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SEMI E119-1104 © SEMI 2002, 2004 2 SEMI M1.15 — Standard for 300 mm Po lished Monocrystalline Silicon Wafers (No tched) SEMI M31 — Provi sional Mech anical Spec ification for Front-Openi ng Shipping Box Used to Tr anspor…
SEMI E119-1104 © SEMI 2002, 2004 1
SEMI E119-1104
MECHANICAL SPECIFICATION FOR REDUCED-PITCH FRONT-
OPENING BOX FOR INTERFACTORY TRANSPORT OF 300 mm
WAFERS
This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is
the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Regional Standards Committee on August 16, 2004. Initially available at
www.semi.org September 2004; to be published November 2004. Originally published November 2002.
1 Purpose
1.1 This standard partially specifies a reduced-pitch
front-opening box for interfactory transport of 300 mm
wafers (FOBIT). This reduced-pitch box, with a
capacity of 25 wafers but with the approximate physical
volume of a 13-wafer FOUP, is intended to reduce the
cost of transporting wafers between IC manufacturing
sites. To leverage current industry 300 mm technology,
this reduced-pitch front-opening box is intended to
interface with 13-wafer FIMS, as specified in SEMI
E62.
2 Scope
2.1 This standard is intended to set an appropriate level
of specification that places minimal limits on
innovation while ensuring modularity and inter-
changeability at all mechanical interfaces. Only the
physical interfaces for FOBIT are specified; no
materials requirements or micro-contamination limits
are given. However, this standard has been written so
that both metal and injection-molded plastic FOBITs
can be manufactured in conformance with it.
2.2 This standard assumes that the FOBIT is intended
for use in the interfactory transportation of wafers. The
following boundary conditions were used in the
creation of this specification:
Minimizing the pitch between wafers will reduce
the cost of transporting wafers.
The FOBIT will be used for interfactory
transportation of both processed and unprocessed
wafers.
The box will have a 25-wafer capacity.
Random access of wafers, using edge grip handling
devices, is not a requirement for this standard.
The FOBIT will be compatible with the following
300 mm Standards:
13-wafer FIMS Interface (SEMI E62)
300 mm Load Port (SEMI E15.1)
Kinematic Coupling (SEMI E57)
The FOBIT will not necessarily be compliant with
the following 300 mm Standards due to wafer
restraint requirements and product applications
during transportation:
300 mm Front-Opening Unified Pod (SEMI E47.1)
300 mm Open Cassette (SEMI E1.9)
300 mm Front-Opening Shipping Box (SEMI
M31)
The technical requirements of this standard are
written for the transportation of nominal thickness
wafers, as defined by SEMI M1.15.
2.3 This reduced-pitch, 25-capacity FOBIT is designed
for use with the 13-capacity FIMS interface, as
specified in SEMI E62.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E1.9 — Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E15 — Specification for Tool Load Port
SEMI E15.1 — Specification for 300 mm Tool Load
Port
SEMI E47.1 — Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 — Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E62 — Provisional Specification for 300 mm
Front-Opening Interface Mechanical Standard (FIMS)
SEMI E119-1104 © SEMI 2002, 2004 2
SEMI M1.15 — Standard for 300 mm Polished
Monocrystalline Silicon Wafers (Notched)
SEMI M31 — Provisional Mechanical Specification for
Front-Opening Shipping Box Used to Transport and
Ship 300 mm Wafers
SEMI S8 — Safety Guidelines for Ergonomics
Engineering of Semiconductor Manufacturing
Equipment
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that
bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI
E57).
4.1.2 box — a protective portable container for a
carrier and/or substrate(s).
4.1.3 carrier — an open structure that holds one or
more substrates.
4.1.4 carrier bottom domain — volume (below z6
above the horizontal datum plane) that contains the
bottom of the carrier (as defined in SEMI E1.9).
4.1.5 carrier capacity — the number of substrates that
a carrier holds (as defined in SEMI E1.9).
4.1.6 carrier sensing pads — surfaces on the bottom of
the carrier for triggering optical or mechanical sensors
(as defined in SEMI E1.9).
4.1.7 carrier side domains — volumes (from z6 above
the horizontal datum plane to z15 above the top
nominal wafer seating plane) that contain the mizo teeth
or slots that support the wafer and the supporting
columns on the sides and rear of the carrier (as defined
in SEMI E1.9).
4.1.8 carrier top domain — volume (higher than z15
above the top wafer) that contains the top of the carrier
(as defined in SEMI E1.9).
4.1.9 facial datum plane — a vertical plane that bisects
the wafers and that is parallel to the front side of the
carrier (where wafers are removed or inserted). On tool
load ports, it is also parallel to the load face plane
specified in SEMI E15 on the side of the tool where the
carrier is loaded and unloaded (as defined in SEMI
E57).
4.1.10 front-opening box for interfactory transport
(FOBIT) — a transportation box with a front-opening
interface (that mates with a FIMS port that complies
with SEMI E62).
4.1.11 front-opening shipping box (FOSB) — a
shipping box (that complies with SEMI M31) with a
front-opening interface.
4.1.12
front-opening unified pod (FOUP) — a box
(that complies with SEMI E47.1) with a non-removable
cassette (so that its interior complies with SEMI E1.9)
and with a front-opening interface (that mates with a
FIMS port that complies with SEMI E62).
4.1.13 horizontal datum plane — a horizontal plane
from which projects the kinematic-coupling pins on
which the carrier sits. On tool load ports, it is at the load
height specified in SEMI E15 and might not be
physically realized as a surface (as defined in SEMI
E57).
4.1.14 minienvironment — a localized environment
created by an enclosure to isolate the product from
contamination and people.
4.1.15 nominal wafer centerline — the line that is
defined by the intersection of the two vertical datum
planes (facial and bilateral) and that passes through the
nominal centers of the seated wafers (which must be
horizontal when the carrier is placed on the coupling)
(as defined in SEMI E57).
4.1.16 optical wafer sensing paths — lines of sight for
optically sensing the positions of the wafers. Several
horizontal optical wafer sensing paths are present in
between the carrier side domains. In addition, two
vertical optical wafer sensing paths are created by
rectangular exclusion zones in the front of the carrier
top and bottom (as defined in SEMI E1.9).
4.1.17 shipping box — a protective portable container
for a carrier and/or wafer(s) that is used to ship wafers
from the wafer suppliers to their customers.
4.1.18 virtual tracking unit — an entity (which could
be a number of substrates or an individual die or mask
group) that the factory floor control system treats as a
single unit for tracking purposes (as defined in SEMI
E1.9).
4.1.19 wafer carrier — any cassette, box, pod, or boat
that contains wafers (as defined in SEMI E15).
4.1.20 wafer extraction volume — the open space for
extracting a wafer from the carrier (as defined in SEMI
E1.9).
4.1.21 wafer pick-up volume — the space that contains
entire bottom of a wafer if the wafer has been pushed to
the rear of the carrier (as defined in SEMI E1.9).
4.1.22 wafer set-down volume — the open space for
inserting and setting down a wafer in the carrier (as
defined in SEMI E1.9).
SEMI E119-1104 © SEMI 2002, 2004 3
5 Requirements
The FOBIT has the following components and sub-
components:
Key:
Required feature
Optional feature
Door on front
Holes for latch keys that lock the door to the
FIMS interface when the door is unlatched
from the box
Holes for registration pins
Door presence sensing areas
Top
Top robotic handling flange (optional)
Interior
Non-removable cassette with supports for 25
wafers
Wafer capture mechanism
2 end-effector exclusion zones
Sides
Ergonomic manual handles (optional)
Bottom
5 carrier sensing pads
Center retaining feature
Front retaining feature
4 info pads
2 advancing box sensing pads
3 features that mate with kinematic coupling
pins and provide a 10 mm lead-in
3 features that mate with kinematic coupling
pins and provide a 15 mm lead-in (optional)
2 bottom side rails for use with roller conveyor
or forklifts (optional)
5.1 Kinematic Couplings — The physical alignment
mechanism from the FOBIT to the tool load-port (or a
nest on a vehicle or in a stocker) consists of features
(not specified in this standard) on the top entity that
mate with three or six pins underneath as defined in
SEMI E57. The three features that mate with the
kinematic coupling pins must provide a lead-in
capability that corrects a FOBIT misalignment of up to
r69 in any horizontal direction.
5.2 Inner and Outer Radii — All required concave
features may have a radius of up to r65 to allow
cleaning and to prevent contaminant build-up. All
required convex features may also have a radius of up
to r66 to prevent small contact patches with large
stresses that might cause wear and particles. Note that
these limits on the radius of all required features are
specified as a maximum (not a minimum) to ensure that
the required features are not rounded off too much. The
lower bound on the radius is up to the FOBIT supplier.
Note also that this radius applies to every required
feature unless another radius is called out specifically.
A required feature is an area on the surface of the
FOBIT specified by a dimension (or intersections of
dimensions) that has a tolerance and not just a
maximum or minimum (such as the edges of the robotic
handling flange).
5.3 Door
— It is recommended that the FOBIT be in a
horizontal orientation when it is opened or closed
(corresponding to the front side of the cassette where
wafers are accessed so the door is perpendicular to the
wafers and parallel to the facial datum plane). The door
and its frame must be designed to mate with a port that
conforms to SEMI E62. Specifically, the FOBIT door
and its frame must have surfaces that mate with the seal
zones and the reserved spaces for vacuum application
(which includes all of the circles bounded by r38 except
for the holes for the registration pins at the center of
each circle) defined in Sections 5.3 and 5.6 of SEMI
E62 (which specifies r38). These FOBIT door and
frame surfaces must be a distance of y52 from the facial
datum plane and must have a flatness of y42. No
surface on the FOBIT door may project further from the
facial datum plan than the door seal zone and the
reserved spaces for vacuum application. The door of the
FOBIT must also be designed so that when the FOBIT
is pressed against the FIMS port, both latch keys on the
port are inserted to their full length. Furthermore, when
the latch keys are turned more than 45 toward the
position that unlocks the FOBIT door, the latch key
holes on the door must be such that the door is not
removable from the latch keys.
5.4 Wafer Capture and Centering — When the FOBIT
is closed, the wafers must be captured in the FOBIT to
prevent movement during subsequent handling,
including transportation. It should be noted that wafers
are typically transported in a vertical orientation and
generally require support from a secondary package. It
is recommended that this secondary package be
designed to allow for easy removal of the FOBIT from
the secondary package.