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SEMI E34-95 © SEM I 1995 3 HEALTH A N D SAFETY DISCLOSURE FORM FOR MASS FLOW DEVICE RET URN 1. Mass Flow Device Infor mation 1.1 Ma nufactur er __________ ________ __________ ________ 1.2 Mo del Nu mber ___ ______ ______…

SEMI E34-95 © SEMI 1995 2

• Attach a copy of the form to the exterior of the

shipping container.

• Enclose another copy inside the package attached

to the protective plastic bag containing the mass

flow device during shipment.

• Retain the original form for your records.

5.2 Purging Prior to Removal — Thoroughly purge

the mass flow device following the applicable purge

procedure. Purge procedures are usually unique to the

equipment and installation. Obtain purging procedures

from your facilities manager, corporate safety

department, and/or the equipment manufacturer. If a

formal purge procedure is available, note on the

disclosure form the purge procedure document number

and source.

5.3 Equipment Removal — WARNING: Do not

remove the mass flow device until it has been properly

purged.

5.3.1 The person removing the mass flow device

should fill out an orange-colored device tag indicating

the process gas(es) or chemicals used, possible exterior

contamination and the purge procedure document

number prior to removal of the device. A sample orange

device tag is shown in Figure 1.

Figure 1

Sample Orange Device Tag

5.3.2 Carefully remove the mass flow device from the

installation or system.

5.3.3 The inlet and outlet ports should be sealed to

prevent any leakage into or out of the mass flow device.

5.3.4 The person removing the mass flow device

should attach the orange tag to the device.

5.4 Equipment Packaging — Package all mass flow

devices for shipment per government regulations

including the following:

5.4.1 Seal the device in a protective container to

prevent the contamination of the shipping package. If

the orange tag is not visible through the container, an

additional tag should be attached to the outside of the

container.

5.4.2 Place the device in a shipping container with

adequate packing to avoid damage to the device and the

protective container during shipment.

5.5 Shipping — Ship the device so that it conforms to

all applicable regulations of the countries of origin,

trans-shipment, and destination governing the shipment

of materials.

SEMI E34-95 © SEMI 19953

HEALTH AND SAFETY DISCLOSURE FORM FOR MASS FLOW DEVICE RETURN

1. Mass Flow Device Information

1.1 Manufacturer ____________________________________

1.2 Model Number ____________________________________

1.3 Serial Number ____________________________________

1.4 Nameplate Gas __________ Nameplate Range ___________

1.5 Details of all substances to which the equipment has been exposed, Interior and Exterior:

Chemical name(s) and attach applicable MSDS(s)

Interior Exterior

a) _________________________________________________ o o

b) _________________________________________________ o o

c) _________________________________________________ o o

d) _________________________________________________ o o

1.6 Was this device purged with an inert gas? o Yes o No

1.7 Any further safety information that you consider to be relevant:

__________________________________________________

1.8 Document number and source of purge procedure used.

__________________________________________________

1.9 Person to contact regarding the above information:

Name:_______________________________________________

Company:____________________________________________

Title:________________________________________________

Phone Number: ( _______)__(______)__(__________)_(_____)

Country Code Area Code Number Extension

Address:_____________________________________________

__________________________________________________

Signature of Sender:____________________________________

1.10 Carrier to be used

__________________________________________________

Expected Delivery date

__________________________________________________

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E35-0305

GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR

SEMICONDUCTOR MANUFACTURING EQUIPMENT

This guide was technically approved by the Global Metrics Committee and is the direct responsibility of the

North American Metrics Committee. Current edition approved by the North American Regional Standards

Committee on December 10, 2004. Initially available at www.semi.org February 2005; to be published

March 2005. Originally published in 1995; previously published March 2004.

NOTICE: This document was completely rewritten in 2005.

1 Purpose

1.1 The purpose of this guide is to provide standard metrics for evaluating unit production cost effectiveness of

manufacturing equipment in the semiconductor industry.

1.2 This guide establishes a well-defined procedure to facilitate an understanding of equipment-related costs by

providing definitions, classifications, algorithms, methods, and default values necessary to build a full or constrained

cost of ownership (COO) calculator.

NOTE 1: Related Information 1 provides a graphical representation of calculating COO to expand upon the guide text.

2 Scope

2.1 This guide is applicable to any type of equipment for processing semiconductor units, which may be wafers,

devices, flat panels or other material. Some terms are specialized to integrated circuit wafer and device production.

2.2 Effective use of the metric to build a COO model requires identification of constraints and data values. Where

possible, use direct values for inputs rather than deriving them from secondary models or using example values.

NOTE 2: Related Information 2 provides some example data.

2.3 Full calculation of COO often requires data held proprietary and is coupled to the overall factory yield and the

related cost of yield loss. It is envisioned that this guide will be used for internal factory and equipment

optimization, investment evaluation, and equipment design improvements.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 Certain cost factors are more difficult than others to accurately determine. Figure 1 depicts the relationship of

some of the COO model input factors to ability to collect and validate them. The accuracy of a COO calculation

may be prone to a variety of errors or omissions.

3.2 Line balance considerations are not included in the COO calculation. Line balance considerations are not

included because it is difficult, in an individual COO model, to show the impact of equipment being modeled on the

complete manufacturing facility. A factory-level cost model should be used for this purpose.

3.3 A COO calculation may have more detail than presented explicitly in this guide. The structure of the guide,

however, allows for these situations.