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SEMI G72.1-099 7 © SEMI 1997 3 Table 2 292 Pin Pl astic Ball Grid A rray 27x27 m m Bod y Design Des ign No. PBD0001 SEMI Standar d BGA Design Li brary Revision Initi al Date 6/20/96 Page 2 of 8 PBGA Wire Bond P ad (*1) S…

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SEMI G72.1-0997 © SEMI 1997 2
Figure 1
292 Pin Plastic Ball Grid Array 27 x 27 mm Body Design
SEMI G72.1-0997 © SEMI 19973
Table 2 292 Pin Plastic Ball Grid Array 27x27 mm Body Design
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
w/b ring 1 A1 3
230 A2 4
225 A3 4
222 A4 4
218 A5 4
215 A6 4
213 A7 4
210 A8 4
206 A9 4
202 A10 4
201 A11 4
198 A12 4
194 A13 4
191 A14 4
188 A15 4
184 A16 4
181 A17 4
180 A18 4
175 A19 4
174 A20 3
1B1 1
229 B2 4
228 B3 4
224 B4 4
221 B5 4
217 B6 4
214 B7 4
211 B8 4
207 B9 4
203 B10 4
199 B11 4
197 B12 4
193 B13 4
190 B14 4
187 B15 4
183 B16 4
177 B17 4
176 B18 4
173 B19 3
171 B20 3
6C1 1
2C2 1
231 C3 4
SEMI G72.1-0997 © SEMI 1997 4
Design No.
PBD0001 SEMI Standard BGA Design Library Revision Initial
Date
6/20/96
Page
2 of 8
PBGA Wire
Bond Pad (*1)
Solder Ball
Location
Die Wire Bond
Pad I/O Name (& Comments) (*4)
Pkg.
Side (*1) Notes
227 C4 4
223 C5 4
220 C6 4
216 C7 4
212 C8 4
208 C9 4
204 C10 4
200 C11 4
196 C12 4
192 C13 4
189 C14 4
185 C15 4
182 C16 4
178 C17 4
172 C18 3
170 C19 3
167 C20 3
7D1 1
3D2 1
4D3 1
w/b ring 1 D4 3
226 D5 4
w/b ring 2 D6 2
219 D7 4
w/b ring 1 D8 3
209 D9 4
205 D10 4
w/b ring 2 D11 2
195 D12 4
w/b ring 1 D13 3
186 D14 4
w/b ring 2 D15 2
179 D16 4
w/b ring 1 D17 3
169 D18 3
166 D19 3
164 D20 3
10 E1 1
9E2 1
8E3 1
5E4 1
168 E17 3
165 E18 3
163 E19 3