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SEMI M38-1104 © SEMI 1999, 2004 5 Item Mechanical Furna ce Particle Lithography 8.4 Localized Light Scatterers Unspecified  0.20/cm 2 @  0.20  m 8.5 Contamination/area Unspecified None 8.6 Edge Chips Unspecified None …

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SEMI M38-1104 © SEMI 1999, 2004 4
Item Mechanical Furnace Particle Lithography
6.0
Mechanical Characteristics
6.1 Diameter
150 mm ± 0.50 mm
200 mm ± 0.50 mm
300 mm ± 0.50 mm
6.2 Primary Flat/Notch Dimension As-supplied
6.3 Primary Flat/Notch Orientation As-supplied
6.4 Secondary Flat Dimension (if Applicable) As-supplied
6.5 Secondary Flat Location (if Applicable) As-supplied
6.6 Edge Profile Unspecified
6.7 Thickness
150 mm (SEMI M1.8) 533–675 µm
150 mm (SEMI M1.13) 585–725 µm
200 mm 600–775 µm
300 mm 650–800 µm
6.8 Thickness Variation (TTV) Unspecified
6.9 Surface Orientation As-supplied
6.10 Bow Unspecified
6.11 Warp (for diameters other than 300 mm) Unspecified
Warp (for 300 mm only) Unspecified
6.12 Sori Unspecified Customer
specified
6.13 Flatness/Global Unspecified Customer
specified
6.14 Flatness/Site Unspecified Customer
specified
7.0
Front Surface Chemistry
7.1 Surface Metal Contamination
Sodium Unspecified Customer
specified
Unspecified
Aluminum Unspecified Customer
specified
Unspecified
Potassium Unspecified Customer
specified
Unspecified
Chromium Unspecified Customer
specified
Unspecified
Iron Unspecified Customer
specified
Unspecified
Nickel Unspecified Customer
specified
Unspecified
Copper Unspecified Customer
specified
Unspecified
Zinc Unspecified Customer
specified
Unspecified
7.2 Surface Organics Unspecified
8.0
Front Surface Visual Characteristics
8.1A Scratches (macro) – total length Unspecified None
8.1B Scratches (micro) – total length Unspecified
0.10 × Diameter
8.2 Pits Unspecified Customer specified
8.3 Haze Unspecified Customer specified
SEMI M38-1104 © SEMI 1999, 2004 5
Item Mechanical Furnace Particle Lithography
8.4 Localized Light Scatterers Unspecified
0.20/cm
2
@ 0.20 m
8.5 Contamination/area Unspecified None
8.6 Edge Chips Unspecified None
8.7 Edge Cracks Unspecified None
8.8 Cracks, Crow's feet Unspecified None
8.9 Craters Unspecified None
8.10 Dimples Unspecified None
8.11 Grooves Unspecified None
8.12 Mounds Unspecified None
8.13 Orange Peel Unspecified None
8.14 Saw Marks Unspecified None
9.0
Back Surface Characteristics
9.1 Edge Chips Unspecified None
9.6 Roughness Unspecified Customer specified
9.7A Brightness (gloss) (150 & 200 mm) Unspecified
9.7B Brightness (gloss) (300 mm)
80%
9.8 Localized Light Scatterers Unspecified Customer specified
9.9A Scratches (macro) Unspecified
0.25 × Diameter
9.9B Scratches (micro) Unspecified
10.0
Other Characteristics
TBD Edge condition
150 mm Unspecified
200 mm and 300 mm Unspecified Customer specified
Table 2 Specifications for 2", 3", 100 mm, and 125 mm Silicon Reclaim Wafers
Item Mechanical Furnace Particle Lithography
1.0
General Characteristics
1.1 Growth Method As-supplied
1.2 Crystal Orientation As-supplied
1.3 Conductivity Type As-supplied
1.4 Dopant As-supplied
1.5 Nominal Edge Exclusion Distance for FQA Unspecified Customer specified
2.0
Electrical Characteristics
2.1 Resistivity Customer specified
2.2 Radial Resistivity Variation (RRG) Unspecified
2.3 Resistivity Striations Unspecified
2.4 Minority Carrier Lifetime Unspecified
3.0
Chemical Characteristics
3.1 Oxygen Concentration Unspecified As-supplied Unspecified
3.2 Radial Oxygen Variation Unspecified As-supplied Unspecified
3.3 Carbon Concentration Unspecified As-supplied Unspecified
4.0
Structural Characteristics
4.1 Dislocation Etch Pit Density Unspecified None
4.2 Slip Unspecified None
4.3 Lineage Unspecified None
4.4 Twins Unspecified None
SEMI M38-1104 © SEMI 1999, 2004 6
Item Mechanical Furnace Particle Lithography
4.5 Swirl Unspecified
4.6 Shallow Pits Unspecified
4.7 OISF Unspecified
4.8 Oxide Precipitates Unspecified
5.0
Wafer Preparation Characteristics
5.1 Wafer ID Marking Customer specified
5.2 Front Surface Thin Films Unspecified None Unspecified None
5.3 Denuded Zone Unspecified
5.4 Extrinsic Gettering Unspecified None Unspecified None
5.5 Backseal Unspecified None Unspecified None
5.6 Annealing Unspecified
6.0
Mechanical Characteristics
6.1 Diameter
2.00 inch ± 0.020 inch
3.00 inch ± 0.025 inch
100 mm ± 0.50 mm
125 mm ± 0.50 mm
6.2 Primary Flat/Notch Dimension As-supplied
6.3 Primary Flat/Notch Orientation As-supplied
6.4 Secondary Flat Dimension (if applicable) As-supplied
6.5 Secondary Flat Location (if applicable) As-supplied
6.6 Edge Profile Unspecified
6.7 Thickness
2.00 inch 0.008–0.013 in
3.00 inch 0.012–0.018 in
100 mm (SEMI M1.5) 432–575 µm
100 mm (SEMI M1.6) 533–675 µm
125 mm 533–675 µm
6.8 Thickness Variation (TTV) Unspecified
6.9 Surface Orientation As-supplied
6.10 Bow Unspecified
6.11 Warp Unspecified
6.12 Sori Unspecified Customer
specified
6.13 Flatness/Global Unspecified Customer
specified
6.14 Flatness/Site Unspecified Customer
specified
7.0
Front Surface Chemistry
7.1 Surface Metal Contamination
Sodium Unspecified Customer
specified
Unspecified
Aluminum Unspecified Customer
specified
Unspecified
Potassium Unspecified Customer
specified
Unspecified
Chromium Unspecified Customer
specified
Unspecified