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SEMI 30.1-0200 © SEMI 1998, 2000 3 SEMI E30.1-0200 INSPECTION A ND REVIEW SPECIFIC EQUIPMENT MODEL (ISEM) This standard w as technic ally a pproved by the G lobal Information a nd Control Com mittee a nd is the direct re…

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SEMI 30.1-0200 © SEMI 1998, 2000 2
14 Scenarios
14.1 Run Level Reporting Scenario
14.2 PP-UPDATE Remote Command Scenario
14.3 PP-SELECT Remote Command Scenario
14.4 Event Report and ISEM Table Transfer Command
Scenario
15 GEM Capabilities
15.1 Requirements
Related Information 1
R1-1 Defect Classification Code Management
R1-1.1 Classification Codes and Defect Classification
R1-1.2 Requirements
R1-2 Reporting Coordinates and Coordinate Systems
R1-2.1 Site Location Accuracy
R1-2.2 Expected or Designed Locations vs. Actual
Locations
R1-2.3 Substrate Coordinate Systems (Unpatterned)
R1-2.4 Substrate Pattern Coordinate System
R1-2.5 Pattern Element Coordinate System
R1-2.6 Parallel Coordinate Systems
R1-2.7 Requirements
R1-3 Coordinate System for a Substrate
R1-3.1 SEMI M20 Coordinate System
R1-3.2 M20P Coordinate System
R1-3.3 Establishing an M20P Coordinate System
R1-4 Layout of Rectangular Pattern Elements on a
Substrate using SEMI M20 Coordinate System
R1-4.1 ISEM “M21” Layouts
R1-5 How an M20P Coordinate System is Established
on a Substrate
Related Information 2 — Application Notes
R2-1 Using ISEM Table Attributes to Specify Process
Related Data Item Variable Values
SEMI 30.1-0200 © SEMI 1998, 20003
SEMI E30.1-0200
INSPECTION AND REVIEW SPECIFIC EQUIPMENT MODEL (ISEM)
This standard was technically approved by the Global Information and Control Committee and is the direct
responsibility of the North American Information and Control Committee. Current edition approved by the
North American Regional Standards Committee on September 3, 1999. Initially available at www.semi.org
November 1999; to be published February 2000. Originally published June 1998.
1 Purpose
1.1 This standard establishes a Specific Equipment
Model (SEM) for Inspection and Review Equipment
(ISEM). The model consists of equipment
characteristics and behavior that are to be implemented
in addition to the SEMI E30 fundamental requirements
and additional capabilities. The intent of this standard is
to facilitate the integration of ISEM equipment into an
automated (semiconductor fabrication) factory. This
document accomplishes this by defining an operational
model for ISEM equipment as viewed by a factory
automation controller. This definition provides a
standard host interface and equipment operational
behavior (e.g., control, state models, data reports, and
reporting levels). Several topics require additional
activity that are within the scope of this standard:
substrate pattern maps; defect classification code
management; and review data management.
2 Scope
2.1 The scope of this standard is li mited to the
definition of Inspection, Review, and Inspection/
Review equipment behavior as perceived by a SEMI
Equipment Communications Standard II (SEMI
E5/SECS-II) host that complies with SEMI E30. It
defines the external view of the equipment through the
SECS link; it does not define the internal operation of
the equipment. This standard expands the SEMI E30
requirements and capabilities in the areas of the
processing state model, remote commands, variable
items, alarms, and data collection.
2.2 This standard is intended for ISEM equipment that
generates data and information about anomalies and
defects found on substrates. Inspection equipment finds
anomalies. Anomalies are occurrences on a substrate
that have been judged to be unexpected, abnormal,
incongruous, or inconsistent. Anomalies may be
examined using review equipment, at which time they
may be classified as defects or non-defects. Some
inspection equipment may generate, and some review
equipment may use, coordinate data to locate anomalies
on a substrate. The accuracy of the coordinate data
generated or used is equipment-dependent.
2.3 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This document addresses three distinct types of
equipment: inspection, review, and inspection/review.
The term ISEM equipment refers to all three types of
equipment. These three equipment types are
differentiated by the basic functions they perform:
3.1.1 Inspection Equipment that looks for anomalies
on a substrate and reports information regarding those
anomalies. Inspection equipment may determine the
location of anomalies relative to a coordinate system.
Inspection equipment may also provide other types of
data related to the anomaly.
3.1.2 Review Equipment that accepts information
about anomalies on a substrate, gathers information on
those anomalies, and reports that data.
3.1.3 Inspection/Review Equipment having the
characteristics of both inspection and review
equipment.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E30 — Generic Model for Communications and
Control of SEMI Equipment (GEM)
SEMI E37 — High-Speed SECS Message Services
(HSMS) Generic Services
SEMI E37.1 — High-Speed SECS Message Services
Single-Session Mode (HSMS-SS)
SEMI E58 — Automated Reliability, Availability, and
Maintainability Standard (ARAMS): Concepts,
Behavior, and Services
SEMI M20 — Specification for Establishing a Wafer
Coordinate System
SEMI M21 — Specification for Assigning Addresses to
Rectangular Elements in a Cartesian Array
SEMI 30.1-0200 © SEMI 1998, 2000 4
4.2 Other References
Harel, D., “Statecharts: A Visual Formalism for
Complex Systems,” Science of Computer Programming
8, (1987), 231-274
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
5 Terminology
5.1 Abbreviations and Acronyms
5.1.1 GEM — generic equipment model
5.1.2 PE — pattern element
5.1.3 TCP/IP — Transmission Communication
Protocol/Internet Protocol
5.2 Definitions
5.2.1 align — to put into proper relative position or
orientation.
5.2.2 alignment — a procedure in which a coordinate
system is established on a substrate.
5.2.3 alignment mark — a feature on the substrate
selectively used for alignment.
5.2.4 anomaly — an occurrence on a substrate that has
been judged to be unexpected. Something abnormal,
incongruous, or inconsistent.
NOTE 2: After an anomaly is reviewed, it may be classified
as a defect.
5.2.5 batch — a group of substrates or lots intended
for a process sequence versus single substrate
processing.
5.2.6 carrier — a container with one or more fixed
positions at which material can be held.
5.2.7 carrier location — a physical place within the
equipment capable of holding a carrier.
5.2.8 cassette — a container with one or more
substrate locations (see slot).
5.2.9 defect — 1) A physical, optical, chemical, or
structural irregularity that degrades the ideal substrate
structure or the thin films built over the substrate. 2) An
undesirable classified anomaly.
5.2.10 defect classification — the categorization of
defects according to some systematic division based on
their physical, optical, chemical, or structural
properties.
5.2.11 die — 1) A field sub-unit. 2) An area of
substrate that contains the device being manufactured.
5.2.12 ended — the end of a state that may be when it
is normally completed, or its early end due to an
allowed or atypical condition (e.g., a STOP command,
or an error or alarm condition).
5.2.13 factory automation controller — a computer
system that provides integration of factory shop control
and business systems with semiconductor equipment.
5.2.14 feature — 1) A line or a point (as a feature
within a pattern). 2) A physical characteristic of the
substrate (e.g., a substrate flat).
5.2.15 field — the printed pattern from a reticle.
5.2.16 field of view — the imaging area as seen at
magnification of the inspection or review equipment.
5.2.17 global alignment — a procedure which
establishes a coordinate system for the entire substrate
(see alignment).
5.2.18 group — a logical collection of regions.
5.2.19 group alignment — a procedure which
establishes a coordinate system for an area, which is a
contiguous group (see alignment).
5.2.20 inspect — to detect anomalies and/or
information about anomalies.
5.2.21 inspection — an examination to detect
anomalies.
5.2.22 inspection equipment — equipment that looks
for anomalies on a substrate and reports information
regarding those anomalies. Inspection equipment may
determine the location of anomalies relative to a
coordinate system. Inspection equipment may also
provide other types of data related to the anomaly.
5.2.23 inspection/review equipment — equipment
having the characteristics of both inspection and review
equipment.
5.2.24 ISEM job — the information required to specify
an inspection or review that may include material
identification and location and process program
identifications as well as any other parameters required
to obtain a desired result.
5.2.25 layer — one of a sequential series of overlaying
photomasks that make up a device series.
5.2.26 lot — a group of one or more substrates of the
same type (e.g., wafers, masks, CDs).
5.2.27 major flat — the flat of longest length that is
commonly located with respect to a specific crystal
plane (ASTM F 1241-89).
5.2.28 mask — a selective barrier to the passage of
radiation. For example, a transparent plate containing
an opaque pattern that is used to transfer that pattern to
another substrate.