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SEMI PR9-0705 © SEMI 2005 9 9.4.9 Test for shoc k and vibrati on. Check for operation a n d l eak integrity before and afte r testing. MIL-STD 810 9.4.10 Test for performance at maximum and minimum voltages based on prod…

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8.6.4 Fluid leak test. Visual inspection, pressure drop test (time to lose pressure).
8.6.5 Helium leak test (any existing standards we can refer to?)
8.6.6 Temperature cycles. Cycle parts in the expected application environments that the components will be
exposed to or in an acceleration chamber with controlled temperature.
8.6.7 In case of disposable devices, only a small sample size from a product lot can be tested. Detailed test plans
can be found in subsystem guidelines.
8.7 An example with a diagram is desired. See Figures 1–4.
9 Subsystem Guidelines
9.1 Purpose — Provide guidance for assembly and testing of Microfluidic subsystems, considering applicable
performance and operating specifications. Examples of performance characteristics are response time, accuracy,
reliability, drydown, and cleanliness.
9.2 Scope — These guidelines are limited to macro sealing and macro to micro sealing. It specifically excludes
wafer-scale testing. They address interconnection (fluidic, electrical, and other) of the microfluidic subsystem to the
external system. They also address interconnection of individual components within the microfluidic subsystem.
9.3 Assembly and Test Preparation
9.3.1 Visually inspect parts under microscope before assembly. Perform any testing possible at the MEMS
component level as characterization or to determine failures before integrating.
9.3.2 Assemble under hoods or in cleanroom. Wear gloves. Use electrostatic protection. Assembly should be in
the same class environment as required by user. See SEMI E129.
9.3.3 Follow manufacturer’s instructions for tightening fittings and seals and connecting parts. If applicable,
measure torque or other assembly parameters. Subsystem should have means or method to hold part being tightened
to not compromise the structural integrity of the part.
9.3.4 Seals used to connect components should be considered for thermal performance, cleanliness, and material
compatibility. See ¶9.4.?.
9.3.5 Test systems should have filters installed upstream of the device under test. Select pore size similar to pore
size used in final application.
9.4 Verification and Validation
9.4.1 The following are guidelines for verification and validation. Some may also apply to production testing.
9.4.2 Test for particles and for other contamination characteristics such as moisture dry down as required by end
user as a system. See ASTM F1394 (particle), SEMI E66 (particle), ASTM F1397 (moisture).
9.4.3 Test for applicable performance parameters such as accuracy using NIST traceable standards. Time or
process response characterizations should model system and connection volumes, based on specification designed
for. If the final application can not be duplicated, consider final system in the data analysis. For faster process time
minimize volume and surface area between the flow control system and chamber. Test in gas or liquid that it will be
used with or list substitute/test gas or liquid on test report.
9.4.4 Cycle parts in environment that they will be used in or in an accelerated mode. This is to model mean time to
failure or other parameters of reliability. At intervals test for most important performance or operating parameters.
See ASTM F1394, ASTM F1373.
9.4.5
Leak test mechanical connections using inboard leak detection method. For positive shut-off components test
for leak across the seat. Reference SEMI F1.
9.4.6 Test for performance at maximum and minimum temperatures based on product specifications.
9.4.7 Test for performance at maximum and minimum pressures (input and output) based on product specifications.
9.4.8 Test for burst and proof pressures, Reference SEMI E28.
SEMI PR9-0705 © SEMI 2005 9
9.4.9 Test for shock and vibration. Check for operation and leak integrity before and after testing. MIL-STD 810
9.4.10 Test for performance at maximum and minimum voltages based on product specifications.
9.4.11 Perform electrical testing and validation. Check for power consumption, response time, noise, dielectric
breakdown, resistance fluctuations, others?
9.4.12 Test for compatibility with typical, operating and/or specified fluids for validation testing.
9.4.12.1 See Figures 1–4 of a MEMS System with subsystem fluidic interface features.
9.4.12.2 Courtesy Redwood MicroSystems
Figure 1
Mechanical Drawing Showing MEMS System
SEMI PR9-0705 © SEMI 2005 10
(A)
Package with Shut-off
Valve and Mass Flow Controller
(B)
Panel in Enclosure Consistency of Six
Packages. Applications Include Gas
Chromatography, Analytical
Instrumentation, Semiconductor
Processing.
Figure 2
Figure 3
Mechanical Drawing Showing MEMS Subsystem and Fluidic Adaptor