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SEMI P2-0298 © SE MI 1988, 1998 4 Characte ristic Meas ured Prope rty Variable Fixed Con ditions Test M ethods Rinse ty pe(s) Agitation/Spray Softba ke Environm ent Rinse latitude As a bove Composition As a bove Deve lop…

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SEMI P9-0298 © SEMI 1988, 19983
Table 3 Sustaining Tests — Imaging
Characteristic Measured Property Variable Fixed Conditions Test Methods
Focus Resolution Focus Substrate
Exposure energy Film thickness
Exposure method
Exposure conditions
Measurement method
Developer type
Developer normality
Development time
Development method
Rinse type(s)
Agitation/Spray
Development time
Softbake
Environment
Exposure requirements Line width Exposure energy As above ASTM F 527
Image size ASTM F 528
Table 4 Extended Testing — Resist Coating
Characteristic Measured Property Variable Fixed Conditions Test Methods
Planarization Film thickness variation Film thickness Coating method
Topography Spin speed
Softbake
Environment
Orientation of topography
Table 5 Extended Testing — Imaging
Characteristic Measured Property Variable Fixed Conditions Test Methods
Focus latitude Line width Exposure energy Substrate
Film thickness variation Focus Film thickness
Resolution Exposure method
Exposure conditions
Line width
Developer type
Developer normality
Development time
Development method
Rinse type(s)
Agitation/Spray
Softbake
Environment
Exposure latitude As above Exposure energy As above
Development latitude As above Development normality Line width
Contrast Development time Exposure conditions ASTM F 1059
Threshold energy Development temperature Developer type
Exposure energy Development method
SEMI P2-0298 © SEMI 1988, 1998 4
Characteristic Measured Property Variable Fixed Conditions Test Methods
Rinse type(s)
Agitation/Spray
Softbake
Environment
Rinse latitude As above Composition As above
Developer overlap
Rinse time
Softbake latitude As above Softbake time Line width
Softbake temperature Exposure energy
Exposure conditions
Exposure energy Film thickness
Ramp rate
Development conditions
Environment
Thickness latitude As above Film thickness As above
Exposed Energy Substrate
Resolution As above Exposure method Substrate
Exposure energy Exposure energy
Film thickness Exposure conditions
Development conditions Measurement method
Softbake conditions Developer type
Development method
Rinse type(s)
Agitation/Spray
Focus
Softbake
Environment
Resist profile Wall angle As above As above
Corner rounding Pre/Post treatment Hardbake conditions
Shape
SEMI P9-0298 © SEMI 1988, 19985
Table 6 Extended Testing — Processing
Characteristic Measured Property Variable Fixed Conditions Test Methods
Thermal image stability Shape Temperature Post exposure
Wall angle Line width Image hardening
Ramp rate
Corner rounding Line width
Line width Film thickness
Film integrity Environment
Wet etch adhesion (undercut/side) Line width (top & bottom) Etch time Substrate ASTM F 518
Etch temp Etch composition
Temperature
Resist treatment
Developer
Wet etch adhesion (bias) Line width etch-resist As above As above
Dry etch resistance Film thickness Hardbake conditions Ion
Line width Image hardening Process gases
Surface appearance Process conditions
Ion implant effects Outgassing Hardbake conditions Ion
Film integrity Image hardening Power
Temperature
Film thickness
Resist removal Removal rate Hardbake conditions Stripping time
Residue Post processing Stripping temperature
Particles Removal method
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