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SEMI E49.2-1104 © SEMI 1995, 2004 3 6 Performance Guidelines Table 1 Ov er vie w of Recommende d Tests Test Frequency Performance Gu ideline Test Method/Reporting of Results Hydrostatic Pressure Ever y Assembly shipped t…

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SEMI E49.2-1104 © SEMI 1995, 2004 2
3 Limitations
3.1 For the purposes of this document, qualification
recommendations are limited to the purity and
mechanical integrity of Assemblies as outlined in the
purpose and scope. Qualification recommendations are
not intended to address any other operational
parameters (for example, flow capacity, flow rates,
reliability, chemical compatibility etc.).
3.2 This guideline does not define the purity
performance requirements of individual components,
which may be addressed by SEMI F57. Nor does this
document provide guidelines for the design and
manufacture of Assemblies, which may be addressed by
SEMI E49.7.
3.3 Facility distribution systems are also outside the
scope of this guideline.
3.4 Stainless steel or other non-polymeric Assemblies
are outside the scope of this document. Refer to SEMI
E49.4, SEMI E49.5, and SEMI E49.6 for information
on stainless steel components and Assemblies
.
3.5 This guideline is not intended to apply to
Assemblies used in the delivery of liquids that do not
contact the wafer’s surface, for example drainage and
cooling Assemblies.
4 Referenced Standards
4.1 SEMI Standards
SEMI C59 Specifications and Guidelines for
Nitrogen
SEMI E49.4 Guide for High Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.5 Guide for Ultrahigh Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.6 Guide For Subsystem Assembly and
Testing Procedures – Stainless Steel Systems
SEMI E49.7 Purity Guide For the Design and
Manufacture of Ultrapure Water and Liquid Chemical
Systems in Semiconductor Process Equipment
SEMI F57 Provisional Specification For Polymer
Components Used in Ultrapure Water and Liquid
Chemical Distribution Systems
SEMI F61 Guide for Ultrapure Water System Used
in Semiconductor Processing
4.2 ASTM Standards
1
ASTM D4327 Standard Test Method for Anions in
Water by Chemically Suppressed Ion Chromatography
ASTM D5997-96 Standard Test Method for On-
Line Monitoring of Total Carbon, Inorganic Carbon in
Water by Ultraviolet, Persulfate Oxidation, and
Membrane Conductivity Detection
4.3 Other Standards
Hydrostatic Pressure and Leak Testing of Polymer
Piping Systems Used in High-purity Water
Applications
2
5 Terminology
5.1 See Section 4 of SEMI E49.
5.2 For the purposes of this document, an “Assembly”
or “Assemblies” is defined as a combination of two or
more ultrapure water or liquid chemical delivery
components and is always capitalized when used in this
manner.
5.3 For the purposes of this document Assemblies
shipped to end users are those Assemblies sent to
semiconductor manufacturers which will not undergo
any additional testing, cleaning, or other qualification
processes. The semiconductor manufacturer may
perform additional testing outside the tests outlined by
this document.
5.4 For the purposes of this document “supply chain”
is defined as those manufacturers involved in producing
components, integrating or assembling components,
and testing Assemblies.
5.5 For the purposes of this document components
include but are not limited to all product covered by
SEMI 57 as well as product not covered by SEMI F57
such as pumps, storage tanks, drums, pressure vessels,
filter housing, sensors, monitors, or ultra-filtration, and
pumps.
5.6 NIST is the National Institute of Standards and
Technology.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555, Website:
www.astm.org
2 Mayer, Burkhart, Rydzewski, UltraPure Water Journal, May/June
2002, pp. 27-40
SEMI E49.2-1104 © SEMI 1995, 2004 3
6 Performance Guidelines
Table 1 Overview of Recommended Tests
Test Frequency Performance Guideline Test Method/Reporting
of Results
Hydrostatic Pressure Every Assembly shipped to
the end user
No visible leakage & < 5% pressure
decay
Section 9.1
Section 9.2
Ultrapure Water Flush Every Assembly shipped to
the end user
Resistivity: > 18 meg ohm-cm @
25°C (77°F)
Allowable TOC adders (ppb): <
7.5
Section 9.1
Section 9.3
Particle Periodic testing – see Section
10.7 and 10.8
Allowable Particle adders
(particles/L >
0.1 µm) : < 120
Section 9.1
Section 9.4
Ionic Contamination Periodic testing – see Sections
10.7 and 10.8
Allowable ionic adders (ppb):
F-: <
7.5
Cl-: <
0.40
NO
2
-, Br-, NO
3
-, HPO
4
=, SO
4
=
<
0.05
Section 9.1
Section 9.5
Metallic Contamination Periodic testing – see Sections
10.7 and 10.8
Allowable metallic adders (ppb):
Al, Ba, B, Ca, Cr, Cu, Fe, Pb, Li, Mg,
Mn, Ni, K, Na, Sr, and Zn:
<
0.02
Section 9.1
Section 9.5
NOTE 2: Table 1 provides an overview of the tests recommended within this document and associated performance criteria. For
detailed explanations of testing frequency, test methods, and some examples of tests, refer to the sections identified within the
table.
SEMI E49.2-1104 © SEMI 1995, 2004 4
7 Utility Recommendations
NOTE 3: These are minimum utility recommendations for
the media used during qualification of an Assembly.
7.1 Nitrogen
Nitrogen quality should meet requirements of
SEMI C59.
Particle filtration should be 99.99999% removal of
.003 micron particles.
7.2 Ultrapure Water
Resistivity 18 Mohm-cm @ 25°C (77°F)
TOC — < 10 ppb
Silica — < 5 ppb
Particles — (>
0.1 µm) < 500 particles/L
Anions (F-, Cl-, NO2-, Br-, NO3-, HPO4-, SO4-) <
0.10 ppb
Metals (Al, Ba, B, Ca, Cr, Cu, Fe, K, Li, Mg, Mn,
Na, Ni, Pb, Sr, Zn) < 0.05 ppb
Bacteria — < 10 colonies/100 milliliter
NOTE 4: If testing requirements dictate, access to higher
quality Ultrapure Water may be appropriate. Additional
information related to Ultrapure Water facility design and
terminology may be obtained in SEMI F61, Guide for
Ultrapure Water System Used in Semiconductor Processing.
7.3 Clean Dry Air (CDA) or Oil Free Air — Uses
include pneumatic control and air actuation. CDA is
not recommended for use on cleaned wetted surfaces.
Nitrogen is recommended for drying cleaned wetted
surfaces because the purity level is clearly defined and
controlled.
8 Related Documents
8.1 International SEMATECH Documents
3
SEMASPEC 92010936B — Provisional Test Method
for Determining Leachable Trace Inorganics in Ultra
Pure Water Distribution System Components
SEMASPEC 92010937B — Provisional Test Method
for the Evaluation of Bulk Polymer Samples of Ultra
Pure Water Distribution System Components
SEMASPEC 92010949B — Provisional Test Method
for Determining Particle Contribution and Retention by
Ultra Pure Water Distribution System Components
3 International SEMATECH, 2706 Montopolis Drive, Austin, TX
78741, USA, Website: www.sematech.org
SEMASPEC 92010955B — Provisional Test Method
for Analyzing Plastic Surface Condition of Ultra Pure
Water Distribution System Components (SEM Method)
8.2 ASTM Documents
ASTM D5173-97 Standard Test Method for On-
Line Monitoring of Carbon Compounds in Water by
Chemical Oxidation, by UV Light Oxidation, by Both,
or by High Temperature Combustion Followed by
NDIR or by Electrolytic Conductivity
9 Sampling and Analysis Methodology
9.1 General Recommendations for all Tests
9.1.1 All test reports should include:
Confidence intervals and detection or reporting
limits,
All units of measure,
As detailed a description as possible of the
Assembly tested including part number and
manufacturing date,
Date of test and initials of person performing test,
Additional information as specified in the specific
test recommendations within this document,
Any and all relevant data collected during testing
should be summarized and included,
Recording of Ultrapure Water and Nitrogen quality
used to perform test, and
For Sections 9.3 through 9.5 inlet and outlet water
quality.
9.1.2 Trained and qualified personnel should perform
all sampling and testing.
9.1.3 All instrumentation shall be calibrated with
standards traceable to NIST or the equivalent national
standard where those standards exist. The type of
instrument(s) manufacturer, model #, serial # or I.D #,
and most recent calibration date should be available.
9.1.4 If using two separate online instruments for inlet
and outlet testing, determine any difference in the two
readings and include that in the final calculations.
9.1.5 Incoming and outgoing water should be sampled
as close as possible to the Assembly’s liquid supply
point and the Assembly’s delivery point respectively.
Where there are multiple inlets and/or outlets for an
Assembly, a single representative inlet and outlet
should be selected for this testing. However, all inlets
and outlets should be flushed in a consistent manner