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SEMI IN TERNA TIONA L STANDA RDS MA TE RIA LS Sem iconduct or Equipm ent and Materials Inte rnational

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SEMI C60-0305 © SEMI 2005 8
APPENDIX 1
GENERAL ANALYTICAL PRACTICES
NOTICE: The material in this appendix is an official part of SEMI C59 and was approved by full letter ballot procedures on
December 10, 2004 by the North American Regional Standards Committee.
A1-1 Introduce the calibration standard as many times as necessary to achieve the desired precision.
A1-2 All the gases used in the analysis of the sample should not contain more than 10% of the specified value at
the component of interest, unless otherwise specified.
Back Flush Vent
Sample
Vent
Column 1
Methanizer
A
B
FID
Figure A1-1
Valving Arrangement
N O
2
To Analyzer
1. Pressure Reducer
(316SS) heat traced to
approximately 100°F.
2. Needle valve heat
traced to 100°F.
3. Relief valve (100 psig)
reseatable.
4. Pressure gauge
(0-100 psig).
5
. Fl
o
wm
ete
r.
Figure A1-2
Nitrous Oxide Cylinder Sample System
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI INTERNATIONAL STANDARDS
MATERIALS
Semiconductor Equipment and Materials International
SEMI M1-0305 © SEMI 1978, 2005 1
SEMI M1-0305
SPECIFICATIONS FOR POLISHED MONOCRYSTALLINE SILICON
WAFERS
This specification was technically approved by the Global Silicon Wafer Committee and is the direct
responsibility of the North American Silicon Wafer Committee. Current edition approved by the North
American Regional Standards Committee on November 4, 2005. Initially available at www.semi.org
February 2005; to be published March 2005. Originally published in 1978; previously published July 2004.
NOTICE: This standard was completely rewritten in 2005.
Table of Contents
1 Purpose .....................................................................................................................................................................3
2 Scope ........................................................................................................................................................................3
3 Referenced Standards ...............................................................................................................................................4
4 Terminology .............................................................................................................................................................8
5 Ordering Information................................................................................................................................................8
6 Requirements ............................................................................................................................................................9
6.1 General Characteristics ......................................................................................................................................9
6.2 Electrical Characteristics .................................................................................................................................20
6.3 Chemical Characteristics .................................................................................................................................20
6.4 Structural Characteristics.................................................................................................................................20
6.5 Wafer Preparation Characteristics ...................................................................................................................20
6.5.1 Wafer ID Marking ......................................................................................................................................20
6.5.2 Other...........................................................................................................................................................21
6.6 Dimensional Characteristics ............................................................................................................................22
6.6.1 Dimensions and Fiducials...........................................................................................................................22
6.6.2 Edge Profile................................................................................................................................................22
6.6.3 Shape ..........................................................................................................................................................31
6.6.4 Standard Wafer Categories.........................................................................................................................31
6.6.5 Flatness.......................................................................................................................................................31
6.6.6 Nanotopography .........................................................................................................................................31
6.7 Front Surface Chemistry ..................................................................................................................................31
6.8 Front and Back Surface Inspection Characteristics..........................................................................................31
7 Basic Specification Requirements ..........................................................................................................................33
8 Sampling.................................................................................................................................................................35
9 Test Methods ..........................................................................................................................................................35
10 Certification ............................................................................................................................................................35
11 Product Labeling.....................................................................................................................................................35
12 Packing and Shipping Container Labeling..............................................................................................................36
Appendix 1 Flatness Decision Tree............................................................................................................................37
A1-1 Scope ............................................................................................................................................................37
A1-2 Use of the Flatness Decision Tree ................................................................................................................37
A1-3 Future Developments....................................................................................................................................39
Appendix 2 Shape Decision Tree ...............................................................................................................................40
A2-1 Scope ............................................................................................................................................................40
A2-2 Use of the Shape Decision Tree....................................................................................................................40
Related Information 1 Surface Metal Contamination.............................................................................
....................43
R1-1 Scope.............................................................................................................................................................43
R1-2 Suggested Allowable Surface Metal Contamination Levels for 1 m Geometries.......................................43
R1-3 Test Methods.................................................................................................................................................43
Related Information 2 Test Methods ..........................................................................................................................44
R2-1 Scope.............................................................................................................................................................44
R2-2 Referenced Standards....................................................................................................................................44
R2-3 General Characteristics .................................................................................................................................45