semi合集-English.pdf - 第5967页

SEMI P41-0304 E © SEMI 2004 27 <ImageReference origin = "mask origin"> <ImageReferencePoint >center</ImageReferencePoint> < I m a g e R e f e r e n c ePosition unit = "micron">…

SEMI P41-0304

</ImageInformation>

</ImageConvertInformation>

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<ImageReferencePosition_Y></ImageReferencePosition_Y>

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</ImageReference>

<ImageTargetPosition_X></ImageTargetPosition_X>

<ImageTargetPosition_Y></ImageTargetPosition_Y>

</ImageTargetPosition>

</ImageTarget>

</ImageData>

</DefectRepair>

<EvaluationCondition>parameter1-000 parameter2-000</EvaluationCondition>

</EvaluationRecipe>

<ImageReferenceAdress>D:\review\image\image001.bmp</ImageReferenceAdress>

<ImageFormat>bitmap</ImageFormat>

<ImagePixelNumber_X>2048</ImagePixelNumber_X>

<ImagePixelNumber_Y>2048</ImagePixelNumber_Y>

<ImagePixelSize_X>10</ImagePixelSize_X>

<ImagePixelSize_Y>10</ImagePixelSize_Y>

</ImagePixelSize>

</ImageInformation>

<ImageIllumination>transmission</ImageIllumination>

<ImageMirror>y-mirror</ImageMirror>

<ImageConversionParameter>convert 8bit from 12bit</ImageConversionParameter>

</ImageConvertInformation>

SEMI P41-0304

<ImageReferencePoint>center</ImageReferencePoint>

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SEMI P42-0304 © SEMI 2004 1

SEMI P42-0304

SPECIFICATION OF RETICLE DATA FOR AUTOMATIC RECIPE

TRANSFER TO WAFER EXPOSURE SYSTEM

This specification was technically approved by the Global Micropatterning Committee and is the direct

responsibility of the Japanese Micropatterning Committee. Current edition approved by the Japanese

Regional Standards Committee on January 9, 2004. Initially available at www.semi.org February 2004; to be

published March 2004.

1 Purpose

1.1 This specification defines a common data interface,

which consists of frame information of reticle data, in

order to prepare recipes for wafer exposure tools. By

utilizing this interface, it becomes possible to carry out

data handling between design and wafer manufacture so

that the data can be reused during recipe making of

wafer exposure tools. This standard is intended to

assist automatic recipe generation of wafer exposure

tools.

2 Scope

2.1 This standard details frame information in

automatic recipe preparation for wafer exposure

equipment. This standard focuses on communication

interface in work flow of design, mask manufacturing,

and wafer manufacturing processes.

2.1.1 This standard defines the items of the required

and common design information at a reticle design and

a recipe preparation for wafer exposure equipment.

2.1.2 This standard defines a data interface, which can

be commonly used independently to the suppliers and

models of exposure equipment.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This data interface is expandable (an item addition

and a user definition are enabled) instead of fixed, and

serves as a form with flexibility.

3.2 This standard uses the current XML standard to

describe a reticle data interface.

3.3 This standard does not provide the definition of the

handling interface of device design data. Only the data

interface specific to frame data information is defined.

3.4 The wafer map information by reticle frame data

and the wafer, which exposure equipment uses, are

defined in this standard.

3.5 This standard includes the handling items of the

related information for reticle exposure and a mark

formation process (reticle) required for automatic recipe

preparation.

3.6 Recipe preparation is shown in Figure 1. This

document focuses on reticle data management (RDM)

interface (IF) as indicated in Figure 1.

4 Referenced Standards

4.1 JEITA Documents

Reticle Data Management Guideline Ver.1.0 (2001) —

(http://jeita-smtc.elisasp.net/)

4.2 World Wide Web Consortium Documents

Extensible Markup Language (XML) 1.0 (Second

Edition) — W3C,6 October 2000

(

http://www.w3.org/TR/2000/REC-xml-20001006)

Extensible Markup Language (XML) 1.1 — W3C,15

October 2002 (

http://www.w3.org/TR/2002/CR-xml11-

20021015)

Extensible Markup Language (XML) 1.1 ― 15 October

2002, John Cowan (

http://www.w3.org/TR/2002/CR-

xml-names11-20021218/)

Namespaces in XML — W3C, 14 January 1999

(

http://www.w3.org/TR/1999/REC-xml-names-

19990114/)

XML Schema Part 0: Primer — W3C, 2 May 2001

(

http://www/w3/org/TR/xmlschema-0/)

XML Schema Part 1: Structures — W3C, 2 May 2001

(

http://www/w3/org/TR/xmlschema-1/)

XML Schema Part 2: Datatypes — W3C, 2 May 2001

(

http://www/w3/org/TR/xmlschema-2/)

1 Japanese Electronic and Information Technology Industries

Association, Tokyo Chamber of Commerce and Industry Bldg. 2-2,

Marunouchi 3-chome, Chiyoda-ku, Tokyo 100-0005, Japan. Website:

http://www.jeita.or.jp

2 World Wide Web Consortium (W3C), ,Website:

http://www.w3c.or