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SEMI G73-0997 (Reapproved 1104) TEST METHOD FOR PULL ST RENGTH FOR WIRE BONDING This test method was technicall y approved by the Global Assembly & Packaging Committee and is the direct responsibility of the Japanese…

SEMI G72.2-0997 © SEMI 1997 12

*5. Thermal enhancement of 6 x 6 solder balls.

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SEMI G73-0997 (Reapproved 1104)

TEST METHOD FOR PULL STRENGTH FOR WIRE BONDING

This test method was technically approved by the Global Assembly & Packaging Committee and is the direct

responsibility of the Japanese Packaging Committee. Current edition approved by the Japanese Regional

Standards Committee on July 23, 2004. Initially available at www.semi.org September 2004; to be published

November 2004. Originally published in 1997.

1 Purpose

1.1 This standard defines the pull strength test method

for wire bonding.

2 Scope

2.1 This standard defines the destructive pull strength

test method and its criterion for evaluating pull strength

of wire bonds connecting two points, connected by

using ball bonding technique.

2.2 This standard can be applied to measure wires

whose diameter is less than 100 microns.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 Military Standard

MIL-STD-883D — Test Methods and Procedures for

Microelectronics

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 hook — L or similar-shaped tool for hooking a

wire for pull test.

5 Apparatus

5.1 Pull Tester or equivalent equipment

5.1.1 Enough stroke to break a wire.

5.1.2 Accuracy — Within ± 0.5% to the full scale of

load cell.

5.1.3 Pull Speed — Constant speed.

5.1.4 Hooks — Between 25–100 microns in diameter.

1 United States Military Standards, Available through the Naval

Publications and Forms Center, 5801 Tabor Avenue, Philadelphia,

PA 19120-5099, USA. Telephone: 215.697.3321

NOTE 1: Hook must be made of material strong enough to

break wire while testing but not with a small diameter so as to

cut through the wire.

Figure 1

Hook Diameter

5.1.5 Calibration of equipment must be simple enough

so that users can calibrate it easily. Instructions for

calibration should be described in equipment manual.

6 Sampling

6.1 Measure at least 30 points from at least 2 devices.

From each side of the devices, select the same number

of wires randomly.

7 Calibration and Standardization

7.1 Calibration Method

7.1.1 Calibration of equipment should be done using

official and traceable weights.

7.1.2 Display the weight and verify whether the results

are within the equipment’s accuracy.

7.1.3 Repeat the measurement using other weights to

verify repeatability and linearity of the calibration.

7.2 Interval of Calibration

7.2.1 Calibrate at regular intervals at least once a year.

7.2.2 Calibration must be able to be done just before

testing when necessary or specifically instructed.

1 SEMI G73-0997 © SEMI 1997, 2004

8 Procedure

8.1 Fix samples using a clamper or adhesive, so that

the sample will not float, without applying excessive

stress to the wire.

8.2 Set pull speed to 0.5 mm/sec while measuring.

8.3 Insert the hook under the bonded wire between the

top of the first bonding and the center of the loop.

NOTE 2: Select hook position accordingly to package,

wiring condition, and wire diameter.

NOTE 3: Place the hook perpendicular to wiring direction if

there is no specific instruction.

NOTE 4: Do not measure damaged or deformed wire.

8.4 Pull the hook perpendicular to die/substrate.

8.5 Record the force that breaks the wire as the pull

strength.

8.6 Repeat the measurement on another wire.

NOTE 5: Do not change the position while testing the same

samples.

Figure 2

Hook Position

9 Report

9.1 Report of the pull test must contain the following

information.

9.2 Pull Strength

9.3 Breaking Mode — Choose the closest position

from Figure 3 below and represent the broken position

by number or alphabet in the figure.

9.3.1 Breaking Mode (Report in number or alphabet)

 1,A: The first bond

 2,B: The first bond neck

 3,C: Loop

 4,D: The second bond neck

 5,E: The second bond

Figure 3

Breaking Mode

9.4 Hook Position

9.5 Rejection — Criterion of each semiconductor

manufacturer to each product. Refer to “Minimum

Strength” of the attached MIL-STD-883D.

10 Related Documents

10.1 SEAJ Document

SEAJ Technical Term Dictionary, 3rd Edition

10.2 JEITA Standard

JEITA ED4703 — In-Line Evaluation Methods and

Structural Analysis Methods for Semiconductor

Devices

10.3 IEC Standard

IEC 749 — Semiconductor Devices: Mechanical and

Climatic Test Methods

2 Semiconductor Equipment Association of Japan, 4F Grand Maison

Shinjuku Gyoen., 1-7-10 Shinjuku Shinjuku-ku, Tokyo 160-0022

Japan, 03(3353)7651 Fax 03(3353)7970,

http://www.seaj.or.jp/english/index.htm.

3 Electronic Industries Association of Japan, Available through:

Japan Electronics and Information Technology Industries

Association, 3rd Fl., Mitsui Sumitomo Kaijo Bldg. Annex 11, Kanda

Surugadai 3-chome, Chiyoda-ku, Tokyo 101-0062, Japan,

http://www.jeita.or.jp/eiaj/english/

4 International Electrotechnical Commission, 3 rue de Varembe, CH-

1211, Geneva 20, Switzerland, Phone: 41 22 919 02 11, Fax: 41 22

919 03 00, E-mail: IEC Central Office, http://www.iec.ch/