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SEMI G36-88 © SEMI 198 6, 1988 3 Figure 1 Top to Bot to m Cavity Mism atch Figure 2 Cavity to Fram e Offset Figure 3 Package Warp age

SEMI G36-88 © SEMI 1986, 1988 2

8. Molding press to be used.

9. Electrical power available for heating.

10. Applicable leadframe drawing, including all

dimensions.

5 Dimensions

5.1 Drawing must show dimensions for the following

items, if applicable:

1. Package length

2. Package width

3. Top cavity thickness

4. Bottom cavity thickness

5. Frame thickness

6. Top ejector pin locations from datum lines

7. Bottom ejector pin locations from datum lines

8. Ejector pin sizes (top and bottom)

9. Ejector depth (top and bottom, draft angle top and

bottom side)

10.Pin 1 ID location from package center

11.Pin 1 ID shape and size

12.All applicable package radii

13.Draft angles (top and bottom)

14. Package parting line location

15.Shoulder bend location

6 Product Criteria

6.1 Dimensional tolerance limits for high density TAB

products (see Section 3).

6.1.1 Recognizing that every manufacturing process is

subject to variation, the following list details the

acceptable limit of this variation:

28-328 LEAD

OVERLAP/OFFSET

Cavity Overlap (See Figure 1) 0.002" (maximum)

Cavity Mismatch (See Figure 1 0.002" (maximum)

CAVITY TO FRAME OFFSET

(See Figure 2)

(not including leadframe tolerances)

0.002" (maximum)

PACKAGE WARPAGE

Warp factor (See Figure 3) 2.5 to a max. of

0.003"

PROTRUSIONS & INTRUSIONS

(See Figure 4) Parting line 0.005" (maximum)

Gating 0.005" (maximum)

Top or bottom ejector pin 0.002" (maximum)

VARIATIONS IN LEAD POSITION

(See Figure 4) 0.003" (maximum)

LEAD COPLANARITY

(See Figure 6) 0.002" (maximum)

DAMBAR TRIMMING

INTRUSIONS/PROTRUSIONS

Intrustions (See Figure 6) 0.002" (maximum)

Protrusions (See Figure 4) (shall not

decrease gap more than 20%)

0.003" (maximum)

7 Packaging

Tooling must be packed in containers designed and

constructed to prevent damage and/or contamination.

SEMI G36-88 © SEMI 1986, 19883

Figure 1

Top to Bottom Cavity Mismatch

Figure 2

Cavity to Frame Offset

Figure 3

Package Warpage

Figure 4

Parting Line Protrusion/Intrusion and Variation in Lead Location

Figure 5

Lead Position Overlay Example

NOTICE: These standards do not purport to address safety issues, if any, associated with their use. It is the

responsibility of the user of these standards to establish appropriate safety and health practices and determine the

applicability of regulatory limitations prior to use. SEMI makes no warranties or representations as to the suitability

of the standards set forth herein for any particular application. The determination of the suitability of the standard is

solely the responsibility of the user. Users are cautioned to refer to manufacturer’s instructions, product labels,

product data sheets, and other relevant literature respecting any materials mentioned herein. These standards are

subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted

material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this

standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and

the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.