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SEMI E112-0305 © SEMI 2001, 2005 16 RELATED INFORMATION 1 NOTICE : This related information is not an official part of SEMI E112, and it is not intended to modify or supercede the official standard. This inf o rmation wa…

SEMI E112-0305 © SEMI 2001, 2005 15

APPENDIX 1

APPLICATION NOTES

NOTICE: This appendix is an official part of SEMI E112 and was approved by full letter ballot procedures on

August 27, 2001, but the recommendations in this appendix are optional and are not required to conform to this

standard.

A1-1 Edge contact only with the photomask is preferred when handling, transporting or storing.

A1-2 Skewness, warp, rock, and stiffness are implicitly defined in the dimensional tolerances.

A1-3 Features on the MRSP150 which enable stacking may be required by end users. It is preferred that these

features allow stacking in only one orientation.

A1-4 Features on the MRSP150 which provide visual orientation of the MRSP150 top and MRSP150 door may be

required by end users.

SEMI E112-0305 © SEMI 2001, 2005 16

RELATED INFORMATION 1

NOTICE: This related information is not an official part of SEMI E112, and it is not intended to modify or

supercede the official standard. This information was inserted by the North America Physical Interfaces and

Carriers Committee to alert the readers to potential changes to this provisional standard.

R1-1 In the event end-effector and pellicle exclusion volumes can be developed which would satisfy all

lithography equipment manufacturers and allow for a 126 mm pellicle, then the appropriate changes would be

balloted to update the standard.

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant

literature, respecting any materials or equipment mentioned herein. These standards are subject to change without

notice.

By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI E113-1104

SPECIFICATION FOR SEMICONDUCTOR PROCESSING EQUIPMENT

RF POWER DELIVERY SYSTEMS

This specification was technically approved by the Global Metrics Committee and is the direct responsibility

of the North American Metrics Committee. Current edition approved by the North American Regional

Standards Committee on July 11, 2004. Initially available at www.semi.org September 2004; to be published

November 2004. Originally published November 2001; previously published November 2003.

1 Purpose

1.1 Process plasmas are used throughout the

semiconductor industry for the etching and deposition

of thin films. The majority of the process chambers use

RF power to produce and sustain the plasmas. Because

the reliability and repeatability of the plasma directly

impacts wafer-processing results, RF power delivery

systems are a key element of semiconductor

manufacturing technology. The accurate and

reproducible performance of the entire RF power

generation system, including the RF influenced

parameters of the plasma, must be within commonly

accepted tolerances.

1.2 Design criteria for RF reliability and repeatability

demand standardized testing and evaluation of the

performance of the RF power delivery systems and

control instrumentation on a chamber. Not only must

the subsystems (i.e., the generator, cable assemblies,

matching network, chuck/coil) be characterized, but the

performance of the integrated system must also be

characterized over the intended operating range.

1.3 It is the intent of this standard to provide RF power

delivery specifications for semiconductor processing

equipment that leads to improved system and

subsystem performance. It outlines performance

criteria as well as required documentation that must be

supplied with the system or subsystem components.

The goal of the document is to provide the

specifications needed to produce a well-characterized

RF power delivery system, where stability,

repeatability, and important electrical parameters such

as delivered power, current/voltage, and the impedance

of the system can be determined within the operating

space.

2 Scope

2.1 This document specifies the minimum performance

criteria for RF equipment used in the semiconductor

industry. It does not address specific test methods or

procedures for performance verification.

2.2 The primary focus for this specification is

semiconductor processing equipment including, but not

limited to, the following tool types:

 Dry etch equipment, and

 Film deposition equipment (CVD and PVD).

2.3 This specification applies to semiconductor

processing equipment RF power delivery systems

whose power is directly used to produce and sustain the

plasma.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Limitations

3.1 This standard is meant to address RF systems that

primarily operate in the frequency range of 0.2–100

MHz. It does not address higher frequency RF systems

or microwave systems.

3.2 This standard is not meant to address pulsed-

power RF systems.

3.3 This standard is intended to be a performance

specification and is not intended to address design

issues related to safety, which are covered elsewhere in

the SEMI Standards.

3.4 This standard does not address any safety or

performance issues related to RF emissions or electrical

codes (e.g., Underwriter’s Laboratory, Inc. (UL), the

National Electrical Code (NEC), Federal

Communications Commission (FCC)). It is the

responsibility of the users of this standard to conform to

the appropriate local codes and regulations as applied to

this type of equipment, some of which are covered by

referenced documents.