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SEMI T13-1104 © SEMI 2004 7 9.2 UML representation — The diagram above is modeling of Tracing Capability fo r Dice in UML diagram. It is not required to make systems with obj ect oriented pr ogramming language compliant …

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SEMI T13-1104 © SEMI 2004 6
metrology data, inspection results, test results, and sorting information. If dice on such substrate as wafer and PCB
are processed, all dice share data for the substrate. This case a part of data for a die links to the substrate data. If a
group of dice or substrates which is referred to as a lot is processed at a time or in the same environment, die trace
data for one of the dice links to the lot.
8.8 Die Trace System and its Clients — Die Trace System keeps collecting expected Die Trace Data on Equipment
or some other entities in a fab. A Client asks the system to make specific information for die tracing about one or
more dice. Client may give some fault information to the system to find out the cause of the fault. When the system
discovers a potential problem, it may notify an alert. Die Tracer is a closest entrance to Die Trace System.
8.9 Tracer and Machine — To reduce ambiguity or burdensome discussion and to make a process conspicuous, this
document highlights die trace data of a process or on a piece of equipment from the ensemble of data. In this aspect
data tracking entity, or a snapshot of the system, is referred to as ‘Tracer’ and entity to execute the process is called
as ‘Machine’ to discriminate from physical equipment.
VIT
VIT
ask
Material /
Acceptance
Database
Die Trace
Data (DTD)
WIP
Computer
Machine
Die Trace Data
Tracer
Defect Analysis System
Inspection
Tool (VIT)
Review Tool
Tracer / Client
Supplier
Database
Tracer
Die Trace
Data (DTD)
Die Tr ace
Data (DTD)
Figure 2
Example of Tracers with/without Machine
9 Basic Concepts
9.1 Domain Analysis and Object Based Modeling — To model and design complicated system or to have shared
specification of a part of system which is used widely in deferent applications, some sophisticated methodologies are
required. Analyzing problem domain by object oriented paradigm is one of the best practices to be taken. Because
this technology is frequently used in many SEMI standards, there is no confusion if this document follows the way.
Client
collects
1..*
1
..*
asks
Tracer
Machine
0..*
Figure 3
Die Trace Cell Model
SEMI T13-1104 © SEMI 2004 7
9.2 UML representation — The diagram above is
modeling of Tracing Capability for Dice in UML
diagram. It is not required to make systems with object
oriented programming language compliant to this
specification. Even if UML is typical object oriented
representation, object oriented implementation may be
expected but may not be mandatory.
9.3 Ensemble Modeling — Die tracing can be done at
any stage of process. Collected data on such different
processes for a specific die are linked together and
accumulated as a serialized one Die Trace Data.
Because the serialized data is an ensemble of snapshot
data of each key process stage. This document models
such snapshot of the ensemble as depicted above Figure
1.
9.3.1 Die Trace Machine Object (Machine) — This is
an instance of Die Trace Machine class (Machine). The
Machine acquires Die Trace Data and reports the data
to associated Tracer.
9.3.1.1 Special Machines — However Die Trace
Machines are often physical equipment, they may be
sometimes such non-automated entities as human
assisted semi-automated manufacturing tools and
handcraft processes. Die Trace Machine is any entity to
process products or make metrology assistance and
have capability to report Due Trace Data on the shop
flower of semiconductor device manufacturing. They
need to manufacture exactly and input at the terminal
by the process or record on work schedule pad for later
input in the office.
9.3.2 Die Tracer Object (Tracer) — This is an instance
of Die Trace class (Tracer). The Tracer collects Die
Trace Data reported by Die Trace Machine below. The
Tracer searches Die Trace Data as requested by Die
Trace Client. Figure 3 is a class model of a cell which
consists of a Tracer and its reporting Machines.
9.3.2.1 Data Searching Chain — Because the Tracer
inherits Client class, the Tracer can ask the other Tracer
when it doesn’t have enough data to respond a request.
Because the Tracer knows very specific type of Tracer,
the inquiring chain is usually restarted at the specific
Tracer.
9.3.2.2 Data Source of Tracer — There are different
kinds of data source from the Machine. Sometimes such
entities as controlling computers, database systems and
their software processes or application programs could
be data source of Die Tracer. The controlling computers
may be called as Manufacturing Execution System
(MES), Work In Process (WIP) computer, Host
computer, Cell Controller and so on.
9.3.3 Die Trace Client Object (Client) — This is an
instance of Die Trace Client class (Client). Basically
the Client asks some Die Trace Data set, asks searching
Die Trace Data or sets expecting data items to be
collected next. At the same time some specific Client
may be asked to register concerning phenomena happen
on specific product or specific production group, or
notify serious problem potentially happens on specific
product or production group to possible customers or
quality assurance database computer of semiconductor
device manufacturer.
9.4 Die Trace Data Hierarchy and Linkage — As
described very briefly in Section 8.7 Data Taxonomy,
whole substrate trace data may complement die trace
data on the substrate. They should be linked by some
means to keep the relation. Possible data hierarchy is as
below.
9.4.1 Die Trace Data (DTD)— This is a generic class
of any kind of Die Trace Data. This class represents
basic concept and primitive nature of data acquired for
Die Tracing. Any objects instanced for this class or its
derived class have following responsibility.
9.4.1.1 Die Trace Data Class Definition — Die Trace
Data must have such attribute as ID, Type and etc. as
depicted on Figure 4. These attributes cannot be
changed because they are proper for a specific object.
Because this document doesn’t intend these attributes to
be accessed directly but just for reference to specify
services to access or make use of these attributes. This
class is used to discuss and handle generic issues of any
subclasses.
9.4.1.1.1 Target Material — Die Trace Data need to
specify intended material. Die Trace Data must have an
attribute for the purpose and it shall provide a service to
identify the target material.
9.4.1.1.2 Data Representation — Actual Data may be
contained in its object as an attribute if amount of data
is relatively small. However it may be stored in such
independent entity as files or database and referenced
with an attribute of this class if the data is relatively
large and the attribute for data value must be null. This
case it is suggested to take care of the separated data
value not to be removed. Storage system often may not
notify or ask when related data is removed. It may be
better to have another copy of the important data
somewhere in Die Tracing System. It is recommended
to use any Universal Resource Identifier (URI) for data
value reference to access without confusion.
9.4.1.2 Responsibility of Die Trace Data — Because
Die Trace Data class is to be data container or data
label, responsibility of this class is to play the role.
9.4.1.3 Services of Die Trace Data — To complete the
responsibility, this class provides following services.
SEMI T13-1104 © SEMI 2004 8
DieTraceData
showProperty
showData
ID
Type
CircuitModule
DataReference
DataValue
Figure 4
Die Trace Data Class
9.4.1.3.1 showProperty — This service returns all or a part of attributes of this object except actual Die Trace Data
value.
9.4.1.3.2 showData — This service returns actual Die Trace Data value regardless whether it is contained in this
object or separated entity.
9.4.1.4 Behavior of Die Trace Data — Behavior is defined to complete responsibility of the Die Trace Data. The
behavior is often specified through collaboration with outside of this class and state model. Because this class has
services to access internal attributes including referenced data value, it defines no collaboration. Also this class
defines no state model for it is stateless.
Die-trace Map
Data (DMD)
Die-trace Die
Data (DDD)
Die-trace Substrate
Data (DSD)
Die-trace Lot
Data (DLD)
Die-trace Batch
Data (DBD)
1..*
Die
Die Trace Data
(DTD)
com
p
lements
com
p
lements
com
p
lements
com
p
lements
charac terized
Substrate
charac terized
Lot
characterized
Batch
characterized
1
..* 1..*
1
..*
0
..* 0..* 0..1 0..1
Figure 5
Die Trace Data Hierarchy, Associations and Linkages