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SEMI E1.9-0701 E2 © SEMI 1994, 2004 14 Table 1 Cassette Dime nsions Symbol Used Figure Number Value Specified Datum Measured from Boundary or Feature Measured to ω 13 0° minimum 2° maximum horizontal datum plane fork-lif…

SEMI E1.9-0701

x25 ≥30

y16

=155 ±1

y24

≤136

cassette

identification

tag area

front side of the cassette where wafers are accessed

facial

datum

plane

bilateral datum plane

y22

=145

Figure 16

Optional Bottom Cassette Identification Tag Area

6.9 Pitch and Capacity — Table 2 shows the different

options with regard to the wafer pitch (spacing) and the

cassette capacity. Again, no tolerance is given on the

wafer pitch (z12), for reasons given in Section 6.7.

6.10 Inner and Outer Radii — All concave features

may have a radius no greater than r15 to allow cleaning

and to prevent contaminant build-up. All required

convex features must also have a radius of r16 to

prevent small contact patches with large stresses that

might cause wear and particles. Here a required feature

is an area on the surface of the carrier specified by a

dimension (or intersections of dimensions) that has a

tolerance and not just a maximum or minimum (such as

the rim of the fork-lift pin hole, the edges of the robotic

handling flanges, and the corners at the rear of the

cassette top and bottom domains).

6.11 Vertical Wafer Access — This standard does not

cover accessing wafers in a vertical orientation.

7 Related Documents

7.1 SEMI Standards

SEMI E22.1 — Cluster Tool Module Interface

300 mm: Transport Module End Effector Exclusion

Volume Standard

SEMI E47.1 — Provisional Mechanical Specification

for Boxes and Pods Used to Transport and Store 300

mm Wafers

SEMI E62 — Provisional Specification for 300 mm

Front-Opening Interface Mechanical Standard (FIMS)

SEMI E63 — Provisional Mechanical Specification for

300 mm Box Opener/Loader to Tool Standard

(BOLTS-M) Interface

SEMI E103 — Provisional Mechanical Specification

for a 300 mm Single-Wafer Box System that Emulates

a FOUP

SEMI M28 — Specification for Developmental 300

mm Diameter Polished Single Crystal Silicon Wafers

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI E1.9-0701

Table 1 Cassette Dimensions

Symbol

Used

Figure

Number

Value Specified Datum Measured from Boundary or Feature Measured to

13 0° minimum

2° maximum

horizontal datum plane fork-lift area

r1† 1 151 mm (5.94 in.)

maximum

nominal wafer center line outer edge of wafer pick-up volume

r2† 1, 10 152 + 1 – 0 mm

(5.99 + 0.03 – 0 in.)

y1 in front of nominal

wafer center line

encroachment of cassette side domains on

wafer set-down volume

r3† 1, 10 r2 + 1 mm (0.04 in.)

minimum

y1 in front of nominal

wafer center line

encroachment of cassette side domains on

wafer extraction volume

r4† 1 170 mm (6.69 in.)

minimum

nominal wafer center line encroachment of tools or front-opening box

on end effector exclusion zone between

front and rear cassette side domains

r5 1, 2, 4 170 mm (6.69 in.)

maximum

nominal wafer center line outside of cassette domains

r6 2, 4, 6 157 mm (6.18 in.)

maximum

nominal wafer center line front of cassette top and bottom domains

r7 4, 8, 9 15 mm (0.59 in.)

minimum

nominal wafer center line encroachment of cassette bottom domain on

pod latch-pin hole

r8 4, 8, 12 7.5 ± 1 mm

(0.30 ± 0.04 in.)

vertical line contained in

facial datum plane and

x11 from bilateral datum

plane

sides of fork-lift pin hole

r9 1, 8, 12 2.5 ± 0.5 mm

(0.10 ± 0.02 in.)

horizontal line contained

in facial datum plane and

z19 above horizontal

datum plane

surface of optical cassette sensing hole

r10 4 166 ± 1 mm

(6.54 ± 0.04 in.)

nominal wafer center line cassette bottom outside of x15 and below

z22

r11‡ 2, 10 166 ± 1 mm

(6.54 ± 0.04 in.)

nominal wafer center line outside of top robotic flange

r12 2 152 mm (5.98 in.)

maximum

nominal wafer center line rear of the cassette top domain above the

area between the cassette side domains

r13* 5 2.5 mm (0.10 in.)

minimum

line segment along center

of cassette sensing pad

edge of cassette sensing pad

r14* 5 7.5 mm (0.30 in.)

minimum

intersection of x21 and

y10

edge of info pads A and B

r15 None 1 mm (0.04 in.)

maximum

not applicable all concave features (radius)

r16 None 2 ± 1 mm

(0.08 ± 0.04 in.)

not applicable all required convex features (radius)

r17* 5 10 mm (0.39 in.)

minimum

intersection of x22 and

edge of info pads C and D

r19 None 10 mm (0.4 in.)

minimum (required)

15 mm (0.6 in.)

(recommended for

ergonomic reasons)

not applicable correctable cassette misalignment in any

horizontal direction

x1† 1, 2, 9 50 mm (1.97 in.)

minimum

bilateral datum plane inside of rear cassette side domains and the

part of the cassette top domain above them

x2† 1, 9 75 mm (2.95 in.)

maximum

bilateral datum plane outside of rear cassette side domains

SEMI E1.9-0701

Symbol

Used

Figure

Number

Value Specified Datum Measured from Boundary or Feature Measured to

x3† 1, 10, 12 125 mm (4.92 in.)

minimum

bilateral datum plane inside of front cassette side domains

x4‡ 1, 10, 12 8 mm (0.31 in.)

minimum

farthest protrusion of

cassette from bilateral

datum plane

encroachment of cassette side domain on

side grip pits

x5 2, 4 76 ± 1 mm

(2.99 ± 0.04 in.)

bilateral datum plane outside of cassette top and bottom domains

above and below rear cassette side domains

x6 2, 4, 9 112.5 mm (4.43 in.)

maximum

bilateral datum plane encroachment of cassette top and bottom

domains on near side of vertical optical

wafer sensing paths

x7‡ 2, 10 12 mm (0.47 in.)

minimum

farthest protrusion of

cassette from bilateral

datum plane

encroachment of cassette top domain on

space underneath robotic handling flanges

x8* 5 12.5 mm (0.49 in.) bilateral datum plane end of line segment along center of center

cassette sensing pad

x9 1, 2, 4, 10,

167 mm (6.57 in.)

maximum

bilateral datum plane left and right side of cassette

x10‡ 1, 10, 12 166 ± 1 mm

(6.54 ± 0.04 in.)

bilateral datum plane rim of opening of side grip pits

x11 4, 12 166 mm (6.54 in.) bilateral datum plane origin of radius of fork-lift pin hole

x12 4, 9 125 mm (4.92 in.)

minimum

bilateral datum plane encroachment of cassette bottom domain on

far side of vertical optical wafer sensing

paths

x13* 5 88.5 mm (3.48 in.) bilateral datum plane near end of line segment along center of

front cassette sensing pads

x14* 5 118.5 mm (4.67 in.) bilateral datum plane far end of line segment along center of front

cassette sensing pads

x15 4, 12 132 mm (5.2 in.)

maximum

bilateral datum plane intersection of cassette bottom domain and

conveyor rail

x16 4, 12 140 ± 1 mm

(5.51 ± 0.04 in.)

(required)

140 ± 0.25 mm

(5.512 ± 0.010 in.)

(recommended for

roller conveyors)

bilateral datum plane end of conveyor rail and encroachment of

cassette bottom domain on fork-lift area

x17* 5 17.5 mm (0.69 in.) bilateral datum plane line segment along center of rear cassette

sensing pads

x21* 5 30 mm (1.18 in.) bilateral datum plane origin of radius r14 at center of info pads A

and B

x22* 5 70 mm (2.76 in.) bilateral datum plane origin of radius r17 at center of info pads C

and D

x25‡ 14, 16 30 mm (1.18 in.)

minimum

bilateral datum plane far end of top and bottom cassette

identification tag areas

x27 None ± 1 mm (± 0.04 in.)

flatness over tag area

bilateral datum plane surface of side cassette identification tag

area

y1† 1 3 mm (0.12 in.)

maximum

facial datum plane origin of r2 and r3 on bilateral datum plane

y2‡ 1, 7, 8 10 ± 1 mm

(0.39 ± 0.04 in.)

facial datum plane front wall of side grip pits

y3‡ 1, 7, 8 10 ± 1 mm

(0.39 ± 0.04 in.)

facial datum plane rear wall of side grip pits