5 mm (0.22 in) 8 mm (0.31 in)

1.5 m (59 in.) 4 mm (0.16 in) 6.25 mm (0.25 in) 10 mm (0.39 in)

1.8 m (71 in.) 4.5 mm (0.18 in) 7 mm (0.28 in) 12 mm (0.47 in)

2.1 m (83 in.) 5 mm (0.20 in) 7.75 mm (0.31 in) 14 mm (0.55 in)

2.4 m (94 in.) 5.5 mm (0.22 in) 8.5 mm (0.33 in) 16 mm (0.63 in)

* 2 mm (0.079 in.) is the suggested minimum type size for use on safety labels.

Calculations for Recommended Letter Heights (in mm) for FAVORABLE Reading Conditions:

600 mm or less: (viewing distance in mm) / 150

>600 mm to 6 m: [(viewing distance in mm - 600) x .0025] + 4

Calculation for Recommended Letter Heights for UNFAVORABLE Reading Conditions (all distances):

(viewing distance) / 150

NOTICE:

Paragraphs entitled “NOTE” are not an official part of this safety guideline and are not intended to modify or

supersede the official safety guideline. These have been supplied by the committee to enhance the usage of the

safety guideline.

SEMI makes no warranties or representations as to the suitability of the guidelines set forth herein for any particular

application. The determination of the suitability of the guideline is solely the responsibility of the user. Users are

cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant literature

respecting any materials or equipment mentioned herein. These guidelines are subject to change without notice.

The user’s attention is called to the possibility that compliance with this guideline may require use of copyrighted

material or of an invention covered by patent rights. By publication of this guideline, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

guideline. Users of this guideline are expressly advised that determination of any such patent rights or copyrights,

and the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI S2-0703a

ENVIRONMENTAL, HEALTH, AND SAFETY GUIDELINE FOR

SEMICONDUCTOR MANUFACTURING EQUIPMENT

This safety guideline was technically approved by the Global Environmental, Health, and Safety Committee

and is the direct responsibility of the North American Environmental, Health, and Safety Committee. Current

edition approved by the North American Regional Standards Committee on April 11, 2003. Initially available

on www.semi.org June 2003; to be published July 2003. Originally published in 1991; previously published

in March 2003.

This standard was modified in September 2004 to correct editorial errors. Changes were made to Notices

preceding Sections 1 and 11.6.

NOTICE: This document contains material that has

been balloted and approved by the SEMI

Environmental Health and Safety Committee, but is

not immediately effective. This material and the

date on which it becomes effective are included in

Delayed Revisions Sections 1 and 2. The provisions

of this information are not an authoritative part of

the document until their effective dates. The main

body of SEMI S2-0703 remains the authoritative

version. Some or all of the provisions of revisions

not yet in effect may optionally be applied prior to

the effective date, providing they do not conflict with

portions of the authoritative version other than

those that are to be revised or replaced as part of the

deferred change, and are labeled accordingly.

Material that is to be replaced by revisions that are

not yet in effect is preceded by a NOTICE indicating

its status.

1 Purpose

1.1 This safety guideline is intended as a set of

performance-based environmental, health, and safety

(EHS) considerations for semiconductor manufacturing

equipment.

2 Scope

2.1 Applicability — This guideline applies to

equipment used to manufacture, measure, assemble,

and test semiconductor products.

2.2 Contents — This document contains the following

sections:

1. Purpose

2. Scope

3. Limitations

4. Referenced Standards

5. Terminology

6. Safety Philosophy

7. General Provisions

8. Evaluation Process

9. Documents Provided to User

10. Hazard Warning Labels

11. Safety Interlock Systems

12. Emergency Shutdown

13. Electrical Design

14. Fire Protection

15. Heated Chemical Baths

16. Ergonomics and Human Factors

17. Hazardous Energy Isolation

18. Mechanical Design

19. Seismic Protection

20. Automated Material Handlers

21. Environmental Considerations

22. Exhaust Ventilation

23. Chemicals

24. Ionizing Radiation

25. Non-Ionizing Radiation and Fields

26. Lasers

27. Sound Pressure Level

28. Related Documents

Appendix 1 — Enclosure Openings

Appendix 2 — Design Principles and Test Methods for

Evaluating Equipment Exhaust Ventilation

Appendix 3 — Design Guidelines for Equipment Using

Liquid Chemicals

Appendix 4 — Ionizing Radiation Test Validation

Appendix 5 — Non-Ionizing Radiation (Other than

Laser) and Fields Test Validation

SEMI S2-0703a

Appendix 6 — Fire Protection: Flowchart for Selecting

Materials of Construction

NOTICE: A new Appendix will be added (in

numerical order) upon July 1, 2006 publication as

shown in Delayed Revisions Section 1. The EH&S

Committee has voted that addition of this Appendix

section is OPTIONAL before the Effective Date.

2.3 Precedence of Sectional Requirements — In the

case of conflict between provisions in different sections

of this guideline, the section or subsection specifically

addressing the technical issue takes precedence over the

more general section or subsection.

NOTICE: This safety guideline does not purport to

address all of the safety issues associated with its use.

It is the responsibility of the users of this safety

guideline to establish appropriate safety and health

practices and determine the applicability of regulatory

or other limitations prior to use.

3 Limitations

3.1 This guideline is intended for use by supplier and

user as a reference for EHS considerations. It is not

intended to be used to verify compliance with local

regulatory requirements.

3.2 It is not the philosophy of this guideline to provide

all of the detailed EHS design criteria that may be

applied to semiconductor manufacturing equipment.

This guideline provides industry-specific criteria, and

refers to some of the many international codes,

regulations, standards, and specifications that should be

considered when designing semiconductor

manufacturing equipment.

3.3 Existing models and subsystems should continue to

meet the provisions of SEMI S2-93A. Models with

redesigns that significantly affect the EHS aspects of

the equipment should conform to the latest version of

SEMI S2. This guideline is not intended to be applied

retroactively.

3.4 In many cases, references to standards have been

incorporated into this guideline. These references do

not imply applicability of the entire standards, but only

of the sections referenced.

4 Referenced Standards

NOTICE: New Referenced Standards will be added

(in alphabetical or numerical order as appropriate)

upon July 1, 2006 publication as shown in Delayed

Revisions Section 1. The EH&S Committee has

voted that implementation of the information is

OPTIONAL before the effective date.

4.1 SEMI Standards

SEMI E6 — Facilities Interface Specifications

Guideline and Format

SEMI F5 — Guide for Gaseous Effluent Handling

SEMI F14 — Guide for the Design of Gas Source

Equipment Enclosures

SEMI F15 — Test Method for Enclosures Using Sulfur

Hexafluoride Tracer Gas and Gas Chromatography

SEMI S1 — Safety Guideline for Equipment Safety

Labels

SEMI S3 — Safety Guideline for Heated Chemical

Baths

SEMI S6 — Safety Guideline for Ventilation

SEMI S7 — Safety Guidelines for Environmental,

Safety, and Health (ESH) Evaluation of Semiconductor

Manufacturing Equipment

SEMI S8 — Safety Guidelines for Ergonomics

Engineering of Semiconductor Manufacturing

Equipment

SEMI S9 — Safety Guideline for Electrical Design

Verification Tests for Semiconductor Manufacturing

Equipment

SEMI S10 — Safety Guideline for Risk Assessment

SEMI S12 — Guidelines for Equipment

Decontamination

SEMI S13 — Safety Guidelines for Operation and

Maintenance Manuals Used with Semiconductor

Manufacturing Equipment

SEMI S14 — Safety Guidelines for Fire Risk

Assessment and Mitigation for Semiconductor

Manufacturing Equipment

4.2 ANSI Standards

ANSI/IEEE C95.1 — Standard for Safety Levels with

Respect to Human Exposure to Radio Frequency

Electromagnetic Fields, 3 kHz to 300 GHz

ANSI/RIA R15.06 — Industrial Robots and Robot

Systems -- Safety Requirements

ANSI/ISA S84.01 — Application of Safety

Instrumented Systems for the Process Industry

4.3 CEN/CENELEC Standards

1 American National Standards Institute, New York Office: 11 West

42nd Street, New York, NY 10036, USA. Telephone: 212.642.4900;

Fax: 212.398.0023 Website: www.ansi.org

2 European Committee for Standardization (CEN)/European

Committee for Electrotechnical Standardization (CENELEC), Central

Secretariat: rue de Stassart 35, B-1050 Brussels, Belgium